公开(公告)号：US20130139380A1

公开(公告)日：2013-06-06

申请号：US13690374

申请日：2012-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Kyoungran KIM ,  Sang Yun KIM ,  Young Bum KIM ,  Seung Dae SEOK ,  Jae-Bong SHIN ,  Il-Young HAN ,  Min-Gyu KOH ,  Dong-Gil SHIM ,  Dong-soo LEE ,  Sang-Jean JEON

IPC: H05K3/32

CPC classification number: H05K3/32 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/751 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/75266 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2203/101 ,  Y10T29/53174 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: A chip bonding apparatus configured to bond chips to a circuit board using induction heating generated by an AC magnetic field may be provided. In particular, the chip bonding apparatus includes at least one stage unit configured to support a circuit board on which a chip is placed, a rotating unit configured to rotatively move the at least one stage unit at a desired angle, and a bonding unit including an induction heating antenna configured to perform induction heating such the chip is bonded to the circuit board.

Abstract translation: 可以提供一种芯片接合装置，其被配置为使用由AC磁场产生的感应加热将芯片接合到电路板。 特别地，芯片接合装置包括：至少一个级单元，被配置为支撑其上放置有芯片的电路板;旋转单元，被配置为使所述至少一个级单元以期望的角度旋转移动;以及接合单元， 感应加热天线被配置为执行感应加热，使得芯片被接合到电路板。