Assembly for measuring a trench depth parameter of a workpiece
    1.
    发明授权
    Assembly for measuring a trench depth parameter of a workpiece 失效
    用于测量工件的沟槽深度参数的组件

    公开(公告)号:US5691540A

    公开(公告)日:1997-11-25

    申请号:US643090

    申请日:1996-04-30

    IPC分类号: G01B11/22

    CPC分类号: G01B11/22

    摘要: An assembly for measuring a trench depth parameter of a workpiece is disclosed. The assembly has an ultra-violet radiation source; a split fiber bundle having a first branch for propagating the ultra-violet radiation from the radiation source to a lens, and a second branch; a lens for focusing the UV radiation to the workpiece and refocusing an ultra-violet interference signal to the second branch; and a detector responsive to the ultra-violet interference signal received through the second branch. The detector transforms the ultra-violet interference signal to an electrical signal which is a measure of a trench depth of the workpiece. The ultra-violet interference signal is developed when ultra-violet radiation propagates through the workpiece and reflects from its base region to thereby interfere with ultra-violet radiation that is directly reflected by a workpiece surface which is different from the base region.

    摘要翻译: 公开了一种用于测量工件的沟槽深度参数的组件。 该组件具有紫外辐射源; 具有用于将紫外辐射从辐射源传播到透镜的第一分支的分裂光纤束和第二分支; 用于将UV辐射聚焦到工件并将紫外干涉信号重新聚焦到第二分支的透镜; 以及响应于通过第二分支接收的紫外干涉信号的检测器。 检测器将紫外线干涉信号转换成电信号,该电信号是工件的沟槽深度的量度。 当紫外线辐射传播通过工件并从其底部区域反射时,紫外线干涉信号被开发,从而干扰由与基底区域不同的工件表面直接反射的紫外辐射。

    Pattern measurement apparatus and pattern measurement method
    2.
    发明授权
    Pattern measurement apparatus and pattern measurement method 有权
    图案测量装置和图案测量方法

    公开(公告)号:US08144338B2

    公开(公告)日:2012-03-27

    申请号:US12546587

    申请日:2009-08-24

    申请人: Tadashi Mitsui

    发明人: Tadashi Mitsui

    IPC分类号: G01B11/24

    CPC分类号: G01B11/24 G01B2210/56

    摘要: A pattern measurement method includes: acquiring sectional shapes of a first pattern corresponding to process parameters, respectively; using the acquired sectional shapes to calculate predicted spectral waveforms which would be obtained when light is applied to the first pattern, and adding information on the corresponding process parameters to the calculated predicted spectral waveforms, respectively, to form a waveform library; setting a process parameter to obtain a desired shape, and acquiring an actual spectral waveform of a second pattern actually created from the first pattern using the set process parameter; performing waveform matching between the actual spectral waveform and the predicted spectral waveforms to acquire matching scores for respective waveform matching, and calculating an optimum process parameter providing the maximum matching score; generating an optimum pattern sectional shape corresponding to the optimum process parameter to measure the optimum pattern sectional shape.

    摘要翻译: 模式测量方法包括:分别获取对应于过程参数的第一模式的截面形状; 使用所获取的截面形状来计算当将光施加到第一图案时将获得的预测光谱波形,以及将相应的处理参数的信息分别加到计算的预测光谱波形上以形成波形库; 设置处理参数以获得期望的形状,并且使用所设置的处理参数获取实际从第一图案创建的第二图案的实际光谱波形; 执行实际光谱波形与预测光谱波形之间的波形匹配,以获得相应波形匹配的匹配分数,以及计算提供最大匹配分数的最佳处理参数; 产生对应于最佳工艺参数的最佳图案截面形状,以测量最佳图案截面形状。

    Pattern evaluation method, computer-readable medium, and semiconductor device manufacturing method
    3.
    发明授权
    Pattern evaluation method, computer-readable medium, and semiconductor device manufacturing method 有权
    模式评估方法,计算机可读介质和半导体器件制造方法

