公开(公告)号：US20160111357A1

公开(公告)日：2016-04-21

申请号：US14982155

申请日：2015-12-29

Applicant: Renesas Electronics Corporation

Inventor： Shinichi UCHIDA ,  Kenji NISHIKAWA ,  Masato KANNO ,  Mika YONEZAWA ,  Shunichi KAERIYAMA ,  Toshinori KIYOHARA

IPC: H01L23/495 ,  H01L49/02

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49551 ,  H01L23/5227 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L28/10 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/06181 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/29034 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48249 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2224/75745 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device has a chip mounting part, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip is mounted over the chip mounting part in a direction in which its first principal plane faces the chip mounting part. A part of the second semiconductor chip is mounted over the chip mounting part in a direction in which its third principal plane faces the first semiconductor chip. The element mounting part has a notch part. A part of the second semiconductor chip overlaps the notch part. In a region of the third principal plane of the second semiconductor chip that overlaps the notch part, a second electrode pad is provided.

公开(公告)号：US20160133548A1

公开(公告)日：2016-05-12

申请号：US14997509

申请日：2016-01-16

Applicant: Renesas Electronics Corporation

Inventor： Akito SHIMIZU ,  Kenji NISHIKAWA ,  Sadayuki MOROI ,  Tomoo lmura

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49579 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device, includes a die pad that has a first main surface and a second main surface located on the opposite side of the first main surface; a lead arranged next to the die pad; a semiconductor chip that has a surface, a first electrode and a second electrode formed on the surface, and a reverse side located on the opposite side of the surface, and is mounted on a chip mounting area of the first main of the die pad; a first wire that electrically couples the first electrode of the semiconductor chip and the lead; a second wire that electrically couples the second electrode of the semiconductor chip and the die pad; and a sealed body that seals the semiconductor chip, the first wire, and the second wire.

Abstract translation: 一种半导体器件，包括具有位于所述第一主表面的相对侧的第一主表面和第二主表面的管芯焊盘; 引线布置在芯片垫的旁边; 具有表面的半导体芯片，形成在所述表面上的第一电极和第二电极以及位于所述表面的相反侧的反面，并且安装在所述管芯焊盘的第一主体的芯片安装区域上; 电连接半导体芯片的第一电极和引线的第一导线; 电连接半导体芯片的第二电极和芯片焊盘的第二导线; 以及密封半导体芯片，第一线和第二线的密封体。

公开(公告)号：US20150084209A1

公开(公告)日：2015-03-26

申请号：US14487762

申请日：2014-09-16

Applicant: Renesas Electronics Corporation

Inventor： Shinichi UCHIDA ,  Kenji NISHIKAWA ,  Masato KANNO ,  Mika YONEZAWA ,  Shunichi KAERIYAMA ,  Toshinori KIYOHARA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49551 ,  H01L23/5227 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L28/10 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/06181 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/29034 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48249 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2224/75745 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device has a chip mounting part, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip is mounted over the chip mounting part in a direction in which its first principal plane faces the chip mounting part. A part of the second semiconductor chip is mounted over the chip mounting part in a direction in which its third principal plane faces the first semiconductor chip. The element mounting part has a notch part. A part of the second semiconductor chip overlaps the notch part. In a region of the third principal plane of the second semiconductor chip that overlaps the notch part, a second electrode pad is provided.

Abstract translation: 半导体器件具有芯片安装部分，第一半导体芯片和第二半导体芯片。 第一半导体芯片沿其第一主平面面向芯片安装部分的方向安装在芯片安装部分上。 第二半导体芯片的一部分在其第三主平面面向第一半导体芯片的方向上安装在芯片安装部分上。 元件安装部分具有凹口部分。 第二半导体芯片的一部分与切口部分重叠。 在与切口部重叠的第二半导体芯片的第三主平面的区域中，设置有第二电极焊盘。