公开(公告)号：US11794219B2

公开(公告)日：2023-10-24

申请号：US16912754

申请日：2020-06-26

Applicant: SEMES CO., LTD.

Inventor： Seungtae Yang ,  Buyoung Jung ,  Seung Hwan Cho

IPC: B08B3/10 ,  H01L21/67

CPC classification number: B08B3/10 ,  H01L21/67051

Abstract: The inventive concept relates to an apparatus for treating a substrate. According to an embodiment, the substrate treating apparatus includes a housing having a process space therein, a support unit that supports the substrate in the housing, a nozzle that dispenses a treatment liquid onto the substrate supported on the support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle, in which the liquid supply unit includes a container having a storage space in which the treatment liquid is stored, a liquid supply tube that causes the treatment liquid to flow from the container to the nozzle, and a microwave applying member that applies microwaves to the treatment liquid before the treatment liquid is supplied to the nozzle.

公开(公告)号：US11869778B2

公开(公告)日：2024-01-09

申请号：US17137233

申请日：2020-12-29

Applicant: SEMES CO., LTD.

Inventor： Seungtae Yang ,  Gi Hun Choi ,  Buyoung Jung ,  Gui Su Park

IPC: H01L21/67 ,  B08B3/12 ,  B08B3/08 ,  H01L21/687 ,  C02F9/00 ,  C02F1/00 ,  C02F1/36 ,  C02F1/48

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B3/12 ,  C02F9/00 ,  H01L21/68764 ,  C02F1/001 ,  C02F1/36 ,  C02F1/484

Abstract: An apparatus for processing a substrate includes a housing, a support unit that supports the substrate in the housing, a nozzle that dispenses a processing liquid onto the substrate, and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes a container having a storage space in which the processing liquid is stored, a liquid supply tube through which the processing liquid flows from the container to the nozzle, and an ultrasonic-wave application member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic-wave application member includes a liquid reservoir having an interior space in which a liquid is received and an ultrasonic generator that applies ultrasonic waves to the liquid received in the liquid reservoir. Part of the liquid supply tube is immersed in the liquid received in the liquid reservoir.

公开(公告)号：US10825699B2

公开(公告)日：2020-11-03

申请号：US16224891

申请日：2018-12-19

Applicant: SEMES CO., LTD.

Inventor： Buyoung Jung ,  Jonghan Kim ,  Young Jin Jang ,  Jin Tack Yu ,  Youngjun Choi ,  Daehun Kim ,  Byungsun Bang ,  Jonghyeon Woo ,  Heehwan Kim ,  Cheol-Yong Shin ,  Gui Su Park

IPC: H01L21/67 ,  H01L21/683

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

公开(公告)号：US11658048B2

公开(公告)日：2023-05-23

申请号：US16906392

申请日：2020-06-19

Applicant: SEMES CO., LTD.

Inventor： Seong Soo Lee ,  Buyoung Jung ,  Gi Hun Choi ,  Myung A Jeon ,  Soo Young Park

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6715 ,  H01L21/67253 ,  H01L21/67309

Abstract: An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.

公开(公告)号：US11232942B2

公开(公告)日：2022-01-25

申请号：US15931911

申请日：2020-05-14

Applicant: SEMES CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Seungtae Yang ,  Buyoung Jung ,  Gui Su Park ,  Jae Hong Lee ,  Ho-Young Kim ,  Yunsuk Jeung

IPC: B08B3/04 ,  H01L21/02 ,  H01L21/67

Abstract: A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.

公开(公告)号：US10699918B2

公开(公告)日：2020-06-30

申请号：US15484377

申请日：2017-04-11

Applicant: SEMES CO., LTD.

Inventor： Buyoung Jung ,  Jin Tack Yu ,  Gil Hun Song ,  Sun Yong Park

IPC: H01L21/67 ,  B05B1/14 ,  B08B3/08

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.

公开(公告)号：US20180337070A1

公开(公告)日：2018-11-22

申请号：US15979956

申请日：2018-05-15

Applicant: SEMES CO., LTD.

Inventor： Byungsun Bang ,  Buyoung Jung ,  Jungbong Choi ,  Bong Joo Kim ,  Youngil Lee ,  Gil Hun Song ,  Gui Su Park ,  Kwang Ryul Kim ,  Kwang-Seop Lee ,  Jin Tack Yu

IPC: H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  B08B3/04 ,  B08B3/08 ,  B08B7/04 ,  C03C23/00 ,  B23K26/402

CPC classification number: H01L21/67028 ,  B08B3/041 ,  B08B3/08 ,  B08B7/0042 ,  B08B7/04 ,  B23K26/402 ,  C03C23/0025 ,  H01L21/0206 ,  H01L21/0217

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.