    公开(公告)号:US08041105B2

    公开(公告)日:2011-10-18

    申请号:US11896043

    申请日:2007-08-29

    申请人: Tadashi Mitsui

    发明人: Tadashi Mitsui

    IPC分类号: G06K9/00 H03C3/00 H03D3/00

    摘要: A pattern evaluation method includes: acquiring a plurality of examination images obtained in regard to an evaluation target pattern, at least one of the plurality of examination images being different from the other examination images; detecting all edges of the evaluation target pattern in each of the examination images; executing alignment of the evaluation target pattern in the respective examination images with a sub-pixel accuracy based on the detected edges; superimposing the aligned pattern edges to generate a single combined edge; measuring the combined edge; and evaluating the evaluation target pattern based on a result of the measurement.

    摘要翻译: 图案评估方法包括:获取关于评估对象图案获得的多个检查图像,所述多个检查图像中的至少一个与其他检查图像不同; 检测每个检查图像中的评估对象图案的所有边缘; 基于检测到的边缘,以各个检测图像的子像素精度执行评价对象图案的对准; 叠加对齐的图案边缘以产生单个组合边缘; 测量组合边缘; 以及基于测量结果评估评估目标模式。

    Pattern matching method, program and semiconductor device manufacturing method
    4.
    发明授权
    Pattern matching method, program and semiconductor device manufacturing method 有权
    模式匹配方法,程序和半导体器件制造方法

    公开(公告)号:US08036445B2

    公开(公告)日:2011-10-11

    申请号:US11255024

    申请日:2005-10-21

    IPC分类号: G06K9/00

    摘要: A pattern matching method includes: detecting an edge of a pattern in a pattern image obtained by imaging the pattern; segmenting the detected pattern edge to generate a first segment set consisting of first segments; segmenting a pattern edge on reference data which serves as a reference for evaluating the pattern to generate a second segment set consisting of second segments; combining any of the segments in the first segment set with any of the segments in the second segment set to define a segment pair consisting of first and second segments; calculating the compatibility coefficient between every two segment pairs in the defined segment pairs; defining new segment pairs by narrowing down the defined segment pairs by calculating local consistencies of the defined segment pairs on the basis of the calculated compatibility coefficients and by excluding segment pairs having lower local consistencies; determining an optimum segment pair by repeating the calculating the compatibility coefficient and the defining new segment pairs by narrowing down the segment pairs; calculating a feature quantity of a shift vector that links the first and second segments making up the optimum segment pair; and performing position matching between the pattern image and the reference data on the basis of the calculated feature quantity of the shift vector.

    摘要翻译: 模式匹配方法包括:通过对图案进行成像而获得的图案图像中的图案的边缘进行检测; 分割检测到的图案边缘以产生由第一段组成的第一段组; 在作为用于评估图案的基准的参考数据上分割图形边缘以生成由第二段组成的第二段集合; 将第一段组中的任何段与第二段集合中的任何段组合以限定由第一和第二段组成的段对; 计算定义的段对中每两个段对之间的兼容性系数; 通过基于所计算的兼容性系数计算定义的段对的局部一致性并排除具有较低本地一致性的段对来缩小定义的段对,来定义新的段对; 通过重复计算所述兼容性系数和通过缩小所述片段对来限定新的片段对来确定最佳片段对; 计算链接构成最佳段对的第一和第二段的移位向量的特征量; 并且基于所计算的移位矢量的特征量,在图案图像和参考数据之间执行位置匹配。

    Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the same
    5.
    发明授权
    Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the same 有权
    图案形状评价方法和利用该图案形状评价装置的图案形状评价装置

