公开(公告)号：US20230163096A1

公开(公告)日：2023-05-25

申请号：US18152478

申请日：2023-01-10

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Katsumi TERADA ,  Kenji HAMAKAWA ,  Takashi HARE ,  Yasushi TAMURA ,  Kensuke TASHIMA

IPC: H01L23/00 ,  H05K13/04 ,  H05K13/08

CPC classification number: H01L24/75 ,  H05K13/04 ,  H05K13/0812 ,  H05K13/0815 ,  H01L24/83 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/75804 ,  H01L2224/83201 ,  H01L2224/83132 ,  H01L2224/8313

Abstract: A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.

公开(公告)号：US20240371657A1

公开(公告)日：2024-11-07

申请号：US18775597

申请日：2024-07-17

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Shimpei AOKI ,  Takashi HARE ,  Kenji HAMAKAWA ,  Katsumi TERADA

IPC: H01L21/52 ,  H01L21/66 ,  H01L23/544

Abstract: A mounting device mounts a chip component having a chip recognition mark and a substrate having a substrate recognition mark. An attachment tool has transparency and has a tool recognition mark. The attachment tool holds a surface of the chip component opposite to a surface having the chip recognition mark. A chip position recognition unit simultaneously acquires position information of the chip recognition mark and of the tool recognition mark. The substrate position recognition unit acquires position information of the substrate recognition mark and of the tool recognition mark. A control unit moves a substrate stage holding the substrate or the attachment tool in the in-plane direction of the substrate on the basis of information obtained by the chip position recognition unit and by the substrate position recognition unit to perform alignment between the chip component and the substrate.

公开(公告)号：US20180019223A1

公开(公告)日：2018-01-18

申请号：US15546553

申请日：2016-02-02

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Katsumi TERADA

IPC: H01L23/00 ,  H01L21/683 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/75 ,  H01L21/6838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75303 ,  H01L2224/75611 ,  H01L2224/75745 ,  H01L2224/75821 ,  H01L2224/7592 ,  H01L2224/81 ,  H01L2224/81005 ,  H01L2224/81132 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81908 ,  H01L2224/83005 ,  H01L2224/831 ,  H01L2224/83101 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83908 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head has a suction hole in a face that holds the semiconductor chip. The pressure reduction mechanism communicates with the suction hole and is configured to reduce pressure inside the suction hole. The resin sheet feed mechanism is configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip. An electrode that protrudes from a top face of the semiconductor chip is bonded by thermocompression after being embedded in the resin sheet.

公开(公告)号：US20170005068A1

公开(公告)日：2017-01-05

申请号：US15038963

申请日：2014-11-19

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Koji NISHIMURA ,  Katsumi TERADA ,  Mikio KAWAKAMI

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/81 ,  H01L24/75 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/75843 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/00014

Abstract: A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material.

Abstract translation: 用于连续层压N个上层接合材料的三维安装方法包括通过识别最下层接合材料的对准位置和相对于最下层接合材料的下表面定位第一上层接合材料相对于最下层接合材料 通过双场图像识别单元对第一上层接合材料的对准位置，存储最下层接合材料的取向位置的位置坐标，定位第（n + 1）个上层接合材料相对于 通过识别第n个上层接合材料的上表面对准位置和第（n + 1）个上层接合材料的下表面对准位置，第n个上层接合材料，存储位置坐标 第n个上层接合材料的上表面对准位置，识别第N个最上层接合材料的上表面对准位置，并且存储位置 第N个最上层接合材料的上表面对准位置的坐标。