APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20230211261A1

    公开(公告)日:2023-07-06

    申请号:US17941018

    申请日:2022-09-09

    CPC classification number: B01D29/668 B08B3/02 B08B15/00 B01D29/94 B01D29/90

    Abstract: The present disclosure provides a substrate processing apparatus capable of stabilizing the particle level when re-supplying a chemical solution. The substrate processing apparatus includes a circulation line connected to a chemical supply unit to circulate a chemical solution, a filter installed in the circulation line to filter particles in the chemical solution, a supply line connected to a first node of the circulation line and configured to supply the chemical solution to the chamber, and a drain line connected, in the circulation line, to a second node located between the filter and the first node, and configured to drain the chemical solution, the apparatus being configured to operate, during a first duration, from when a pump of the chemical supply unit is restarted after the pump had stopped, to drain the chemical solution that passes through the filter.

    Unit for supplying liquid, apparatus and method for treating substrate having the unit

    公开(公告)号:US11658048B2

    公开(公告)日:2023-05-23

    申请号:US16906392

    申请日:2020-06-19

    CPC classification number: H01L21/6715 H01L21/67253 H01L21/67309

    Abstract: An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.

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