公开(公告)号：US20210057480A1

公开(公告)日：2021-02-25

申请号：US17091236

申请日：2020-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: H01L27/146 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  H01L21/683

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and cis amole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US10854666B2

公开(公告)日：2020-12-01

申请号：US16229972

申请日：2018-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: G03F7/09 ,  G03F7/038 ,  G03F7/16 ,  H01L27/146 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  H01L21/683

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US10764593B2

公开(公告)日：2020-09-01

申请号：US14412828

申请日：2013-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeong-doo Choi ,  Young-o Park ,  Il-koo Kim ,  Jae-hyun Kim ,  Jeong-hoon Park

IPC: H04N19/44 ,  H04N19/30 ,  H04N19/31 ,  H04N19/70 ,  H04N19/46 ,  H04N19/513 ,  H04N19/52

Abstract: Provided are a video encoding method and apparatus having temporal scalability, and a video decoding method and apparatus having temporal scalability. The video encoding method includes: splitting pictures included in a picture sequence into temporal sub-layers; classifying, as a first temporal layer access picture or a second temporal layer access picture, a temporal layer access picture based on whether a picture encoded after the temporal layer access picture is capable of referring to a picture encoded before the temporal layer access picture; and adding, to transmission unit data including the temporal layer access picture, type syntax information for identifying the first temporal layer access picture and the second temporal layer access picture, wherein the picture encoded after the temporal layer access picture belongs to a same temporal sub-layer as the temporal layer access picture or belongs to an upper temporal sub-layer to the temporal layer access picture.

公开(公告)号：US09774883B2

公开(公告)日：2017-09-26

申请号：US14521817

申请日：2014-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeong-doo Choi ,  Jae-hyun Kim ,  Jeong-hoon Park

IPC: H04N19/597 ,  H04N21/2343 ,  H04N21/236 ,  H04N21/2365 ,  H04N21/2381 ,  H04N19/70 ,  H04N19/46 ,  H04N19/30 ,  H04N21/81 ,  H04N21/845

CPC classification number: H04N19/597 ,  H04N19/30 ,  H04N19/46 ,  H04N19/70 ,  H04N21/234327 ,  H04N21/23614 ,  H04N21/2365 ,  H04N21/2381 ,  H04N21/816 ,  H04N21/8451

Abstract: A multi-view video encoding method multiplexes an encoded multi-view image by a predetermined data unit and adds a scalable extension type (SET) indicating which view of image among a basic view image and an additional view image is related to data included in the predetermined data unit, a depth flag indicating which image is related to the data among a texture image and a depth map image, and a view ID of the data to a header of the predetermined data unit.

公开(公告)号：US09571832B2

公开(公告)日：2017-02-14

申请号：US14327074

申请日：2014-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Seung-ho Park ,  Jae-hyun Kim ,  Se-hyeok Park ,  Hyun-wook Park ,  Hyung-jun Lim

IPC: H04N19/00 ,  H04N19/51 ,  H04N19/513 ,  H04N19/52 ,  H04N19/543 ,  H04N19/139 ,  H04N19/176 ,  H04N19/119 ,  H04N19/147 ,  H04N19/192

CPC classification number: H04N19/513 ,  H04N19/119 ,  H04N19/139 ,  H04N19/147 ,  H04N19/176 ,  H04N19/192 ,  H04N19/52 ,  H04N19/521 ,  H04N19/543

Abstract: Provided are an image encoding method and apparatus, and an image decoding method and apparatus. The image encoding method includes: obtaining a variation of a motion estimation error with respect to a homogeneity degree of a motion vector according to mergence, based on a motion vector of each of merged blocks obtained by merging adjacent blocks, motion vectors of the adjacent blocks included in each of the merged blocks, and motion vectors of neighboring blocks of each of the merged blocks; and determining, based on the obtained variation, a merged block having a smallest variation from among the merged blocks and whether to merge the adjacent blocks included in the determined merged block.

