公开(公告)号：US11869778B2

公开(公告)日：2024-01-09

申请号：US17137233

申请日：2020-12-29

Applicant: SEMES CO., LTD.

Inventor： Seungtae Yang ,  Gi Hun Choi ,  Buyoung Jung ,  Gui Su Park

IPC: H01L21/67 ,  B08B3/12 ,  B08B3/08 ,  H01L21/687 ,  C02F9/00 ,  C02F1/00 ,  C02F1/36 ,  C02F1/48

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B3/12 ,  C02F9/00 ,  H01L21/68764 ,  C02F1/001 ,  C02F1/36 ,  C02F1/484

Abstract: An apparatus for processing a substrate includes a housing, a support unit that supports the substrate in the housing, a nozzle that dispenses a processing liquid onto the substrate, and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes a container having a storage space in which the processing liquid is stored, a liquid supply tube through which the processing liquid flows from the container to the nozzle, and an ultrasonic-wave application member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic-wave application member includes a liquid reservoir having an interior space in which a liquid is received and an ultrasonic generator that applies ultrasonic waves to the liquid received in the liquid reservoir. Part of the liquid supply tube is immersed in the liquid received in the liquid reservoir.

公开(公告)号：US11794219B2

公开(公告)日：2023-10-24

申请号：US16912754

申请日：2020-06-26

Applicant: SEMES CO., LTD.

Inventor： Seungtae Yang ,  Buyoung Jung ,  Seung Hwan Cho

IPC: B08B3/10 ,  H01L21/67

CPC classification number: B08B3/10 ,  H01L21/67051

Abstract: The inventive concept relates to an apparatus for treating a substrate. According to an embodiment, the substrate treating apparatus includes a housing having a process space therein, a support unit that supports the substrate in the housing, a nozzle that dispenses a treatment liquid onto the substrate supported on the support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle, in which the liquid supply unit includes a container having a storage space in which the treatment liquid is stored, a liquid supply tube that causes the treatment liquid to flow from the container to the nozzle, and a microwave applying member that applies microwaves to the treatment liquid before the treatment liquid is supplied to the nozzle.

公开(公告)号：US11232942B2

公开(公告)日：2022-01-25

申请号：US15931911

申请日：2020-05-14

Applicant: SEMES CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Seungtae Yang ,  Buyoung Jung ,  Gui Su Park ,  Jae Hong Lee ,  Ho-Young Kim ,  Yunsuk Jeung

IPC: B08B3/04 ,  H01L21/02 ,  H01L21/67

Abstract: A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.

公开(公告)号：US11869763B2

公开(公告)日：2024-01-09

申请号：US16861387

申请日：2020-04-29

Applicant: SEMES CO., LTD.

Inventor： Jun Keon Ahn ,  Soo Young Park ,  Ohyeol Kwon ,  Jung Hwan Lee ,  Seungtae Yang

IPC: H01L21/02 ,  B23K26/40 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/073 ,  B23K26/06 ,  B23K26/082 ,  B23K101/40

CPC classification number: H01L21/02098 ,  B08B7/0042 ,  B23K26/0604 ,  B23K26/0622 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/073 ,  B23K26/082 ,  B23K26/0823 ,  H01L21/02087 ,  H01L21/67115 ,  H01L21/68764 ,  B23K2101/40

Abstract: An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The first laser irradiation unit includes a first laser light source configured to generate the first laser beam, and a first wavelength adjusting member configured to adjust a range of a wavelength of the first laser beam received from the first laser light source. The second laser beam, and a second wavelength adjusting member configured to adjust a range of a wavelength of the second laser beam received from the second laser light source.