公开(公告)号：US20230212044A1

公开(公告)日：2023-07-06

申请号：US18148168

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Bok Kyu Lee ,  Byung Woo Sim ,  Yong Sun Ko ,  Young Seop Choi ,  Myung A Jeon

IPC: C02F1/78

CPC classification number: C02F1/78 ,  C02F2201/005 ,  C02F2209/001 ,  C02F2209/02 ,  C02F2209/23

Abstract: Disclosed is a method of decomposing ozone in ozone water. According to the present invention, a temperature of ozone water is increased by mixing ozone water with heated water, and the ozone in the ozone water is decomposed into oxygen by the increase in the temperature.

公开(公告)号：US12198950B2

公开(公告)日：2025-01-14

申请号：US17943312

申请日：2022-09-13

Applicant: SEMES CO., LTD.

Inventor： Myung A Jeon ,  Muhyeon Lee ,  Sul Lee

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B32B41/00 ,  B32B43/00 ,  H01L21/683

Abstract: Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

公开(公告)号：US12134113B2

公开(公告)日：2024-11-05

申请号：US18117592

申请日：2023-03-06

Applicant: SEMES CO., LTD.

Inventor： Ju Hwan Lee ,  Hyeon Jun Lee ,  So Young Park ,  Myung A Jeon

IPC: B08B3/02 ,  B08B13/00 ,  H01L21/67

Abstract: A substrate processing method for processing a substrate, the substrate processing method comprising: a first nozzle moving step of moving a first nozzle to a process position and a standby position in a swing motion manner; a cleaning liquid supplying step of supplying, by the first nozzle, a cleaning liquid onto a rotating substrate at the process position of the first nozzle; a second nozzle moving step of moving a second nozzle to a process position and a standby position in a swing motion manner; a drying gas supplying step of supplying, by the second nozzle, a drying gas onto the rotating substrate at the process position of the second nozzle; and a nozzle distance controlling step of controlling a distance between the first nozzle and the second nozzle on the basis of a horizontal position of at least one of the first nozzle and the second nozzle.

公开(公告)号：US11664212B2

公开(公告)日：2023-05-30

申请号：US17239091

申请日：2021-04-23

Applicant: SEMES CO., LTD.

Inventor： Yong Hoon Hong ,  Sul Lee ,  Myung A Jeon ,  Moonsik Choi ,  Young Su Kim

IPC: H01L21/02 ,  H01L21/263

CPC classification number: H01L21/02057 ,  H01L21/02282 ,  H01L21/2636

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a housing having a treatment space for treating a substrate in an interior thereof, a support unit that supports the substrate in the treatment space, a nozzle that supplies a liquid to the substrate positioned on the support unit, a liquid supply unit that supplies the liquid to the nozzle, and a controller that controls the liquid unit, the liquid supply unit includes a tank having an interior space for storing the liquid, and a first circulation line that circulates the liquid stored in the interior space and in which a first heater is installed, and the controller controls the first heater such that the first heater heats the liquid to a first temperature, at which particles in the interior of the liquid are not eluted.

公开(公告)号：US11658048B2

公开(公告)日：2023-05-23

申请号：US16906392

申请日：2020-06-19

Applicant: SEMES CO., LTD.

Inventor： Seong Soo Lee ,  Buyoung Jung ,  Gi Hun Choi ,  Myung A Jeon ,  Soo Young Park

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6715 ,  H01L21/67253 ,  H01L21/67309

Abstract: An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.