公开(公告)号：US09859175B2

公开(公告)日：2018-01-02

申请号：US15142275

申请日：2016-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiwook Song ,  Bum-Soo Kim ,  Kye Hyun Baek ,  Masayuki Tomoyasu ,  Eunwoo Lee ,  Jong Seo Hong

IPC: H01L21/66 ,  G01R31/26 ,  H01J37/32

CPC classification number: H01L22/10 ,  G05B19/41875 ,  G05B2219/32234 ,  G05B2219/45031 ,  H01J37/3288 ,  H01J37/32972

Abstract: Provided are substrate processing systems and methods of managing the same. The method may include displaying a notification for a preventive maintenance operation on a chamber, performing a maintenance operation on the chamber, performing a first optical test, and evaluating the preventive maintenance operation. The first optical test may include generating a reference plasma reaction, measuring a variation of intensity by wavelength for plasma light emitted from the reference plasma reaction, and calculating an electron density and an electron temperature from a ratio in intensity of the plasma light.

公开(公告)号：US10991825B2

公开(公告)日：2021-04-27

申请号：US16167815

申请日：2018-10-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Kim ,  Jong Chui Park ,  Kye Hyun Baek

IPC: H01L29/76 ,  H01L29/78 ,  H01L29/66 ,  H01L29/08 ,  H01L29/423 ,  H01L29/417 ,  H01L21/8238 ,  H01L27/092

Abstract: A semiconductor device includes a substrate having a plurality of fins protruding therefrom. The plurality of fins includes a plurality of active fins and at least one non-active fin disposed between ones of the plurality of active fins. The device also includes at least one gate electrode crossing at least a portion of the active fins. The device further includes a plurality of source/drain regions disposed on the active fins adjacent the at least one gate electrode and separated from one another by the at least one non-active fin.

公开(公告)号：US20190288114A1

公开(公告)日：2019-09-19

申请号：US16167815

申请日：2018-10-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheol Kim ,  Jong Chul Park ,  Kye Hyun Baek

IPC: H01L29/78 ,  H01L29/66 ,  H01L29/417 ,  H01L29/423 ,  H01L29/08

Abstract: A semiconductor device includes a substrate having a plurality of fins protruding therefrom. The plurality of fins includes a plurality of active fins and at least one non-active fin disposed between ones of the plurality of active fins. The device also includes at least one gate electrode crossing at least a portion of the active fins. The device further includes a plurality of source/drain regions disposed on the active fins adjacent the at least one gate electrode and separated from one another by the at least one non-active fin.

公开(公告)号：US09870900B2

公开(公告)日：2018-01-16

申请号：US14631083

申请日：2015-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kye Hyun Baek ,  Ohyung Kwon ,  Junghyun Cho ,  Haejoong Park

IPC: H01J37/32

CPC classification number: H01J37/32917 ,  H01J37/32807 ,  H01J37/3288

Abstract: Provided are methods and systems for managing semiconductor manufacturing equipment. A method may include preventive maintenance involving steps of disassembling, cleaning, and assembling parts of a chamber. The assembling of the parts may include checking whether the parts are correctly assembled, using reflectance and absorptivity of a high-frequency voltage applied to the parts.

公开(公告)号：US20160035545A1

公开(公告)日：2016-02-04

申请号：US14631083

申请日：2015-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kye Hyun Baek ,  Ohyung Kwon ,  Junghyun Cho ,  Haejoong Park

IPC: H01J37/32

CPC classification number: H01J37/32917 ,  H01J37/32807 ,  H01J37/3288

Abstract: Provided are methods and systems for managing semiconductor manufacturing equipment. A method may include preventive maintenance involving steps of disassembling, cleaning, and assembling parts of a chamber. The assembling of the parts may include checking whether the parts are correctly assembled, using reflectance and absorptivity of a high-frequency voltage applied to the parts.

Abstract translation: 提供了用于管理半导体制造设备的方法和系统。 一种方法可以包括预防性维护，其包括拆卸，清洁和组装室的部件的步骤。 部件的组装可以包括使用施加到部件的高频电压的反射率和吸收率来检查部件是否被正确组装。

公开(公告)号：US09912258B2

公开(公告)日：2018-03-06

申请号：US14842936

申请日：2015-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haejoong Park ,  Hongmyoung Kim ,  Kye Hyun Baek ,  Sangkyu Park

IPC: H01T23/00 ,  H02N13/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: H02N13/00 ,  H01L21/67109 ,  H01L21/6831

Abstract: An electrostatic chuck assembly, including an electrostatic chuck on which a substrate is loaded; a channel that provides a flow passage for coolant in the electrostatic chuck, the channel having a first opening at a first end corresponding to a center of the substrate and a second opening at a second end corresponding to an edge of the substrate; and a valve box to control a flow direction of the coolant in the channel, the valve box including a first supply valve to control an introduction of the coolant into the first opening; a first return valve to control a drainage of the coolant from the second opening; a second supply valve to control an introduction of the coolant into the second opening; and a second return valve to control a drainage of the coolant from the first opening.