公开(公告)号：US09378931B2

公开(公告)日：2016-06-28

申请号：US14796188

申请日：2015-07-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyung Kwon ,  Namjun Kang ,  Doug-Yong Sung ,  Jung-hyun Cho

IPC: H01J7/24 ,  H01J37/32 ,  H05B31/26

CPC classification number: H01J37/32183 ,  H01J7/24 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32926 ,  H01J2237/327 ,  H01J2237/334 ,  H05B31/26

Abstract: A pulse plasma apparatus includes a process chamber, source RF generator configured to supply first and second level RF pulse power having first and second duty cycles to an upper electrode of the process chamber, a reflected power indicator configured to indicate reflection RF power, a first matching network, and a controller. The first matching network is configured to match an impedance of the process chamber with an impedance of the source RF generator as a first or second matching capacitance value, respectively when the first level RF pulse power or second level RF pulse power is supplied, respectively. The controller is configured to calculate a third matching capacitance value based on the first and second matching capacitance values and a ratio of the first and second duty cycles, provide the third matching capacitance values to the first matching network, and control the source RF generator and first matching network.

Abstract translation: 脉冲等离子体装置包括处理室，源RF发生器，被配置为向处理室的上电极提供具有第一和第二占空比的第一和第二电平的RF脉冲功率，被配置为指示反射RF功率的反射功率指示器，第一 匹配网络和控制器。 当分别提供第一级RF脉冲功率或第二级RF脉冲功率时，第一匹配网络被配置为将处理室的阻抗与源RF发生器的阻抗分别匹配为第一或第二匹配电容值。 控制器被配置为基于第一和第二匹配电容值和第一和第二占空比的比率来计算第三匹配电容值，向第一匹配网络提供第三匹配电容值，并且控制源RF发生器和 第一匹配网络。

公开(公告)号：US20160035545A1

公开(公告)日：2016-02-04

申请号：US14631083

申请日：2015-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kye Hyun Baek ,  Ohyung Kwon ,  Junghyun Cho ,  Haejoong Park

IPC: H01J37/32

CPC classification number: H01J37/32917 ,  H01J37/32807 ,  H01J37/3288

Abstract: Provided are methods and systems for managing semiconductor manufacturing equipment. A method may include preventive maintenance involving steps of disassembling, cleaning, and assembling parts of a chamber. The assembling of the parts may include checking whether the parts are correctly assembled, using reflectance and absorptivity of a high-frequency voltage applied to the parts.

Abstract translation: 提供了用于管理半导体制造设备的方法和系统。 一种方法可以包括预防性维护，其包括拆卸，清洁和组装室的部件的步骤。 部件的组装可以包括使用施加到部件的高频电压的反射率和吸收率来检查部件是否被正确组装。

公开(公告)号：US09870900B2

公开(公告)日：2018-01-16

申请号：US14631083

申请日：2015-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kye Hyun Baek ,  Ohyung Kwon ,  Junghyun Cho ,  Haejoong Park

IPC: H01J37/32

CPC classification number: H01J37/32917 ,  H01J37/32807 ,  H01J37/3288

Abstract: Provided are methods and systems for managing semiconductor manufacturing equipment. A method may include preventive maintenance involving steps of disassembling, cleaning, and assembling parts of a chamber. The assembling of the parts may include checking whether the parts are correctly assembled, using reflectance and absorptivity of a high-frequency voltage applied to the parts.