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公开(公告)号：US09435823B2
公开(公告)日：2016-09-06
申请号：US14152179
申请日：2014-01-10
发明人： Atsuki Naruse
IPC分类号： G01P15/125 , G01P15/08
CPC分类号： G01P15/125 , G01P15/0802 , G01P2015/0814
摘要： A physical quantity sensor includes: an element piece including a movable weight and movable electrode portions which are provided to extend from the movable weight; fixed electrode portions which are provided in a first direction in which the element piece is displaced, with a gap d1 interposed therebetween; and fixed portions which are provided to face an end portion of the element piece, in which a recess is provided on the end portion of the movable weight in a position facing the fixed portions, a first stopper portion which extends towards the movable weight is provided on the fixed portion, and a tip end of the first stopper portion is inserted into the recess, and a gap d2 between the tip end and the movable weight is narrower than the gap d1.
摘要翻译： 物理量传感器包括：元件，其包括可移动重物和可动电极部分，其可移动重物设置成延伸; 固定电极部分，其沿元件片移动的第一方向设置，插入间隙d1; 以及设置成面向所述元件的端部的固定部分，其中在与所述固定部分相对的位置处在所述可移动重物的端部上设置有凹部，设置有朝向所述可移动重物延伸的第一止动部分 在固定部分上，并且第一止动部分的末端插入到凹部中，并且尖端和移动重物之间的间隙d2比间隙d1窄。
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公开(公告)号：US11614462B2
公开(公告)日：2023-03-28
申请号：US16426328
申请日：2019-05-30
发明人： Atsuki Naruse
IPC分类号： G01P15/08 , G01C19/5783 , G01P15/125 , G05D1/00 , G01P1/02 , G01P15/18
摘要： A physical quantity sensor includes a physical quantity sensor element including a lid joined to a substrate to define a housing space in the inside and a physical quantity sensor element piece housed in the housing space and a circuit element bonded to the outer surface of the lid via an adhesive material. In the lid, an electrode is provided to extend from an inner wall of a through-hole, which pierces through the lid from the housing space to a surface on the opposite side of the side of the physical quantity sensor element piece and is sealed by a sealing member, to a peripheral edge of the through-hole at the surface on the opposite side. In a sectional view, thickness of a region at the peripheral edge of the electrode is smaller at the opposite side of the side of an opening of the through-hole than the opening side.
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公开(公告)号：US10883887B2
公开(公告)日：2021-01-05
申请号：US16162684
申请日：2018-10-17
发明人： Atsuki Naruse
IPC分类号： G01L1/14 , G01D5/24 , G01P15/18 , G01P15/125 , G01P15/08
摘要： A physical quantity sensor includes a base unit as a support substrate, provided with a cavity that is open on one side, a movable unit which is formed on an open side of the cavity and is capable of displacing in a first direction, and spring units that are formed on the open side of the cavity and are connected to the movable unit. A length of the spring units in a second direction that is a direction, which intersects the first direction and in which the base unit overlaps the movable unit, is shorter than a length of the movable unit in the second direction and is longer than a length of the spring units in the first direction.
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4.发明授权公开(公告)号：US11892464B2
公开(公告)日：2024-02-06
申请号：US16937775
申请日：2020-07-24
发明人： Teruo Takizawa , Atsuki Naruse
IPC分类号： G01P1/02 , G01P3/44 , G01P15/08 , B60K35/00 , G01C19/5733 , G01C19/5769 , G01P15/097 , G01P15/09
CPC分类号： G01P1/026 , B60K35/00 , G01C19/5733 , G01C19/5769 , G01P1/023 , G01P3/44 , G01P15/0802 , B60K2370/48 , B60Y2400/303 , G01P15/0888 , G01P15/09 , G01P15/097
摘要： An electronic device includes a substrate, a functional element disposed on a principal plane of the substrate, a lid body, the functional element being housed in a space covered by the lid body and the substrate, the lid body including a recess at a side opposed to the functional element, an outer surface at the opposite side of the recess, a first hole section including an inclined surface and a bottom surface on the outer surface, and a second hole section piercing through the lid body between the recess and the bottom surface and having an inner wall surface, a joining section of the inclined surface and the bottom surface in the first hole section being a curved surface, the lid body containing silicon, and a sealing member that seals the first hole section communicating with the space.
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5.发明授权Package, electronic device, method of manufacturing electronic device, electronic apparatus, and mobile body 有权包装，电子设备，电子设备制造方法，电子设备和移动体公开(公告)号：US09392694B2
公开(公告)日：2016-07-12
申请号：US14693059
申请日：2015-04-22
发明人： Atsuki Naruse
IPC分类号： G01C25/00 , G01P3/44 , B81B7/00 , H05K1/11 , B81C1/00 , H05K1/03 , H05K1/18 , G01P1/02 , G01P15/125 , G01P15/08
CPC分类号： H05K1/115 , B81C1/00293 , B81C1/00539 , G01P1/023 , G01P15/125 , G01P2015/0814 , H05K1/0306 , H05K1/181 , H05K2201/09545 , H05K2201/09827
摘要： A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body, in a cross-sectional view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward the first main surface, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface, a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and the first through-hole is sealed with a sealing member.
摘要翻译： 包装体包括容纳空间部分和形成容纳空间部分的至少一部分的第一基体。 第一通孔设置在第一基体的第一通孔的横截面视图中，第一通孔从容纳空间部分侧的第二表面延伸到与容纳空间部分相对的第一主表面 第一通孔包括从第二表面朝向第一主表面倾斜的第一倾斜部分和从第一倾斜部分的第一主表面侧的一端朝向第一主体部分倾斜的第二倾斜部分 由第二倾斜部分和第二表面制成的第二角度大于由第一倾斜部分和第二表面形成的第一角度，并且第一通孔被密封部件密封。
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公开(公告)号：US10761109B2
公开(公告)日：2020-09-01
申请号：US16143566
申请日：2018-09-27
发明人： Shogo Inaba , Atsuki Naruse , Shigekazu Takagi , Tomokazu Umeno , Satoru Tanaka
IPC分类号： G01C19/5628 , G01P15/125 , G01P15/08 , G01P15/13 , G01C19/56
摘要： A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.
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公开(公告)号：US09880000B2
公开(公告)日：2018-01-30
申请号：US14938268
申请日：2015-11-11
发明人： Teruo Takizawa , Atsuki Naruse , Shigekazu Takagi
IPC分类号： G01P15/00 , G01C19/5769 , G01C19/5712 , G01P15/125 , G01P15/08 , B81C1/00
CPC分类号： G01C19/5769 , B81B2201/025 , B81C1/00293 , B81C1/00301 , B81C2203/0145 , G01C19/5712 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.
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公开(公告)号：US09688532B2
公开(公告)日：2017-06-27
申请号：US15222085
申请日：2016-07-28
发明人： Atsuki Naruse
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81C2203/0145 , B81C2203/031
摘要： A method of manufacturing an electronic device in which a second substrate (functional element) containing silicon and a third substrate (lid body) containing silicon are bonded to a first substrate containing alkali metal ions by anode bonding includes a first process of performing the anode bonding to bond the second substrate to a surface of the first substrate; a second process of removing at least a portion of the surface of the first substrate to which the third substrate is to be bonded by the anode bonding and exposing a bonding surface after the first process; and a third process of performing the anode bonding to bond the third substrate to the bonding surface of the first substrate.
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