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    LOW PROFILE CAMERA MODULE WITH IMAGE COMPENSATION
    1.
    发明申请
    LOW PROFILE CAMERA MODULE WITH IMAGE COMPENSATION 有权
    具有图像补偿的低轮廓相机模块

    公开(公告)号：US20150237245A1

    公开(公告)日：2015-08-20

    申请号：US14183937

    申请日：2014-02-19

    Applicant: STMicroelectronics Pte Ltd.

    Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

    IPC: H04N5/235 ,  H04N5/225

    CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

    Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

    Abstract translation: 公开了一种用于微型照相机的低成本树脂透镜。 树脂透镜具有低外形，特别适用于诸如智能手机的消费产品。 树脂透镜安装到附接到标准四层基板的集成电路管芯上。 集成电路管芯包括用于支持数字图像捕获，传输和处理的电子和/或光电子电路。 图像校正软件调整图像以校正由树脂透镜引入的失真。

    LIQUID CRYSTAL CELL CONNECTION TO LENS MOUNT OF CAMERA MODULE
    2.
    发明申请
    LIQUID CRYSTAL CELL CONNECTION TO LENS MOUNT OF CAMERA MODULE 审中-公开
    液晶电池连接到相机模块的镜头

    公开(公告)号：US20150138420A1

    公开(公告)日：2015-05-21

    申请号：US14086507

    申请日：2013-11-21

    Applicant: STMicroelectronics Pte Ltd.

    Inventor： Hk Looi ,  David Gani ,  Wee Chin Judy Lim ,  Bs Aw ,  Cheng-Hai Cheh

    IPC: H04N5/225 ,  G02F1/1341 ,  G02F1/1345 ,  G02F1/1333 ,  G02F1/1343

    CPC classification number: H04N5/2257 ,  G02F1/13452 ,  G03B3/10 ,  G03B5/00 ,  G03B17/02 ,  G03B2205/0046 ,  Y10T29/49117

    Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.

    Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。

    Lens mount with conductive glue pocket for grounding to a circuit board
    3.
    发明授权
    Lens mount with conductive glue pocket for grounding to a circuit board 有权
    镜头安装带导电胶袋，用于接地到电路板

    公开(公告)号：US09596748B2

    公开(公告)日：2017-03-14

    申请号：US13852373

    申请日：2013-03-28

    Applicant: STMicroelectronics Pte Ltd.

    Inventor： Wee Chin Judy Lim

    IPC: H05K1/02 ,  H05K9/00

    CPC classification number: H05K1/0215 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/2018 ,  Y10T29/49124

    Abstract: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.

    Abstract translation: 镜头座安装在电路板上并覆盖电路板上的电气部件。 电绝缘装置位于透镜支架和电路板之间。 电路板包括邻近电绝缘装置的接地垫。 透镜座包括与接地垫和电绝缘装置对准的孔。 将导电胶分配到孔中以将透镜安装座电接地到接地垫。 电绝缘装置将导电胶从电气部件密封。 提供了一种将透镜座连接到电路板的方法。

    CONTACT HAVING AN ANGLED PORTION
    4.
    发明申请
    CONTACT HAVING AN ANGLED PORTION 有权
    联系有一个安装的部分

    公开(公告)号：US20140293120A1

    公开(公告)日：2014-10-02

    申请号：US13853598

    申请日：2013-03-29

    Applicant: STMICROELECTRONICS PTE LTD.

    Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

    IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

    CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

    Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

    Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。

    Image sensing device with cap and related methods
    5.
    发明授权
    Image sensing device with cap and related methods 有权

    公开(公告)号：US10854651B2

    公开(公告)日：2020-12-01

    申请号：US16536984

    申请日：2019-08-09

    Applicant: STMICROELECTRONICS PTE LTD

    Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

    IPC: H01L27/146 ,  H01L31/0203

    Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.

    IMAGE SENSING DEVICE WITH CAP AND RELATED METHODS
    9.
    发明申请
    IMAGE SENSING DEVICE WITH CAP AND RELATED METHODS 审中-公开

    公开(公告)号：US20190363123A1

    公开(公告)日：2019-11-28

    申请号：US16536984

    申请日：2019-08-09

    Applicant: STMICROELECTRONICS PTE LTD

    Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

    IPC: H01L27/146 ,  H01L31/0203

    Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.

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