公开(公告)号：US20250080920A1

公开(公告)日：2025-03-06

申请号：US18240668

申请日：2023-08-31

Applicant: Texas Instruments Incorporated

Inventor： Bichoy Bahr ,  Udit Rawat ,  Mohit Chawla ,  Yogesh Ramadass

IPC: H04R17/10 ,  H04R3/04 ,  H04R17/02 ,  H04R29/00 ,  H10N30/50 ,  H10N30/87

Abstract: In one example, an audio device includes a substrate, a first piezoelectric flap, a second piezoelectric flap, a transmit circuit, a first receive circuit, a switch circuit, and a second receive circuit. The substrate has an opening. The first piezoelectric flap has a first end on the substrate and extending over the opening, the first piezoelectric flap having first and second terminals. The second piezoelectric flap has a second end on the substrate and extending over the opening, the second piezoelectric flap spaced from the first piezoelectric flap, the second piezoelectric flap having third and fourth terminals. The transmit circuit has driver outputs. The first receive circuit has first receiver inputs. The switch circuit coupled to the driver outputs and the first receiver inputs, and the first and second terminals. The second receive circuit has second receiver inputs coupled to the third and fourth terminals.

公开(公告)号：US20250080918A1

公开(公告)日：2025-03-06

申请号：US18240676

申请日：2023-08-31

Applicant: Texas Instruments Incorporated

Inventor： Bichoy Bahr ,  Udit Rawat ,  Mohit Chawla ,  Yogesh Ramadass

IPC: H04R17/02 ,  H04R17/10 ,  H10N30/063 ,  H10N30/086 ,  H10N30/20 ,  H10N30/87

Abstract: In one example, an apparatus comprises a substrate, a first piezoelectric flap, and a second piezoelectric flap. The substrate has an opening. The first piezoelectric flap has a first end on the substrate and has a first portion extending over a first part of the opening, the first piezoelectric flap including first electrodes, in which the first electrodes extend no more than half of a first length of the first portion. The second piezoelectric flap has a second end on the substrate and has a second portion extending over a second part of the opening, the second piezoelectric flap including second electrodes, in which the second electrodes extend no more than half of a second length of the second portion.

公开(公告)号：US20240422480A1

公开(公告)日：2024-12-19

申请号：US18528673

申请日：2023-12-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy Bahr

IPC: H04R17/02 ,  H04R17/00 ,  H04R31/00

Abstract: A transducer device is described that includes a substrate having an opening, and a cantilever device having a first end on the substrate and a second end suspended over the opening. In at least one example, the cantilever device includes a first piezoelectric layer having a first surface, the first piezoelectric layer having a first poling direction. The cantilever device further includes a second piezoelectric layer having a second surface opposing the first surface, the second piezoelectric layer having a second poling direction, the second poling direction being different from the first poling direction. The cantilever device further includes a first electrode on the first surface, and a second electrode on the second surface.

公开(公告)号：US12095471B2

公开(公告)日：2024-09-17

申请号：US17936505

申请日：2022-09-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy Bahr ,  Yogesh Ramadass

IPC: H03L7/099 ,  H03B5/32 ,  H03H9/02 ,  H03K3/0231 ,  H03L7/085 ,  H03M1/46

CPC classification number: H03L7/0995 ,  H03B5/326 ,  H03H9/02244 ,  H03K3/0231 ,  H03L7/085 ,  H03M1/46

Abstract: A clock circuit includes a voltage-controlled oscillator (VCO) having a control input and a first clock output. The clock circuit includes a frequency-locked loop (FLL) having an FLL input and a control output, the control output coupled to the control input. A microelectromechanical system (MEMS) resonator-based oscillator has a second clock output. A multiplexer has a first multiplexer input, a second multiplexer input, a selection input, and a multiplexer output. The first multiplexer input is coupled to the first clock output. The second multiplexer input is coupled to the second clock output. The multiplexer output is coupled to the FLL input.