    公开(公告)号:US08019149B2

    公开(公告)日:2011-09-13

    申请号:US12562173

    申请日:2009-09-18

    IPC分类号: G06K9/00 G01N21/86

    CPC分类号: G06K9/342 G06K9/48

    摘要: A pattern shape evaluation method for deciding whether a pair of patterns are disconnected or connected. The method includes extracting a plurality of pattern contour points that make up a contour of a pattern in a measurement region, and creating two pattern contour point sequences based on the plurality of pattern contour points. Each of the two pattern contour point sequences includes a set of the pattern contour points. In the pattern contour point sequence, each of distances between neighboring pattern contour points is equal to or smaller than a predetermined value. The method includes calculating an angle between a line passing through two of the pattern contour points which provide a shortest distance between the two pattern contour point sequences and a reference line arbitrarily defined with respect to the measurement region. The method further includes deciding whether the patterns are disconnected or connected, based on the angle.

    摘要翻译: 用于判断一对图案是断开连接还是连接的图案形状评估方法。 该方法包括提取构成测量区域中的图案轮廓的多个图案轮廓点,并且基于多个图案轮廓点创建两个图案轮廓点序列。 两个图案轮廓点序列中的每一个包括一组图案轮廓点。 在图案轮廓点序列中,相邻图案轮廓点之间的距离中的每一个等于或小于预定值。 该方法包括计算通过提供两个图案轮廓点序列之间的最短距离的两个图案轮廓点之间的线与相对于测量区域任意定义的参考线之间的角度。 该方法还包括基于角度来决定图案是断开还是连接。

    Pattern shape evaluation apparatus, pattern shape evaluation method, method of manufacturing semiconductor device, and program
    7.
    发明授权
    Pattern shape evaluation apparatus, pattern shape evaluation method, method of manufacturing semiconductor device, and program 有权
    图案形状评价装置,图案形状评价方法,半导体装置的制造方法以及程序

    公开(公告)号:US07787687B2

    公开(公告)日:2010-08-31

    申请号:US11589057

    申请日:2006-10-30

    IPC分类号: G06K9/00

    摘要: A pattern shape evaluation method includes acquiring design data accompanied by an evaluation area in which information on a particular evaluation area within a pattern of a semiconductor device is added to the design data for the pattern, acquiring an image of the pattern, generating edge data for the pattern from the image of the pattern, aligning the design data accompanied by the evaluation area with the edge data and evaluating the shape of the pattern within the evaluation area after the alignment.

    摘要翻译: 图案形状评估方法包括获取伴随有评估区域的设计数据,其中将关于半导体器件的图案内的特定评估区域的信息添加到图案的设计数据中,获取图案的图像,生成边缘数据, 来自图案的图案的图案,将伴随评估区域的设计数据与边缘数据对齐,并且在对准之后评估评估区域内的图案的形状。

    Pattern evaluation method, pattern matching method and computer readable medium
    8.
    发明申请
    Pattern evaluation method, pattern matching method and computer readable medium 失效
    模式评估方法,模式匹配方法和计算机可读介质

    公开(公告)号:US20100158389A1

    公开(公告)日:2010-06-24

    申请号:US12659294

    申请日:2010-03-03

    申请人: Tadashi Mitsui

    发明人: Tadashi Mitsui

    IPC分类号: G06K9/48

    摘要: A pattern evaluation method includes: generating first array data from edge data on a pattern to be evaluated, the edge data on the pattern to be evaluated being shape data including edge points of the pattern to be evaluated; generating second array data from edge data on a reference pattern, the edge data on the reference pattern including edge points of the reference pattern which serves as an inspection standard of the pattern to be evaluated; subjecting each component of the second array data to array conversion processing, the array conversion processing being designed to convert a value of the component of the second array data into a function value of a value of a distance from that component to the edge point closest thereto, thereby generating third array data; executing arithmetic processing between the first array data and the third array data to generate fourth array data; and using a component of the fourth array data to calculate a numerical value representative of an relation between the pattern to be evaluated and the reference pattern.

