公开(公告)号：US20240248059A1

公开(公告)日：2024-07-25

申请号：US18597396

申请日：2024-03-06

Applicant: Texas Instruments Incorporated

Inventor： Ricky Alan Jackson ,  Wai Lee

IPC: G01N27/22

CPC classification number: G01N27/225 ,  G01N27/226

Abstract: Monolithic humidity sensor devices, and methods of manufacture. The devices include circuitry on or over a silicon substrate. A primary passivation barrier is formed over the circuitry with conductive vias therethrough; a capacitor, comprising metal fingers with spaces therebetween, is formed above said primary passivation barrier and electrically coupled by the conductive vias to the circuitry. A secondary passivation barrier is formed over the capacitor. A hygroscopic material layer is formed over the secondary passivation barrier, wherein the capacitor is operable to exhibit a capacitance value responsive to moisture present in the hygroscopic material layer and the circuitry is operable to generate a signal responsive to said capacitance value.

公开(公告)号：US20240243024A1

公开(公告)日：2024-07-18

申请号：US18618843

申请日：2024-03-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred KummerlL ,  Wai Lee

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/29 ,  H01L25/065

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US11953460B2

公开(公告)日：2024-04-09

申请号：US17709692

申请日：2022-03-31

Applicant: Texas Instruments Incorporated

Inventor： Ricky Alan Jackson ,  Wai Lee

IPC: G01N27/22 ,  H01L23/31 ,  H01L23/64

CPC classification number: G01N27/225 ,  H01L23/3171 ,  H01L23/642

Abstract: Monolithic humidity sensor devices, and methods of manufacture. The devices include circuitry on or over a silicon substrate. A primary passivation barrier is formed over the circuitry with conductive vias therethrough; a capacitor, comprising metal fingers with spaces therebetween, is formed above said primary passivation barrier and electrically coupled by the conductive vias to the circuitry. A secondary passivation barrier is formed over the capacitor. A hygroscopic material layer is formed over the secondary passivation barrier, wherein the capacitor is operable to exhibit a capacitance value responsive to moisture present in the hygroscopic material layer and the circuitry is operable to generate a signal responsive to said capacitance value.

公开(公告)号：US20210343694A1

公开(公告)日：2021-11-04

申请号：US17376747

申请日：2021-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Steve Edward Harrell ,  Keith Eric Sanborn ,  Wai Lee ,  Erika Lynn Mazotti

IPC: H01L27/00 ,  H01L23/525 ,  H01L27/08

Abstract: An electronic device, e.g. a trimmable resistor, includes a plurality of fused resistors, each fused resistor including one or more doped resistive regions formed in a semiconductor substrate. The doped resistive regions may be thermistors. Each fused resistor further includes a corresponding one of a plurality of fusible links. A first terminal of each of the fused resistors is connected to a first terminal of the corresponding fusible link. First and second interconnection buses are located over the substrate, with the first interconnection bus connecting to a second terminal of each of the fused resistors, and the second interconnection bus connecting to a second terminal of each of the fusible links. The plurality of fused resistors have resistance values that form an exponential progression.

公开(公告)号：US11004929B2

公开(公告)日：2021-05-11

申请号：US16596972

申请日：2019-10-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dok Won Lee ,  Erika Lynn Mazotti ,  Mark Robert Visokay ,  William David French ,  Ricky Alan Jackson ,  Wai Lee

IPC: H01L49/02 ,  G01K7/22 ,  H01L23/522 ,  H01L27/07 ,  G01K7/16

Abstract: Various examples provide an electronic device that includes first and second resistor segments. Each of the resistor segments has a respective doped resistive region formed in a semiconductor substrate. The resistor segments are connected between first and second terminals. The first resistor segment is configured to conduct a current in a first direction, and the second resistor segment is configured to conduct the current in a second different direction. The directions may be orthogonal crystallographic directions of the semiconductor substrate.

公开(公告)号：US20240096767A1

公开(公告)日：2024-03-21

申请号：US17945835

申请日：2022-09-15

Applicant: Texas Instruments Incorporated

Inventor： Hank Sung ,  Dok Won Lee ,  Wai Lee ,  Sreenivasan Koduri

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L23/49513 ,  H01L23/49555 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  G01R15/202

Abstract: An electronic device includes a metal heat slug, a semiconductor die, and a package structure. The metal heat slug has a first portion, a second portion, and a third portion, the second portion is spaced apart from the first portion, and the third portion connects the first and second portions. The semiconductor die is attached to the third portion of the metal heat slug to measure a current of the third portion of the metal heat slug, and the package structure encloses the semiconductor die and the third portion of the metal heat slug and exposes sides of the first and second portions of the metal heat slug.

公开(公告)号：US11972994B2

公开(公告)日：2024-04-30

申请号：US18299293

申请日：2023-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred Kummerl ,  Wai Lee

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/29 ,  H01L25/065

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US11658083B2

公开(公告)日：2023-05-23

申请号：US17116963

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani Koduri ,  Leslie Edward Stark ,  Steven Alfred Kummerl ,  Wai Lee

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/14 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/142 ,  H01L23/293 ,  H01L23/564 ,  H01L25/0655

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20240128210A1

公开(公告)日：2024-04-18

申请号：US18217039

申请日：2023-06-30

Applicant: Texas Instruments Incorporated

Inventor： Amit Ashara ,  Jeffrey West ,  Wai Lee

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/26 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2924/0665

Abstract: The present disclosure introduces an integrated circuit (IC) device that includes a plurality of metal features in a first metal layer over and electrically connected to a semiconductor substrate, an intermetal dielectric (IMD) layer over the first metal layer, and a second metal layer over the first metal layer and electrically isolated from the first metal layer by the IMD layer. The second metal layer includes a plurality of thermal contacts separated by portions of a top dielectric layer. Each thermal contact has an upper surface with a dielectric-free area.

公开(公告)号：US11885834B2

公开(公告)日：2024-01-30

申请号：US17463112

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lei Ding ,  Srinath Mathur Ramaswamy ,  Dok Won Lee ,  Baher Haroun ,  Wai Lee ,  Steven John Loveless

IPC: G01R15/20 ,  G01R19/10

CPC classification number: G01R15/202 ,  G01R19/10

Abstract: In a described example, a circuit includes a sensor circuit including multiple magnetic field sensors having respective sensor outputs. The magnetic field sensors are configured to provide magnetic field sensor signals at the respective sensor outputs representative of a measure of current flow through a conductive structure. A combiner interface has combiner inputs and a combiner output. The combiner inputs are coupled to the respective sensor outputs. The combiner interface is configured to provide an aggregate sensor measurement at the combiner output responsive to the magnetic field sensor signals, in which the aggregate sensor measurement is decoupled from magnetic fields generated responsive to the current flow through the conductive structure.