公开(公告)号：US09240366B2

公开(公告)日：2016-01-19

申请号：US14168317

申请日：2014-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Gi Jin ,  Ho-Joon Lee ,  Ji-Woong Sue ,  Joo-Hee Jang

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/367 ,  H01L25/065 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L23/481 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/522 ,  H01L23/5225 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0346 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05176 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05552 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06051 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/06517 ,  H01L2224/06519 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/17519 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/014

Abstract: Provided are a semiconductor device, a semiconductor package, and an electronic system. The device includes a substrate having a front side and a back side disposed opposite the front side. An internal circuit is disposed on or near to the front side of the substrate. Signal I/O through-via structures are disposed in the substrate. Back side conductive patterns are disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures. A back side conductive structure is disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures. The back side conductive structure includes parallel supporter portions.

Abstract translation: 提供半导体器件，半导体封装和电子系统。 该装置包括具有与前侧相对设置的前侧和后侧的基板。 内部电路设置在基板的正面上或附近。 信号I / O通孔结构设置在基板中。 背面导电图案设置在基板的背面并电连接到信号I / O通孔结构。 背面导电结构设置在基板的背面并与信号I / O通孔结构隔开。 背面导电结构包括平行支撑部分。