公开(公告)号：US20220303450A1

公开(公告)日：2022-09-22

申请号：US17835209

申请日：2022-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun LEE

IPC: H04N5/232

Abstract: According to certain embodiments, an electronic device comprises: a communication module; and a processor operatively connected to the communication module and configured to transmit and receive data to and from external electronic devices through the communication module, and wherein the processor is configured to: receive a preview source image from a first external electronic device; performing a first image processing on the preview source image, thereby resulting in a preview image; transmitting the preview image to a second external electronic device and a third external electronic device; receive a request for second image processing from the second external electronic device; transmit a first modified preview image obtained by performing the second image processing on the preview image to the second external electronic device in response to the request; receive a request for third image processing form the third external electronic device; transmit a second modified preview image obtained by performing the third image processing on the preview image to the third external electronic device.

公开(公告)号：US20190272619A1

公开(公告)日：2019-09-05

申请号：US16292981

申请日：2019-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaewhan LIM ,  Myunghun LEE

IPC: G06T3/40 ,  H04N5/247 ,  G06K9/00 ,  G06T7/55 ,  H04N5/232

Abstract: An electronic device is provided. The electronic device includes image sensors configured to include a plurality of pairs of image sensors, each pair of image sensors facing in substantially the same direction and generating image data and each of which has a different field of view, a processor configured to be operatively connected to the image sensors, and a memory configured to be operatively connected to the processor. The memory stores instructions, when executed, causing the processor to receive at least one set of image data from the pairs of image sensors, recognize at least one object from the image data, determine depth information of the at least one object, and stitch the at least one set of image data using the at least one object and the depth information.

公开(公告)号：US20240224522A1

公开(公告)日：2024-07-04

申请号：US18475070

申请日：2023-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Homoon SHIN ,  Jonghoon PARK ,  Juyoung YANG ,  Jungseok HWANG ,  Sunghoon KIM ,  Pansuk KWAK ,  Ahreum KIM ,  Myunghun LEE ,  Changyeon YU ,  Mookyu BAE ,  Sungun LEE

IPC: H10B43/27 ,  H10B41/27 ,  H10B41/41 ,  H10B43/40

CPC classification number: H10B43/27 ,  H10B41/27 ,  H10B41/41 ,  H10B43/40

Abstract: A non-volatile memory device may include a memory cell region and a peripheral circuit region positioned below the memory cell region in the vertical direction. The memory cell region may include a plurality of channel structures extending in a vertical direction, a first metal layer over the plurality of channel structures, a first capping layer over the first metal layer, a first upper insulation layer over the first capping layer, and at least one first dummy contact penetrating through the first capping layer. The first metal layer may include a plurality of bit lines and at least one dummy bit line. The bit lines may be respectively connected to the plurality of channel structures. The at least one first dummy contact may be on the at least one dummy bit line and may provide a migration path for hydrogen ions in the first upper insulation layer.

公开(公告)号：US20240292634A1

公开(公告)日：2024-08-29

申请号：US18499446

申请日：2023-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun LEE ,  Homoon SHIN

IPC: H10B80/00 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H10B80/00 ,  H01L24/08 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/08145 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/1431 ,  H01L2924/14511

Abstract: A memory device may include a first structure and a second structure bonded to the first structure. The first structure may have a plurality of planes and a pad part between two planes adjacent to each other among the plurality of planes. Each of the plurality of planes may include a memory cell. The second structure may include a peripheral circuit. The plurality of planes may be minimum units in which operations are independently performed and may be in an n×m array (n and m being integers of 2 or larger). The pad part may be between the rows and/or between the columns of the n×m array.

公开(公告)号：US20240233824A1

公开(公告)日：2024-07-11

申请号：US18614908

申请日：2024-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghun LEE ,  Sangwan NAM ,  Taemin OK

IPC: G11C16/04 ,  G11C16/26 ,  H01L23/528 ,  H10B41/27 ,  H10B41/40 ,  H10B41/50 ,  H10B43/10 ,  H10B43/20 ,  H10B43/27 ,  H10B43/40 ,  H10B43/50

CPC classification number: G11C16/0483 ,  G11C16/26 ,  H01L23/528 ,  H10B41/27 ,  H10B41/40 ,  H10B41/50 ,  H10B43/10 ,  H10B43/20 ,  H10B43/27 ,  H10B43/40 ,  H10B43/50

Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.