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公开(公告)号：US12125766B2
公开(公告)日：2024-10-22
申请号：US17537689
申请日：2021-11-30
发明人： Tae Hwan Kim , Jae Choon Kim , Kyung Suk Oh
IPC分类号： H01L35/32 , F25B21/02 , H01L23/00 , H01L23/31 , H01L23/373 , H01L23/38 , H01L23/48 , H01L23/522 , H01L25/16
CPC分类号： H01L23/38 , H01L23/3121 , H01L23/3738 , H01L23/481 , H01L23/5226 , H01L24/16 , H01L25/16 , H01L24/73 , H01L2224/16146 , H01L2224/16227 , H01L2224/73204
摘要： A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip bumps between the first package substrate and the first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a molding member which covers the plurality of second semiconductor chips, on the first semiconductor chip, and a thermoelectric cooling layer attached onto a surface of the first semiconductor chip. The thermoelectric cooling layer includes a cooling material layer extending along the surface of the first semiconductor chip, a first electrode pattern which surrounds the plurality of first chip bumps from a planar viewpoint, in the cooling material layer, and a second electrode pattern which surrounds the first electrode pattern from the planar viewpoint, in the cooling material layer.
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公开(公告)号：US10757430B2
公开(公告)日：2020-08-25
申请号：US15361869
申请日：2016-11-28
发明人： Tae Hwan Kim , Sung Ho Roh
IPC分类号： H04N19/426 , H04N19/159 , H04N19/172 , H04N19/423 , H04N19/127 , H04N19/593
摘要： A method of decoding image data includes operating a decoder including a decoding buffer and a decoding module, wherein the decoding module includes a plurality of decoding channels, setting a non-shared memory region and a shared memory region in the decoding buffer, restoring a plurality of frames by decoding a bitstream using the plurality of decoding channels, determining a type of each of the frames, and writing each frame to one of the non-shared memory region or the shared memory region based on the type of each frame.
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公开(公告)号：US12051680B2
公开(公告)日：2024-07-30
申请号：US17735158
申请日：2022-05-03
发明人： Tae Hwan Kim , Hyung Gil Baek , Young-Ja Kim , Kang Gyune Lee , Sang-Won Lee , Yong Kwan Lee
IPC分类号： H01L25/16 , H01L23/00 , H01L23/498
CPC分类号： H01L25/162 , H01L23/49833 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/165 , H01L23/49816 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/16235 , H01L2924/16251 , H01L2924/165 , H01L2924/1659 , H01L2924/182
摘要： A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.
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4.发明授权公开(公告)号：US11515181B2
公开(公告)日：2022-11-29
申请号：US16395701
申请日：2019-04-26
发明人： Tae Hwan Kim
摘要： A device for attaching conductive balls to a substrate includes a first plate, a second plate and a controller. The first plate includes first recesses. Each of the first recesses picks up a corresponding conductive ball to be attached to the semiconductor package. The second plate includes second recesses. Each of the second recesses picks up a corresponding conductive ball to be attached to the semiconductor package. The first plate and the second plate are separated from each other. The controller controls each of the first plate and the second plate to be separately moved up or down so that a lower surface of the first plate and a lower surface of the second plate are positioned differently in a first direction normal the lower surface of the first plate.
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公开(公告)号：USD926538S1
公开(公告)日：2021-08-03
申请号：US29730275
申请日：2020-04-02
设计人： Eun Hye Kim , Tae Hwan Kim , Ji Hyun Bang , Dong Min Shin , Mi-Seon Hwang
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公开(公告)号：US09088130B2
公开(公告)日：2015-07-21
申请号：US13845602
申请日：2013-03-18
发明人： Hong Sig Kim , Wang Yuhl Oh , Tae Hwan Kim , Jae Guyn Lim , Han Saem Cho
CPC分类号： H01S5/06821 , H01S3/1303 , H01S3/137 , H01S5/06216 , H01S5/0687 , H01S5/141 , H01S5/146
摘要： An apparatus and method for stabilizing an output of a laser is provided. An optical amplifier oscillates light having a first wavelength band. A filter filters the light having the first wavelength band to output light having a second wavelength band narrower than the first wavelength band. The light having the second wavelength band may correspond to an output of a laser. To stabilize the wavelength center of the output laser, at least a portion of the light having the second wavelength band may be transferred to a fiber Bragg Grating (FBG) through a coupler. By performing feedback of a difference between the signal output from the FBG and a laser modulation signal, an offset corresponding to a lead zirconate titanate (PZT) operating parameter of a Fabry-Perot filter may be controlled to automatically stabilize the wavelength center.
摘要翻译： 提供一种稳定激光输出的装置和方法。 光放大器振荡具有第一波长带的光。 滤光器对具有第一波长带的光进行滤光，以输出具有比第一波长带窄的第二波长带的光。 具有第二波长带的光可以对应于激光的输出。 为了稳定输出激光器的波长中心，具有第二波长带的光的至少一部分可以通过耦合器传送到光纤布拉格光栅（FBG）。 通过执行从FBG输出的信号与激光调制信号之间的差异的反馈，可以控制对应于法布里 - 珀罗滤波器的锆钛酸铅（PZT）工作参数的偏移量以自动稳定波长中心。
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