-
1.发明授权公开(公告)号：US11508704B2
公开(公告)日：2022-11-22
申请号：US17121651
申请日：2020-12-14
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon Chae , Ik Kyu You , Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu
IPC: H01L25/075 , H01L33/62 , H01L23/00
Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.
-
2.发明申请公开(公告)号：US20210183828A1
公开(公告)日：2021-06-17
申请号：US17121651
申请日：2020-12-14
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jong Hyeon Chae , Ik Kyu You , Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu
IPC: H01L25/075 , H01L33/62 , H01L23/00
Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.
-
公开(公告)号：US10734554B2
公开(公告)日：2020-08-04
申请号：US16354815
申请日：2019-03-15
Applicant: Seoul Viosys Co., Ltd.
Inventor： Min Chan Heo , Kyoung Wan Kim , Ye Seul Kim , Yong Woo Ryu
Abstract: A light emitting diode including a light emitting structure including an active layer, a first distributed Bragg reflector (DBR) disposed on one side of the light emitting structure to reflect light emitted from the light emitting structure, and an interfacial layer disposed between the light emitting structure and the first DBR, in which the first DBR includes first material layers having a low refractive index and second material layers having a high refractive index alternately stacked one above another, the interfacial layer has a lower refractive index than the first material layers, and has a thickness greater than a thickness of each of the first and second material layers, and one a second material layer of the second material layers that is closest to the interfacial layer includes a first sub-layer and a second sub-layer, the first sub-layer having a density lower than that of the second sub-layer.
-
公开(公告)号：US11961873B2
公开(公告)日：2024-04-16
申请号：US17314562
申请日：2021-05-07
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu
IPC: H01L27/15 , H01L25/075 , H01L33/38 , H01L33/62
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/382 , H01L33/62
Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.
-
公开(公告)号：US11437353B2
公开(公告)日：2022-09-06
申请号：US17096289
申请日：2020-11-12
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu , Jong Hyeon Chae
IPC: H01L25/075 , H01L33/42 , H01L33/62
Abstract: A light emitting device including a first LED stack, a second LED stack, and a third LED stack each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the second LED stack, a second planarization layer disposed on the first LED stack, lower buried vias passing through the first planarization layer, the second LED stack, and the first bonding layer and electrically connected to the semiconductor layers of the third LED stack, respectively, and upper buried vias passing through the second planarization layer and the first LED stack, in which a width of an upper end of each of the lower buried vias and the upper buried vias is greater than a width of a corresponding through hole.
-
Patent Agency Ranking
公开(公告)号：US11239387B2
公开(公告)日：2022-02-01
申请号：US16246192
申请日：2019-01-11
Applicant: Seoul Viosys Co., Ltd.
Inventor： Keum Ju Lee , Seom Geun Lee , Kyoung Wan Kim , Yong Woo Ryu , Mi Na Jang
Abstract: A light emitting diode includes: a substrate; a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer and an active layer interposed between the lower semiconductor layer and the upper semiconductor layer, the semiconductor stack having an isolation groove exposing the substrate through the upper semiconductor layer, the active layer and the lower semiconductor layer; a first electrode pad and an upper extension portion electrically connected to the upper semiconductor layer; a second electrode pad and a lower extension portion electrically connected to the lower semiconductor layer; a connecting portion connecting the upper extension portion and the lower extension portion to each other across the isolation groove; a first current blocking layer interposed between the lower extension portion and the lower semiconductor layer; and a second current blocking layer interposed between the second electrode pad and the lower semiconductor layer.
-
公开(公告)号：US10559715B2
公开(公告)日：2020-02-11
申请号：US16259478
申请日：2019-01-28
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Mae Yi Kim , Jin Woong Lee , Yeo Jin Yoon , Seom Geun Lee , Yong Woo Ryu , Keum Ju Lee
Abstract: A light emitting diode is provided to comprises: a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on the substrate and having an opening for exposing a first conductive semiconductor layer; a first electrode pad disposed to be closer to a first corner of the substrate; a second electrode pad disposed to be relatively closer to a second corner of the substrate opposing to the first corner; a first extension extending from the first electrode pad; and a second extension and a third extension extending from the second electrode pad to sides of the first extension, wherein an imaginary line connecting an end of the second extension and an end of the third extension is located between the first electrode pad and the first corner.
-
公开(公告)号：US09905729B2
公开(公告)日：2018-02-27
申请号：US15354928
申请日：2016-11-17
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Mae Yi Kim , Jin Woong Lee , Yeo Jin Yoon , Seom Geun Lee , Yong Woo Ryu , Keum Ju Lee
Abstract: A light emitting diode is provided to comprises: a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on the substrate and having an opening for exposing a first conductive semiconductor layer; a first electrode pad disposed to be closer to a first corner of the substrate; a second electrode pad disposed to be relatively closer to a second corner of the substrate opposing to the first corner; a first extension extending from the first electrode pad; and a second extension and a third extension extending from the second electrode pad to sides of the first extension, wherein an imaginary line connecting an end of the second extension and an end of the third extension is located between the first electrode pad and the first corner.
-
公开(公告)号：US12199214B2
公开(公告)日：2025-01-14
申请号：US17586804
申请日：2022-01-28
Applicant: Seoul Viosys Co., Ltd.
Inventor： Keum Ju Lee , Seom Geun Lee , Kyoung Wan Kim , Yong Woo Ryu , Mi Na Jang
Abstract: A light emitting diode including a substrate having a first area and a second area defined by an isolation groove line, a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer, an active layer, a first electrode pad electrically connected to the lower semiconductor layer, a second electrode pad electrically connected to the upper semiconductor layer, and a connecting portion electrically connecting the semiconductor stack disposed in the first and second areas to each other, and including a first portion, a second portion, and a third portion extending from a second distal end of the first portion, in which the isolation groove line is disposed between the first and second electrode pads and exposes the substrate, the first portion extends along a first direction substantially parallel to an extending direction of the isolation groove line, and the second and third portions extend in a second direction crossing the first direction.
-
公开(公告)号：US12040344B2
公开(公告)日：2024-07-16
申请号：US17318475
申请日：2021-05-12
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seong Kyu Jang , Seom Geun Lee , Yong Woo Ryu
CPC classification number: H01L27/15 , H01L33/62 , H01L2933/0066
Abstract: A stacked light emitting device includes a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, and a plurality of pads disposed over the first LED stack. Each of the first, second, and third LED stacks has a light generation region and a peripheral region disposed around the light generation region. The plurality of pads is disposed on the peripheral region of the first LED stack.
-
-
-
-
-
-
-
-
-
Search Results
23
records
(took 0.02 seconds)
