公开(公告)号：US20210358778A1

公开(公告)日：2021-11-18

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung HAN ,  Kyoungran KIM ,  Chulhyun PARK ,  Minjae SHIN ,  Geunsik OH ,  Hyunjin LEE ,  Soonwon LEE ,  Nungpyo HONG

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

公开(公告)号：US20130248114A1

公开(公告)日：2013-09-26

申请号：US13826446

申请日：2013-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Dae SEOK ,  Kyoungran KIM ,  Jae Bong SHIN ,  Hyung Sok YEO ,  Byung Joon LEE ,  Il Young HAN

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75101 ,  H01L2224/75264 ,  H01L2224/75501 ,  H01L2224/75744 ,  H01L2224/81075 ,  H01L2224/81203 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2924/01007

Abstract: A bonding apparatus includes at least one stage unit to support a circuit board having a chip thereon and a bonding unit coupled to the stage unit to define a chamber. The bonding unit has at least one inductive heater to heat to bond the chip to the circuit board, and the stage unit includes a vacuum generator configured to generate a vacuum between the stage unit and the circuit board. The vacuum is used to hold the circuit board on the stage unit during bonding of the chip to the circuit board. The induction heater may include one or more induction heating antennas, and the chamber may include one or more stage units.

Abstract translation: 接合装置包括至少一个级单元，用于支撑其上具有芯片的电路板和耦合到级单元的接合单元以限定腔室。 接合单元具有至少一个感应加热器以加热以将芯片结合到电路板，并且平台单元包括配置成在平台单元和电路板之间产生真空的真空发生器。 在将芯片接合到电路板时，真空用于将电路板保持在平台单元上。 感应加热器可以包括一个或多个感应加热天线，并且腔室可以包括一个或多个平台单元。

公开(公告)号：US20130139380A1

公开(公告)日：2013-06-06

申请号：US13690374

申请日：2012-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Kyoungran KIM ,  Sang Yun KIM ,  Young Bum KIM ,  Seung Dae SEOK ,  Jae-Bong SHIN ,  Il-Young HAN ,  Min-Gyu KOH ,  Dong-Gil SHIM ,  Dong-soo LEE ,  Sang-Jean JEON

IPC: H05K3/32

CPC classification number: H05K3/32 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/751 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/75266 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2203/101 ,  Y10T29/53174 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: A chip bonding apparatus configured to bond chips to a circuit board using induction heating generated by an AC magnetic field may be provided. In particular, the chip bonding apparatus includes at least one stage unit configured to support a circuit board on which a chip is placed, a rotating unit configured to rotatively move the at least one stage unit at a desired angle, and a bonding unit including an induction heating antenna configured to perform induction heating such the chip is bonded to the circuit board.

Abstract translation: 可以提供一种芯片接合装置，其被配置为使用由AC磁场产生的感应加热将芯片接合到电路板。 特别地，芯片接合装置包括：至少一个级单元，被配置为支撑其上放置有芯片的电路板;旋转单元，被配置为使所述至少一个级单元以期望的角度旋转移动;以及接合单元， 感应加热天线被配置为执行感应加热，使得芯片被接合到电路板。