公开(公告)号：US09154109B2

公开(公告)日：2015-10-06

申请号：US14132475

申请日：2013-12-18

Applicant: Seiko Epson Corporation

Inventor： Shogo Inaba ,  Akinori Yamada ,  Aritsugu Yajima

IPC: H03H9/00 ,  H03H9/24 ,  H03H3/007

CPC classification number: H03H9/2405 ,  H03H3/0072 ,  Y10T29/49117

Abstract: An MEMS vibrator includes a substrate, a fixation section disposed above a principal surface of the substrate, a support section extending from the fixation section, and a vibrating body (an upper electrode) separated from the substrate and supported by the support section in a node part of a vibration, and the vibrating body is a 2n-fold rotationally symmetric body having 2n beams radially extending from a node part of a vibration, wherein n is a natural number.

Abstract translation: MEMS振子包括基板，设置在基板的主表面上方的固定部分，从固定部分延伸的支撑部分和与基板分离并由支撑部分支撑在节点中的振动体（上电极） 一部分振动，而振动体是2n个旋转对称体，其具有从振动的节点部分径向延伸的2n个光束，其中n是自然数。

公开(公告)号：US09176013B2

公开(公告)日：2015-11-03

申请号：US14044992

申请日：2013-10-03

Applicant: Seiko Epson Corporation

Inventor： Shogo Inaba ,  Kyo Horie

IPC: G01L1/10 ,  G01P15/097 ,  G01P15/18 ,  G01L1/14 ,  H03H9/24

CPC classification number: G01L1/10 ,  G01L1/14 ,  G01P15/097 ,  G01P15/18 ,  H03H9/2457

Abstract: A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.

Abstract translation: 传感器包括柔性晶片衬底和设置在晶片衬底的主表面上的振荡器，并且当外力施加到晶片衬底时，振荡器变形。

公开(公告)号：US20140102217A1

公开(公告)日：2014-04-17

申请号：US14044992

申请日：2013-10-03

Applicant: Seiko Epson Corporation

Inventor： Shogo Inaba ,  Kyo Horie

IPC: G01L1/10

CPC classification number: G01L1/10 ,  G01L1/14 ,  G01P15/097 ,  G01P15/18 ,  H03H9/2457

Abstract: A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.

Abstract translation: 传感器包括柔性晶片衬底和设置在晶片衬底的主表面上的振荡器，并且当外力施加到晶片衬底时，振荡器变形。

公开(公告)号：US11679976B2

公开(公告)日：2023-06-20

申请号：US16776098

申请日：2020-01-29

Applicant: SEIKO EPSON CORPORATION

Inventor： Shogo Inaba

IPC: G01P15/125 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00515 ,  G01P15/125 ,  B81B3/0021 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/0112 ,  B81C2201/0132 ,  B81C2201/0142

Abstract: A structure forming method according to an aspect is a structure forming method for forming a first hole and a second hole having width smaller than width of the first hole in a substrate with dry etching and forming a structure. The structure forming method includes forming an etching mask on the substrate, etching a portion of the etching mask overlapping a first hole forming region where the first hole is formed, etching a portion of the etching mask overlapping a second hole forming region where the second hole is formed, and performing the dry etching of the substrate using the etching mask as a mask.

公开(公告)号：US10761109B2

公开(公告)日：2020-09-01

申请号：US16143566

申请日：2018-09-27

Applicant: Seiko Epson Corporation

Inventor： Shogo Inaba ,  Atsuki Naruse ,  Shigekazu Takagi ,  Tomokazu Umeno ,  Satoru Tanaka

IPC: G01C19/5628 ,  G01P15/125 ,  G01P15/08 ,  G01P15/13 ,  G01C19/56

Abstract: A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

公开(公告)号：US20140184018A1

公开(公告)日：2014-07-03

申请号：US14132475

申请日：2013-12-18

Applicant: Seiko Epson Corporation

Inventor： Shogo Inaba ,  Akinori Yamada ,  Aritsugu Yajima

IPC: H02N1/00 ,  H03H3/00

CPC classification number: H03H9/2405 ,  H03H3/0072 ,  Y10T29/49117

Abstract: An MEMS vibrator includes a substrate, a fixation section disposed above a principal surface of the substrate, a support section extending from the fixation section, and a vibrating body (an upper electrode) separated from the substrate and supported by the support section in a node part of a vibration, and the vibrating body is a 2n-fold rotationally symmetric body having 2n beams radially extending from a node part of a vibration, wherein n is a natural number.

Abstract translation: MEMS振子包括基板，设置在基板的主表面上方的固定部分，从固定部分延伸的支撑部分和与基板分离并由支撑部分支撑在节点中的振动体（上电极） 一部分振动，而振动体是2n个旋转对称体，其具有从振动的节点部分径向延伸的2n个光束，其中n是自然数。

公开(公告)号：US20140145551A1

公开(公告)日：2014-05-29

申请号：US14082537

申请日：2013-11-18

Applicant: Seiko Epson Corporation

Inventor： Shogo Inaba ,  Masahiro Fujii

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B2203/0109 ,  B81B2203/0163 ,  Y10T29/49117

Abstract: A vibrator includes: a vibrating portion; a support portion extended from the vibrating portion; and a fixing portion disposed at the support portion, wherein the support portion includes a first beam portion extending in a first direction from the vibrating portion and a second beam portion extending in a second direction intersecting the first direction.

Abstract translation: 振动器包括：振动部分; 从所述振动部延伸的支撑部; 以及设置在所述支撑部分的固定部分，其中所述支撑部分包括从所述振动部分沿第一方向延伸的第一梁部分和沿与所述第一方向相交的第二方向延伸的第二梁部分。