-
公开(公告)号:US11977332B2
公开(公告)日:2024-05-07
申请号:US17017786
申请日:2020-09-11
Inventor: Hae-Won Choi , Yerim Yeon , Anton Koriakin , Kihoon Choi , Youngran Ko , Jeong Ho Cho , Hyungseok Kang , Hong Gi Min
CPC classification number: G03F7/162 , G03F7/168 , H01L21/67225 , G03F7/039 , G03F7/322
Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.
-
公开(公告)号:US12046466B2
公开(公告)日:2024-07-23
申请号:US17965911
申请日:2022-10-14
Applicant: SEMES CO., LTD.
Inventor: Yong-Jun Seo , Hyun Yoon , Jungsuk Goh , Byeong Geun Kim , Yoonki Sa , Doyeon Kim , Yerim Yeon , Choonghyun Lee , Pil Kyun Heo , Youngje Um , Jaeseong Lee , Dongok Ahn
CPC classification number: H01L21/02101 , H01L21/6715
Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
-
公开(公告)号:US10711228B2
公开(公告)日:2020-07-14
申请号:US16028720
申请日:2018-07-06
Applicant: SEMES CO., LTD.
Inventor: Mong-Ryong Lee , Miyoung Jo , Yerim Yeon , Anton Koriakin
Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a support member which supports a substrate; a treatment liquid discharging member which discharges a treatment liquid containing a monomeric substance to the substrate located in the support member; and a light irradiator which irradiates light to the treatment liquid discharged to the substrate.
-
-