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    Wafer cleaning system and method
    1.
    发明授权
    Wafer cleaning system and method 有权

    公开(公告)号：US10515833B2

    公开(公告)日：2019-12-24

    申请号：US14163045

    申请日：2014-01-24

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

    Inventor： Kuo-Shu Tseng ,  Yao-Yuan Shang ,  You-Feng Chen

    IPC: H01L21/02 ,  H01L21/67

    Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

    Metrology method in reticle transportation
    4.
    发明授权
    Metrology method in reticle transportation 有权

    公开(公告)号：US10345716B2

    公开(公告)日：2019-07-09

    申请号：US15877646

    申请日：2018-01-23

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yao-Yuan Shang ,  Kuo-Shu Tseng ,  Yen-Yu Chen ,  Chun-Chih Lin ,  Yi-Ming Dai

    IPC: G03F7/20

    Abstract: A method for fault detection in a fabrication system is provided. The method includes transferring a reticle carrier containing a reticle from an original position to a destination position. The method further includes detecting environmental condition in the reticle carrier during the transfer of the reticle carrier using a metrology tool that is positioned at the reticle carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.

    Wafer cleaning system and method
    6.
    发明授权
    Wafer cleaning system and method 有权

    公开(公告)号：US11742227B2

    公开(公告)日：2023-08-29

    申请号：US16725459

    申请日：2019-12-23

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Kuo-Shu Tseng ,  Yao-Yuan Shang ,  You-Feng Chen

    IPC: H01L21/67 ,  H01L21/02 ,  B08B1/00

    CPC classification number: H01L21/67253 ,  H01L21/67046 ,  B08B1/00 ,  H01L21/0209

    Abstract: A wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

    Gas delivery for uniform film properties at UV curing chamber
    9.
    发明授权
    Gas delivery for uniform film properties at UV curing chamber 有权
    气体输送在紫外线固化室中具有均匀的膜性能

    公开(公告)号：US08872138B2

    公开(公告)日：2014-10-28

    申请号：US13771112

    申请日：2013-02-20

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yu-Ying Lu ,  Sung-Po Yang ,  Ding-I Liu ,  Kuo-Shu Tseng ,  Chung-Wen Chang

    IPC: G21K5/04 ,  B05D3/06

    CPC classification number: B05D3/067 ,  H01L21/67115 ,  H01L21/6776

    Abstract: A UV curing system includes an enclosure defining an interior, a UV radiation source disposed within the interior of the enclosure, and a first window disposed within the interior of the enclosure. The first window creates a barrier that separates the UV radiation source and a processing chamber. A second window is disposed within the interior of the enclosure at a distance from the first window to define a gas channel. The second window defines a plurality of openings such that the gas channel is in fluid communication with the processing chamber. A gas inlet conduit is in fluid communication with the gas channel and is configured to introduce a cooling gas into the gas channel. A gas outlet is in fluid communication with the processing chamber and is configured to remove gas from the processing chamber.

    Abstract translation: UV固化系统包括限定内部的外壳，设置在外壳内部的UV辐射源以及设置在外壳内部的第一窗口。 第一个窗口创建一个隔离UV辐射源和一个处理室的屏障。 第二窗口设置在与第一窗口相距一定距离的外壳的内部，以限定气体通道。 第二窗口限定多个开口，使得气体通道与处理室流体连通。 气体入口导管与气体通道流体连通，并且构造成将冷却气体引入气体通道。 气体出口与处理室流体连通并且被配置为从处理室去除气体。

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