公开(公告)号：US20150155178A1

公开(公告)日：2015-06-04

申请号：US14297024

申请日：2014-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sam Hyung-sam KIM ,  Gon-Jun KIM ,  Volynets VLADMIR ,  Yong-Kyun PARK ,  In-Cheol SONG ,  Sang-Heon LEE ,  Sang-Jean JEON

IPC: H01L21/3065 ,  H01L21/67

CPC classification number: H01L21/67069 ,  H01J37/32357 ,  H01J37/3244 ,  H01L21/32136 ,  H01L21/6719

Abstract: In a method of processing a substrate, a first plasma may be generated from a first reaction gas. A second plasma may be generated from a second reaction gas. The first plasma and the second plasma may be individually applied to the substrate. Thus, each of the at least two remote plasma sources may generate at least two plasmas under different process recipes, which may be optimized for processing the substrate. As a result, the substrate processed using the optimal plasmas may have a desired shape.

Abstract translation: 在处理衬底的方法中，可以从第一反应气体产生第一等离子体。 可以从第二反应气体产生第二等离子体。 第一等离子体和第二等离子体可以单独地施加到基底。 因此，至少两个远程等离子体源中的每一个可以在不同的工艺配方下产生至少两个等离子体，其可以被优化用于处理衬底。 结果，使用最佳等离子体处理的衬底可以具有期望的形状。

公开(公告)号：US20130139380A1

公开(公告)日：2013-06-06

申请号：US13690374

申请日：2012-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Kyoungran KIM ,  Sang Yun KIM ,  Young Bum KIM ,  Seung Dae SEOK ,  Jae-Bong SHIN ,  Il-Young HAN ,  Min-Gyu KOH ,  Dong-Gil SHIM ,  Dong-soo LEE ,  Sang-Jean JEON

IPC: H05K3/32

CPC classification number: H05K3/32 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/751 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/75266 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2203/101 ,  Y10T29/53174 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: A chip bonding apparatus configured to bond chips to a circuit board using induction heating generated by an AC magnetic field may be provided. In particular, the chip bonding apparatus includes at least one stage unit configured to support a circuit board on which a chip is placed, a rotating unit configured to rotatively move the at least one stage unit at a desired angle, and a bonding unit including an induction heating antenna configured to perform induction heating such the chip is bonded to the circuit board.

Abstract translation: 可以提供一种芯片接合装置，其被配置为使用由AC磁场产生的感应加热将芯片接合到电路板。 特别地，芯片接合装置包括：至少一个级单元，被配置为支撑其上放置有芯片的电路板;旋转单元，被配置为使所述至少一个级单元以期望的角度旋转移动;以及接合单元， 感应加热天线被配置为执行感应加热，使得芯片被接合到电路板。