Stanzling insbesondere zum dauerhaften Verschließen von Löchern

    公开(公告)号:US20220025220A1

    公开(公告)日:2022-01-27

    申请号:US17380432

    申请日:2021-07-20

    Applicant: TESA SE

    Abstract: The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.

    PUNCHED ARTICLE, IN PARTICULAR FOR PERMANENTLY CLOSING HOLES

    公开(公告)号:US20250083410A1

    公开(公告)日:2025-03-13

    申请号:US18292536

    申请日:2022-07-21

    Applicant: TESA SE

    Abstract: Punched articles permanently close holes in metal sheets or in plastic parts and comprise a carrier made of a composite laminate composed of at least one first layer formed by a needle-punched nonwoven and containing polyacrylonitrile fibers, optionally at least one second layer formed by a first pressure-sensitive adhesive compound, at least one third layer formed by a glass woven fabric or glass laid fabric with a weight per unit of area of 30 to 200 g/m2, optionally at least one fourth layer formed by a second pressure-sensitive adhesive compound, at least one fifth layer formed by a metal layer, and at least one sixth layer formed by an acrylate-based pressure-sensitive adhesive compound with a weight per unit area of 300 to 1800 g/m2.

    DIECUT ESPECIALLY FOR PERMANENTLY CLOSING HOLES

    公开(公告)号:US20220105708A1

    公开(公告)日:2022-04-07

    申请号:US17449177

    申请日:2021-09-28

    Applicant: tesa SE

    Abstract: Diecuts and methods for closing of holes in metal sheets or in plastics parts are disclosed. The diecuts have a carrier composed of an assembly that comprises a metallic first layer having a thickness of 10 to 40 μm, a second layer of a woven or laid glass fabric having a basis weight of 30 to 200 g/m2, an optional first adhesive third layer, an unexpanded expandable graphite fourth layer having a thickness of at least 0.2 to 3.0 mm, and a second adhesive fifth layer. The expandable graphite being present in the fourth layer to an extent of at least 80 wt % and fifth layer being formed by an adhesive having a basis weight of 300 to 1800 g/m2 and/or a thickness of 400 to 1800 μm.

    PLASMA TREATMENT FOR MULTILAYER ADHESIVE BONDING ELEMENT

    公开(公告)号:US20180112107A1

    公开(公告)日:2018-04-26

    申请号:US15783527

    申请日:2017-10-13

    Applicant: TESA SE

    Abstract: Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).

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