公开(公告)号：US20200075818A1

公开(公告)日：2020-03-05

申请号：US16491146

申请日：2018-03-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/50

Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

公开(公告)号：US20160254424A1

公开(公告)日：2016-09-01

申请号：US15054585

申请日：2016-02-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Lermer ,  Roland Fischl

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/44 ,  H01L33/08 ,  H01L33/60

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/24245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A method of producing an optoelectronic lighting device includes providing a carrier on which is arranged at least one light-emitting diode including a surface that emits light during operation of the light-emitting diode, carrying out an injection molding process to encapsulate the light-emitting diode by molding as far as the light-emitting surface such that a molded housing is formed within which the light-emitting diode is encapsulated by molding, wherein the light-emitting surface remains at least partly free, shaping a reflector that reflects light emitted by the light-emitting surface during the injection molding process such that the reflector is formed integrally with the housing, at least partly masking the light-emitting surface, coating the reflector with a light-reflecting layer after the masking, and demasking the light-emitting surface after the coating.

Abstract translation: 一种光电子照明装置的制造方法，其特征在于，在所述载体上配置有至少一个发光二极管，所述至少一个发光二极管包括在所述发光二极管的操作期间发光的表面，进行注射成型工艺以封装所述发光二极管 二极管，通过模制到发光表面，使得形成模制外壳，其中通过模制封装发光二极管，其中发光表面保持至少部分自由，成形反射由 在注射成型过程中的发光表面使得反射器与壳体一体地形成，至少部分地遮蔽发光表面，在掩模之后用光反射层涂覆反射器，并且去除发光 表面涂层后。

公开(公告)号：US10950765B2

公开(公告)日：2021-03-16

申请号：US16491146

申请日：2018-03-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/00

Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.