公开(公告)号：US20210135068A1

公开(公告)日：2021-05-06

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US11462500B2

公开(公告)日：2022-10-04

申请号：US16962175

申请日：2019-01-23

Applicant: OSRAM OLED GmbH

Inventor： Matthias Hien ,  Matthias Goldbach ,  Michael Zitzlsperger ,  Ludwig Peyker

IPC: H01L23/00 ,  H01L25/04 ,  H01L25/075 ,  H01L25/16 ,  H01L31/02 ,  H01L33/62 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/60

Abstract: In one embodiment, an optoelectronic semiconductor device includes at least two lead frame parts and an optoelectronic semiconductor chip which is mounted in a mounting region on one of the lead frame parts. The lead frame parts are mechanically connected to one another via a casting body. The semiconductor chip is embedded in the cast body. In the mounting region the respective lead frame part has a reduced thickness. An electrical line is led over the cast body from the semiconductor chip to a connection region of the other of the lead frame parts. In the connection region, the respective lead frame part has the full thickness. From the connection region to the semiconductor chip the electrical line does not overcome any significant difference in height.

公开(公告)号：US11038090B2

公开(公告)日：2021-06-15

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.