公开(公告)号：US20120075816A1

公开(公告)日：2012-03-29

申请号：US13242202

申请日：2011-09-23

申请人： Shigeki MASHIMO ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

发明人： Shigeki MASHIMO ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H05K7/00 ,  H05K3/00

CPC分类号： H02M7/537 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20753 ,  H05K1/0203 ,  H05K1/181 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.

摘要翻译： 在本发明的混合集成电路装置中，引线固定在电路板的上表面上。 引线包括岛部分，斜坡部分和引线部分。 晶体管和二极管安装在岛部的上表面上。 设置在晶体管和二极管的上表面上的电极通过细金属线连接到接合部分。 引线的接合部分设置在比岛部更高的位置。 因此，与接合部连接的细金属线彼此分离。