公开(公告)号：US11972939B2

公开(公告)日：2024-04-30

申请号：US16901913

申请日：2020-06-15

Applicant: SEMES CO., LTD.

Inventor： Ohyeol Kwon ,  Jun Keon Ahn ,  Soo Young Park ,  Jung Hwan Lee

IPC: H01L21/02 ,  B23K26/0622 ,  B23K26/36 ,  B23K26/362 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/02098 ,  B23K26/0624 ,  B23K26/36 ,  B23K26/362 ,  H01L21/02021 ,  H01L21/02087 ,  H01L21/67069 ,  H01L21/67242 ,  H01L21/67253 ,  H01L21/68764 ,  H01L22/12 ,  H01L22/20

Abstract: The inventive concept provides a method for treating a substrate. The method includes removing a film on the substrate by applying a pulsed laser to the rotating substrate, in which thickness of the film to be removed is measured and pulse energy of the pulsed laser is selected based on the measured thickness of the film.

公开(公告)号：US20200167946A1

公开(公告)日：2020-05-28

申请号：US16685345

申请日：2019-11-15

Applicant: Semes Co., Ltd.

Inventor： Ohyeol KWON ,  Soo Young Park ,  Jihyun Lee ,  Young Ho Choo

IPC: G06T7/64 ,  G06T7/13 ,  G06T7/11 ,  G06T7/00 ,  H01L21/687

Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.

公开(公告)号：US11387127B2

公开(公告)日：2022-07-12

申请号：US16930660

申请日：2020-07-16

Applicant: SEMES CO., LTD.

Inventor： Ohyeol Kwon ,  Jung Hwan Lee ,  Soo Young Park

IPC: H01L21/677 ,  H01L21/687

Abstract: A substrate treating apparatus includes a plurality of load ports on which carriers having substrates received therein are placed, a plurality of process chambers that perform processes on the substrates, and a transfer robot that transfers the substrates between the load ports and the process chambers. The transfer robot is movable along a transfer passage having a lengthwise direction formed along a first direction, the load ports and the process chambers are arranged along the first direction on one side and an opposite side of the transfer passage, and the transfer robot transfers the substrates between the carriers placed on the load ports and the process chambers.

公开(公告)号：US11869763B2

公开(公告)日：2024-01-09

申请号：US16861387

申请日：2020-04-29

Applicant: SEMES CO., LTD.

Inventor： Jun Keon Ahn ,  Soo Young Park ,  Ohyeol Kwon ,  Jung Hwan Lee ,  Seungtae Yang

IPC: H01L21/02 ,  B23K26/40 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/073 ,  B23K26/06 ,  B23K26/082 ,  B23K101/40

CPC classification number: H01L21/02098 ,  B08B7/0042 ,  B23K26/0604 ,  B23K26/0622 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/073 ,  B23K26/082 ,  B23K26/0823 ,  H01L21/02087 ,  H01L21/67115 ,  H01L21/68764 ,  B23K2101/40

Abstract: An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The first laser irradiation unit includes a first laser light source configured to generate the first laser beam, and a first wavelength adjusting member configured to adjust a range of a wavelength of the first laser beam received from the first laser light source. The second laser beam, and a second wavelength adjusting member configured to adjust a range of a wavelength of the second laser beam received from the second laser light source.

公开(公告)号：US11679447B2

公开(公告)日：2023-06-20

申请号：US16861709

申请日：2020-04-29

Applicant: SEMES CO., LTD.

Inventor： Soo Young Park ,  Ohyeol Kwon ,  Jun Keon Ahn ,  Jung Hwan Lee

IPC: B23K26/042 ,  B23K26/03 ,  B23K26/08 ,  H01L21/02 ,  H01L21/68 ,  H01L21/66

CPC classification number: B23K26/042 ,  B23K26/032 ,  B23K26/0823 ,  H01L21/02021 ,  H01L21/681 ,  H01L22/12

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a space in which a substrate is treated, a support unit supporting the substrate inside the chamber, a laser unit irradiating laser to an edge region of the substrate, a vision unit capturing the edge region of the substrate to measure an offset value of the substrate, and an adjustment unit adjusting an irradiation location of the laser based on the offset value of the substrate.

公开(公告)号：US12290876B2

公开(公告)日：2025-05-06

申请号：US18341838

申请日：2023-06-27

Applicant: SEMES CO., LTD.

Inventor： Soo Young Park ,  Ohyeol Kwon ,  Jun Keon Ahn ,  Jung Hwan Lee ,  Seong Soo Lee

IPC: B23K26/0622 ,  B23K26/08 ,  B23K26/10 ,  B23K26/40 ,  B23K103/00

Abstract: Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.

公开(公告)号：US12217977B2

公开(公告)日：2025-02-04

申请号：US17665233

申请日：2022-02-04

Applicant: SEMES CO., LTD.

Inventor： Oh Yeol Kwon ,  Soo Young Park ,  Soo Yeon Shin

IPC: H01L21/67 ,  B08B3/02 ,  B08B13/00 ,  G05D3/20 ,  G06T7/00 ,  G06T7/70

Abstract: A substrate treating method includes moving a first component of a substrate treatment device to a preset position in response to a treating process of the substrate treatment device, detecting, by a plurality of position detection sensors, a position of the first component, vision-testing, by a vision sensor, a positional state of the first component, and determining an operational state of an error in the detection of the plurality of position detection sensors or a malfunction of the substrate treatment device based on a detection result obtained by the plurality of position detection sensor and a test result obtained by the vision sensor.

公开(公告)号：US11658048B2

公开(公告)日：2023-05-23

申请号：US16906392

申请日：2020-06-19

Applicant: SEMES CO., LTD.

Inventor： Seong Soo Lee ,  Buyoung Jung ,  Gi Hun Choi ,  Myung A Jeon ,  Soo Young Park

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6715 ,  H01L21/67253 ,  H01L21/67309

Abstract: An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.

公开(公告)号：US11158079B2

公开(公告)日：2021-10-26

申请号：US16685345

申请日：2019-11-15

Applicant: Semes Co., Ltd

Inventor： Ohyeol Kwon ,  Soo Young Park ,  Jihyun Lee ,  Young Ho Choo

IPC: G06K9/00 ,  G06T7/64 ,  G06T7/13 ,  G06T7/00 ,  H01L21/687 ,  G06T7/11

Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.