公开(公告)号：US20230068451A1

公开(公告)日：2023-03-02

申请号：US17461235

申请日：2021-08-30

Applicant: Texas Instruments Incorporated

Inventor： Bichoy Bahr ,  Adam Fruehling ,  Scott Summerfelt

IPC: H01H37/32 ,  H01H37/04 ,  H01H37/64

Abstract: An example microelectromechanical structures (MEMS) switch includes a body having a first end and a second end opposite the first end. The body extends from a base at the first end and has a first width. The MEMS switch further includes a bridge extending laterally from the body at the second end, and a spine extending between the bridge and the base. The spine has a second width smaller than the first width. At least one of the spine or the body includes a first material with a first thermal coefficient and a second material with a second thermal coefficient different from the first thermal coefficient.

公开(公告)号：US20230061753A1

公开(公告)日：2023-03-02

申请号：US17463013

申请日：2021-08-31

Applicant: Texas Instruments Incorporated

Inventor： Bichoy Bahr ,  Jeronimo Segovia Fernandez ,  Hassan Omar Ali

IPC: G01J1/46 ,  G02B5/20 ,  G01J1/04

Abstract: An example apparatus includes: a semiconductor substrate; a mechanical resonator supported by the substrate, the mechanical resonator including an array of capacitors; and a plasmonic infrared (IR) absorber including an array of metal structures. The mechanical resonator is between the substrate and the IR absorber.

公开(公告)号：US11545466B2

公开(公告)日：2023-01-03

申请号：US17150825

申请日：2021-01-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Bichoy Bahr ,  Baher Haroun

IPC: H01L25/065 ,  H01L21/673 ,  H03B5/08 ,  H01F38/14

Abstract: A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

公开(公告)号：US20220345228A1

公开(公告)日：2022-10-27

申请号：US17860087

申请日：2022-07-07

Applicant: Texas Instruments Incorporated

Inventor： Bichoy Bahr ,  Benjamin Stassen Cook ,  Scott Robert Summerfelt

IPC: H04B11/00 ,  H01L29/51

Abstract: In described examples of a CMOS IC, an ultrasonic transducer having terminals is formed on a substrate of the IC. CMOS circuitry having ultrasonic signal terminals is formed on the substrate. At least one metal interconnect layer overlies the ultrasonic transducer and the CMOS circuitry. The at least one metal interconnect layer connects the CMOS circuitry ultrasonic signal terminals to the terminals of the ultrasonic transducer.

公开(公告)号：US10985729B2

公开(公告)日：2021-04-20

申请号：US16235512

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy Bahr ,  Baher S. Haroun ,  Benjamin Stassen Cook

IPC: G01L11/00 ,  H03H9/02 ,  H03H3/02 ,  G01L7/00 ,  H03H9/17 ,  G01R23/02 ,  G01L21/08 ,  G01L9/00

Abstract: A pressure sensor apparatus is disclosed. The pressure sensor apparatus includes a bulk acoustic wave (BAW) die having a die interface side and a pressure contact side, a sensor BAW resonator and a reference BAW resonator disposed on the die interface side of the BAW die, a control circuit die coupled to the die interface side of the BAW die via an attachment layer, and an extended opening on the pressure contact side that extends into a depth of the BAW die and is generally aligned with the sensor BAW resonator, the extended opening being configured to translate an external pressure on the pressure contact side onto the sensor BAW resonator.

公开(公告)号：US20190068198A1

公开(公告)日：2019-02-28

申请号：US15690144

申请日：2017-08-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy Bahr ,  Baher Haroun ,  Ali Kiaei

IPC: H03L1/02 ,  H03K3/03 ,  H03H9/54 ,  H03L7/24

Abstract: Methods and systems for producing a low-power, low-phase noise oscillating signal using a self-injection locking oscillator. Preferred embodiments include, for example, producing, using an oscillator, a signal having a base frequency component, an Mth harmonic component and a Pth harmonic component, wherein M and P are selected integers and M>P>1; filtering said signal through one or more bandpass filters comprising at least two resonators, said filters having Q factor ≥5, said filters configured to pass said Mth and Pth harmonic components; multiplying said filtered Mth and Pth harmonic components together to produce a multiplied signal, and filtering said multiplied signal using a low pass filter to pass a difference between said filtered Mth and Pth harmonic components, said difference comprising a filtered beat frequency waveform; and injecting said filtered beat frequency waveform into said oscillator to thereby injection lock said signal to said filtered beat frequency waveform.