    摘要翻译: 图案评估方法包括:从要评估的图案上的边缘数据生成第一阵列数据,待评估的图案上的边缘数据是包括要评估的图案的边缘点的形状数据; 在参考图案上从边缘数据生成第二阵列数据,参考图案上的边缘数据包括用作待评估图案的检查标准的参考图案的边缘点; 对所述第二阵列数据的每个分量进行阵列转换处理,所述阵列转换处理被设计为将所述第二阵列数据的分量的值转换为距离所述分量至所述边缘点的距离的值的函数值 从而产生第三阵列数据; 执行第一阵列数据和第三阵列数据之间的算术处理以产生第四阵列数据; 以及使用第四阵列数据的分量来计算表示要评估的图案与参考图案之间的关系的数值。

    Method and apparatus for measuring dimensions of a feature of a specimen
    9.
    发明授权
    Method and apparatus for measuring dimensions of a feature of a specimen 失效
    用于测量样本特征尺寸的方法和装置

    公开(公告)号:US06278114B1

    公开(公告)日:2001-08-21

    申请号:US09184074

    申请日:1998-11-02

    申请人: Tadashi Mitsui

    发明人: Tadashi Mitsui

    IPC分类号: H01J3726

    CPC分类号: H01J37/28 H01J2237/2814

    摘要: An electron microscope for measuring a dimension of a feature of a specimen includes a focusing lens for focusing an electron beam onto the specimen and a supplying circuit for supplying an exciting current supplied to the focusing lens. A control circuit controls the supplying circuit to vary the exciting current which is supplied to the focusing lens and obtains dimension data of a feature of the specimen at each of the exciting currents which is supplied to the focusing lens. An actual dimension of the feature is determined based on the obtained dimension data. Further, a profile of the feature may be determined based on the changes observed in the dimension data.

    摘要翻译: 用于测量样本特征尺寸的电子显微镜包括:聚焦透镜,用于将电子束聚焦到样本上;以及供应电路,用于提供供给聚焦透镜的激励电流。 控制电路控制供电电路来改变提供给聚焦透镜的激励电流,并且在提供给聚焦透镜的每个激励电流处获得样品特征的尺寸数据。 基于获得的尺寸数据确定特征的实际尺寸。 此外,可以基于在尺寸数据中观察到的变化来确定特征的轮廓。

    Handling apparatus for transferring a semiconductor wafer or LCD
    10.
    发明授权
    Handling apparatus for transferring a semiconductor wafer or LCD 失效
    用于传送半导体晶片或LCD的处理装置

    公开(公告)号:US5049029A

    公开(公告)日:1991-09-17

    申请号:US506537

    申请日:1990-04-09

    摘要: A handling apparatus includes a base member having a rotating shaft, of a multijoint arm having one end portion thereof connected to the rotating shaft, a holder mounted at the free end portion of the arm, for holding a wafer, a stepping motor for circling the holder together with the arm about the rotating shaft, and another stepping motor for pivoting the arm joints. The multijoint arm is constituted by a plurality of parallel crank mechanisms arranged on corresponding planes in parallel with the circulating plane. One of the links constituting the first-stage parallel crank mechanism is fixed on the base member. During nonuse of the apparatus, the respective parallel crank mechanism overlap each other on the base member. Pulleys are mounted on joints of the arm, and a wire is wrapped around the pulleys. When at least one of the pulleys is pivoted, the parallel crank mechanisms are displaced, thereby extending or retracting the arm.

    摘要翻译: 一种处理装置,包括:具有旋转轴的基部构件,多个连接臂的一端部连接到旋转轴;保持件,其安装在臂的自由端部,用于保持晶片;步进电机, 与手臂围绕旋转轴保持架,以及用于使臂关节枢转的另一个步进电机。 多点臂由与平行于平面的相应平面配置的多个平行曲柄机构构成。 构成第一级平行曲柄机构的连杆之一固定在基座部件上。 在不使用设备的过程中,相应的平行曲柄机构在基座构件上彼此重叠。 皮带轮安装在手臂的接头上,线圈缠绕在皮带轮上。 当至少一个滑轮枢转时,平行的曲柄机构移位,从而使臂伸出或缩回。