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    LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE
    1.
    发明申请
    LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE 有权
    用于组装半导体器件的引线框架

    公开(公告)号：US20130234306A1

    公开(公告)日：2013-09-12

    申请号：US13605990

    申请日：2012-09-06

    申请人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

    发明人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

    IPC分类号： H01L23/495 ,  H01L21/60

    CPC分类号： H01L23/49558 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.

    摘要翻译： 引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。 至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘 。 内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。 内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

    Lead frame for assembling semiconductor device
    2.
    发明授权
    Lead frame for assembling semiconductor device 有权
    用于组装半导体器件的引线框架

    公开(公告)号：US08643156B2

    公开(公告)日：2014-02-04

    申请号：US13605990

    申请日：2012-09-06

    申请人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

    发明人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

    IPC分类号： H01L23/495 ,  H01L21/60

    CPC分类号： H01L23/49558 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.

    摘要翻译： 引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。 至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘 。 内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。 内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

    Semiconductor device with staggered leads
    3.
    发明授权
    Semiconductor device with staggered leads 有权
    具有交错引线的半导体器件

    公开(公告)号：US08643153B2

    公开(公告)日：2014-02-04

    申请号：US13461801

    申请日：2012-05-02

    申请人： Shunan Qiu ,  Zhigang Bai ,  Xuesong Xu ,  Beiyue Yan ,  You Ge

    发明人： Shunan Qiu ,  Zhigang Bai ,  Xuesong Xu ,  Beiyue Yan ,  You Ge

    IPC分类号： H01L23/495 ,  H01L23/48

    CPC分类号： H01L23/49555 ,  H01L21/4842 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch.

    摘要翻译： 一种用于组装半导体器件的方法包括提供具有天然平面的引线框架和具有天然引线间距的多个引线。 该过程包括修剪和形成多个引线的第一子集以提供第一行引线。 该过程包括修剪和形成多个引线的第二子集以提供第二排引线。 引线的至少一个子集以相对于天平平面的钝角形成，使得与引线的第一或第二子集相关联的引线间距大于原始引线间距。