公开(公告)号：US20050195110A1

公开(公告)日：2005-09-08

申请号：US10795781

申请日：2004-03-08

申请人： Shengli Lin ,  Chunfei Ye ,  Nilesh Shah

发明人： Shengli Lin ,  Chunfei Ye ,  Nilesh Shah

IPC分类号： H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q1/38 ,  H01Q9/0414

摘要： A multi-band antenna comprises a first conductive layer having one or more parasitic patches, a second conductive layer having a plurality of radiating patches, and a third conductive layer having a ground patch. The first, second and third conductive layers may be separated by first and second substrate layers. The second conductive layer may comprise a first radiating patch having dimensions selected to radiate signals within a first frequency spectrum and second radiating patches having dimensions selected to radiate signals within a second frequency spectrum. In wireless local area network (WLAN) embodiments, the first frequency spectrum may comprise a frequency band ranging from approximately 5.1 to 5.9 GHz, and the second frequency spectrum may comprise frequency bands ranging from approximately 2.4 to 2.5 GHz.

摘要翻译： 多频带天线包括具有一个或多个寄生片的第一导电层，具有多个辐射片的第二导电层和具有接地片的第三导电层。 第一，第二和第三导电层可以由第一和第二衬底层分离。 第二导电层可以包括第一辐射贴片，其具有被选择用于辐射第一频谱内的信号的尺寸，以及具有被选择用于辐射第二频谱内的信号的尺寸的第二辐射贴片。 在无线局域网（WLAN）实施例中，第一频谱可以包括范围从大约5.1到5.9GHz的频带，并且第二频谱可以包括范围从大约2.4到2.5GHz的频带。

公开(公告)号：US06982672B2

公开(公告)日：2006-01-03

申请号：US10795781

申请日：2004-03-08

申请人： Shengli Lin ,  Chunfei Ye ,  Nilesh N. Shah

发明人： Shengli Lin ,  Chunfei Ye ,  Nilesh N. Shah

IPC分类号： H01Q1/38

CPC分类号： H01Q1/38 ,  H01Q9/0414

摘要： A multi-band antenna comprises a first conductive layer having one or more parasitic patches, a second conductive layer having a plurality of radiating patches, and a third conductive layer having a ground patch. The first, second and third conductive layers may be separated by first and second substrate layers. The second conductive layer may comprise a first radiating patch having dimensions selected to radiate signals within a first frequency spectrum and second radiating patches having dimensions selected to radiate signals within a second frequency spectrum. In wireless local area network (WLAN) embodiments, the first frequency spectrum may comprise a frequency band ranging from approximately 5.1 to 5.9 GHz, and the second frequency spectrum may comprise frequency bands ranging from approximately 2.4 to 2.5 GHz.

摘要翻译： 多频带天线包括具有一个或多个寄生片的第一导电层，具有多个辐射片的第二导电层和具有接地片的第三导电层。 第一，第二和第三导电层可以由第一和第二衬底层分离。 第二导电层可以包括第一辐射贴片，其具有被选择用于辐射第一频谱内的信号的尺寸，以及具有被选择用于辐射第二频谱内的信号的尺寸的第二辐射贴片。 在无线局域网（WLAN）实施例中，第一频谱可以包括范围从大约5.1到5.9GHz的频带，并且第二频谱可以包括范围从大约2.4到2.5GHz的频带。

公开(公告)号：US08487195B2

公开(公告)日：2013-07-16

申请号：US12717570

申请日：2010-03-04

申请人： Shengli Lin

发明人： Shengli Lin

IPC分类号： H05K1/11

CPC分类号： H05K1/162 ,  H05K1/0222 ,  H05K1/0251 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09781

摘要： A via structure is disclosed to pass electronic signals from a first conductive pathway formed on a first outermost substrate of a multi-layer PCB to a second conductive pathway formed on a second outermost substrate of the multi-layer PCB. The via structure allows the electronic signals to pass from the first outermost substrate through one or more inner substrates to the second outermost substrate. The one or more inner substrates include one or more closed geometric structures to enclose the via structure.

摘要翻译： 公开了一种通孔结构，用于将形成在多层PCB的第一最外层衬底上的第一导电通路的电子信号传递到形成在多层PCB的第二最外层衬底上的第二导电通路。 通孔结构允许电子信号从第一最外面的衬底通过一个或多个内部衬底到第二最外面的衬底。 一个或多个内部基板包括一个或多个闭合的几何结构以封闭通孔结构。

公开(公告)号：US09706642B2

公开(公告)日：2017-07-11

申请号：US12869910

申请日：2010-08-27

申请人： Shengli Lin

发明人： Shengli Lin

IPC分类号： H05K1/02 ,  H01P3/04 ,  H01P3/02 ,  H05K1/11

CPC分类号： H05K1/0253 ,  H01P3/02 ,  H01P3/04 ,  H05K1/0216 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0245 ,  H05K1/111 ,  H05K2201/10636 ,  Y02P70/611

摘要： Embodiments of the present invention are directed to providing a time delay to a shortened trace in a differential microstrip trace pair. By adding back metal to a ground plane associated with a DC blocking capacitor, a time delay can be added to the shortened trace. The cutout associated with the longer trace remains unaltered. In a further embodiment, both cutouts can be modified with the addition of metal, with the cutout associated with the shorter trace receiving more metal than the other cutout. In a further embodiment of the present invention, a cutout associated with a connector can be modified to add back metal in the cutout. The cutout associated with the shorter trace is modified while the other cutout is left unchanged.

公开(公告)号：US08669830B2

公开(公告)日：2014-03-11

申请号：US13006643

申请日：2011-01-14

申请人： Shengli Lin

发明人： Shengli Lin

IPC分类号： H03H7/38

CPC分类号： H05K1/025 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K1/0253 ,  H05K2201/09727 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane.

摘要翻译： 本发明的实施例涉及在穿过印刷电路板或封装设计中的另一层中的空隙时提供增加的迹线宽度。 通过增加迹线宽度或者替代地增加电容，可以减少由空隙引起的劣化。 这种方法适用于微带线，带状线以及使用参考平面的其他传输线。 空隙可以是与通孔相关联的止痛剂的结果，或者在其它均匀参考平面中的任何其它破坏的结果。