摘要:
A semiconductor memory device comprises a dynamic memory cell array, a static memory cell array, a plurality of word lines, a plurality of DRAM bit line pairs and a plurality of SRAM bit line pairs. The dynamic memory cell array comprises a plurality of dynamic memory cells arranged in the shape of a matrix. The static memory cell array is arranged adjacent to the dynamic memory cell array. The static memory cell array includes the static memory cells arranged in the shape of a matrix. A plurality of word lines are arranged in a plurality of rows. Each word line is connected to the dynamic and static memory cells arranged in the corresponding rows. A plurality of DRAM bit line pairs are arranged in a plurality of columns. Each DRAM bit line pair is connected to the dynamic memory cells. A plurality of SRAM bit line pairs are arranged in the other plurality of columns. Each SRAM bit line pair is connected to the static memory cells arranged in the corresponding columns.
摘要:
A semiconductor memory device comprises a dynamic memory cell array, a static memory cell array, a plurality of word lines, a plurality of DRAM bit line pairs and a plurality of SRAM bit line pairs. The dynamic memory cell array comprises a plurality of dynamic memory cells arranged in the shape of a matrix. The static memory cell array is arranged adjacent to the dynamic memory cell array. The static memory cell array includes the static memory cells arranged in the shape of a matrix. A plurality of word lines are arranged in a plurality of rows. Each word line is connected to the dynamic and static memory cells arranged in the corresponding rows. A plurality of DRAM bit line pairs are arranged in a plurality of columns. Each DRAM bit line pair is connected to the dynamic memory cells. A plurality of SRAM bit line pairs are arranged in the other plurality of columns. Each SRAM bit line pair is connected to the static memory cells arranged in the corresponding columns.
摘要:
In a semiconductor memory device having a plurality of data input/output pins, control pins (e.g. address pins and external control signal pins) are arranged parallel to each other on a chip. The plurality of data input/output pins are divided into a plurality of groups. Each group has a specific data input/output pin. The specific data input/output pin is lined up with the control pins. In a test mode, a signal is written into all memory cells by applying the signal to the specific data input/output pin. In addition, whether the signals read from all memory cells are correct or not is determined using the specific data input/output pin.
摘要:
A semiconductor memory device comprising a memory cell array, a row decoder, an input/output register train, a burst counter, an input/output bus, a refresh counter and a multiplexer. The memory cell array includes a plurality of word lines, a plurality of bit line pairs and a plurality of memory cells. The input/output register train has a plurality of registers corresponding to the bit line pairs. Each of the registers is connected to the corresponding bit line pair. The input/output bus inputs and outputs data to and from the register train in response to a signal from the burst counter. The multiplexer supplies the row decoder with an external address signal as an internal address signal. After data is transferred from any bit line pair to the register or before data is transferred from any register to the bit line pair, the multiplexer supplies the row decoder with a refresh address signal from the refresh counter in place of the external address signal. This allows a refresh operation to take place during a burst read/write operation of data.
摘要:
A method of manufacturing a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency. According to the method, after forming an unwelded section by a primary welding process step, including a first beam irradiation process step and a second beam irradiation process step, annealing treatment is performed in an annealing process step by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step. The locus may be on a housing or a lid.
摘要:
An internal address signal corresponding to data to be written into a memory cell is held in a latch circuit. The held internal address signal is selected by a multiplexer in the next writing operation and applied to a decoder. Write data is taken in and held by the latch circuit during the period in which data is not being read out from the memory cell array. A comparator compares the held internal address signal and an internal address signal for reading data. If a matching is found between them, the multiplexer outputs data from the latch circuit for external output. Accordingly, delay of a writing operation following a reading operation can be eliminated without increasing chip cost, package cost, and system cost, as a result high speed operation of cache memories is achieved and the speed performance of computers of various levels such as supercomputers, large size calculators, work stations and personal computers can be improved.
摘要:
Sense circuits are provided correspondingly to bit line pairs provided corresponding to memory cell columns, respectively. The sense circuit senses, amplifies and latches storage data of the selected memory cell, and information latched by the sense amplifier is rewritten into the selected memory cell after selection of the memory cell. Thereby, destruction of storage information of the memory cell is prevented.
摘要:
A pair of driving bipolar transistors of a lateral type T1 and T2 have emitters coupled to a ground potential, collectors connected to a pair of highly resistive elements R1 and R2. Highly resistive elements R1 and R2 have respective other ends coupled to power supply potential V.sub.CC, and bases and collectors of transistors T1 and T2 are cross-connected to each other, thereby forming a flipflop circuit. Access MOS transistors Q3 and Q4 having a gate potential controlled by word line WL are each connected to form a conduction path between one of storage nodes A and B and one of the pair of bit lines BL and /BL.
摘要:
In the present invention, a row address processing circuit and a column address processing circuit operate in synchronism with an externally applied synchronous signal in a semiconductor memory device. The row address processing circuit and the column address processing circuit each include an address buffer and a decoder. The address buffer or decoder operates in synchronism with the synchronous signal.
摘要:
An internal address signal corresponding to data to be written into a memory cell is held in a latch circuit. The held internal address signal is selected by a multiplexer in the next writing operation and applied to a decoder. Write data is taken in and held by the latch circuit during the period in which data is not being read out from the memory cell array. A comparator compares the held internal address signal and an internal address signal for reading data. If a matching is found between them, the multiplexer outputs data from the latch circuit for externally output. Accordingly, delay of a writing operation following a reading operation can be eliminated without increasing chip cost, package cost, and system cost, as a result high speed operation of cache memories is achieved and the speed performance of computers of various levels such as supercomputer, large size calculator, work station and personal computer can be improved.