SUBSTRATE TREATING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240145263A1

    公开(公告)日:2024-05-02

    申请号:US18099856

    申请日:2023-01-20

    CPC classification number: H01L21/67034

    Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.

    APPARATUS FOR TREATING SUBSTRATE AND APPARATUS FOR MEASURING CONCENTRATION

    公开(公告)号:US20230111149A1

    公开(公告)日:2023-04-13

    申请号:US17957428

    申请日:2022-09-30

    Abstract: Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20210013064A1

    公开(公告)日:2021-01-14

    申请号:US16925449

    申请日:2020-07-10

    Abstract: An apparatus for treating a substrate includes a light treatment chamber having an interior space, a support unit that supports the substrate in the interior space, and an irradiation unit that irradiates light to the substrate in the interior space to remove organic matter remaining on the substrate, in which the irradiation unit includes a first light source that irradiates first light to the substrate and a second light source that irradiates, to the substrate, second light having a different wavelength range from the first light.

    SUBSTRATE TREATING APPARATUS
    7.
    发明申请

    公开(公告)号:US20220381509A1

    公开(公告)日:2022-12-01

    申请号:US17825275

    申请日:2022-05-26

    Abstract: The present invention provides a substrate treating apparatus, including: a housing including a first body and a second body which are combined with each other to provide a treatment space in which a substrate is treated; an actuator which moves the second body in a vertical direction with respect to the first body to seal or open the treatment space; and a pipe which is coupled with the second body and in which a fluid flows, in which the pipe is a stretchable pipe that is stretchable and contractible according to the vertical movement of the second body.

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