Abstract translation: 提供了图像编码方法和装置，以及图像解码方法和装置。 图像编码方法包括：基于通过合并相邻块获得的每个合并块的运动矢量，获得关于根据合并的运动矢量的均匀度的运动估计误差的变化，相邻块的运动矢量 包括在每个合并块中，以及每个合并块的相邻块的运动矢量; 以及基于所获得的变化，确定在合并块中具有最小变化的合并块以及是否合并所确定的合并块中包括的相邻块。

公开(公告)号：US11309345B2

公开(公告)日：2022-04-19

申请号：US17091236

申请日：2020-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: G03F7/09 ,  G03F7/038 ,  G03F7/16 ,  H01L27/146 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  H01L21/683 ,  C08F220/30 ,  C08F220/18 ,  C08F220/28 ,  C08K5/544

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US20190245003A1

公开(公告)日：2019-08-08

申请号：US16229972

申请日：2018-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung-chul Eum ,  Hye-kyoung Lee ,  Chang-kun Kang ,  Jae-hyun Kim ,  Kyeong-il Oh ,  Seung-keun Oh ,  Chi-hwan Lee

IPC: H01L27/146 ,  H01L21/683 ,  H01L21/78 ,  C09D133/08 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30

CPC classification number: H01L27/14687 ,  C08F220/18 ,  C08F220/28 ,  C08F220/30 ,  C08F2220/1841 ,  C08F2220/185 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F2220/1891 ,  C08F2220/281 ,  C08F2220/282 ,  C08F2220/301 ,  C08F2220/302 ,  C08F2220/305 ,  C09D133/08 ,  C09D133/14 ,  H01L21/6835 ,  H01L21/78 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14685 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05≤a/(a+b+c)≤0.3; 0.1≤b/(a+b+c)≤0.6; 0.1≤c/(a+b+c)≤0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

公开(公告)号：US10116947B2

公开(公告)日：2018-10-30

申请号：US14413154

申请日：2013-07-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeong-doo Choi ,  Jae-hyun Kim ,  Jeong-hoon Park

IPC: H04N19/169 ,  H04N19/187 ,  H04N19/46 ,  H04N19/176 ,  H04N21/2343 ,  H04N21/236 ,  H04N19/597 ,  H04N19/70 ,  H04N19/30

Abstract: A multilayer video encoding method includes encoding a multilayer video, generating network adaptive layer (NAL) units for data units included in the encoded multilayer video, and adding scalable extension type information, for a scalable extension of the multilayer video, to a video parameter set (VPS) NAL unit among the NAL units, the VPS NAL unit including VPS information that is information commonly applied to the multilayer video.

公开(公告)号：US09918063B2

公开(公告)日：2018-03-13

申请号：US14522131

申请日：2014-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeong-doo Choi ,  Jae-hyun Kim ,  Jeong-hoon Park

IPC: H04N19/159 ,  H04N19/503 ,  H04N13/00 ,  H04N19/597 ,  H04N19/46 ,  H04N19/105 ,  H04N19/172 ,  H04N19/96 ,  H04N19/136

CPC classification number: H04N13/10 ,  H04N19/105 ,  H04N19/136 ,  H04N19/172 ,  H04N19/46 ,  H04N19/597 ,  H04N19/96

Abstract: Provided are methods and apparatuses for encoding and decoding a multiview video. The method of decoding the multiview video includes obtaining a data unit including encoding information of texture pictures and depth map pictures of a multiview image related to a same point of time, obtaining, from the data unit, view information of pictures that are encoded and are included in the data unit, type information indicating a type of each of the pictures from among the texture pictures and the depth map pictures, and reference flag information indicating whether each of the pictures is previously inter-layer predicted by referring to a texture picture of the same point of time or to a depth map picture of the same point of time, determining an encoding order of the pictures, based on the obtained information, and decoding the texture pictures and depth map pictures based on the determined encoding order.

公开(公告)号：US09881125B2

公开(公告)日：2018-01-30

申请号：US13734217

申请日：2013-01-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hae-kyung Jung ,  Hee-chul Yoon ,  Hyun-taek Lee ,  Yong-je Kim ,  Jae-hyun Kim ,  Myung-jin Eom

IPC: G06F19/26 ,  A61B8/08 ,  A61B8/00

CPC classification number: G06F19/26 ,  A61B8/085 ,  A61B8/0858 ,  A61B8/0866 ,  A61B8/469 ,  A61B8/5223 ,  G06F19/00

Abstract: A method for measuring biometrics of an object includes receiving an image of an object, modeling the object to identify a portion of the object, and measuring biometrics of the object based on a modeling result the object.