公开(公告)号：US12255081B2

公开(公告)日：2025-03-18

申请号：US17657821

申请日：2022-04-04

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hayashi ,  Hiroaki Inadomi ,  Shota Umezaki ,  Suguru Enokida ,  Kouji Kimoto

IPC: H01L21/67 ,  B08B3/08 ,  B08B13/00 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate processing apparatus includes multiple first substrate processing devices, one or more second substrate processing devices and a transfer unit. Each of the multiple first substrate processing devices is configured to process a substrate one by one. The one or more second substrate processing devices are configured to simultaneously process multiple substrates, which are processed in the multiple first substrate processing devices. The transfer unit is configured to simultaneously carry the multiple substrates, which are processed in the multiple first substrate processing devices, into a same second substrate processing device.

公开(公告)号：US12198961B2

公开(公告)日：2025-01-14

申请号：US18388550

申请日：2023-11-10

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：USD1012311S1

公开(公告)日：2024-01-23

申请号：US29821006

申请日：2021-12-27

Applicant: Tokyo Electron Limited

Designer： Tatsuhiko Tsujihashi ,  Suguru Enokida ,  Kazuki Matsushita

Abstract: FIG. 1 is a front view of a holding pad for carrying substrate showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front perspective view thereof;
FIG. 8 is a rear perspective view thereof; and,
FIG. 9 is a cross-sectional view taken along the line 9-9 in FIG. 1.
The broken lines depict unclaimed portions of the holding pad for carrying substrate, and thus form no part of the claimed design.

公开(公告)号：US09287145B2

公开(公告)日：2016-03-15

申请号：US13663179

申请日：2012-10-29

Applicant: Tokyo Electron Limited

Inventor： Masahiro Nakaharada ,  Yoji Sakata ,  Akira Miyata ,  Shinichi Hayashi ,  Suguru Enokida ,  Tsunenaga Nakashima

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67046 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67213 ,  H01L21/67253 ,  H01L21/67748 ,  H01L21/6875

Abstract: In a coating and developing treatment system including a treatment station and an interface station, the interface station has: a cleaning unit cleaning a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting whether the cleaned wafer is in an exposable state; and a wafer transfer mechanism including an arm transferring the wafer between the cleaning unit and the inspection unit. Each of the cleaning unit and the inspection unit is provided at multiple tiers in an up and down direction on the front side in the interface station, and the wafer transfer mechanism is provided in a region adjacent to the cleaning units and the inspection units.

Abstract translation: 在包括处理台和接口站的涂覆和显影处理系统中，界面站具有：清洁单元，其在将晶片转移到曝光装置之前清洁晶片的后表面; 检查单元检查清洁的晶片是否处于可曝光状态; 以及晶片传送机构，其包括在所述清洁单元和所述检查单元之间传送所述晶片的臂。 每个清洁单元和检查单元在接口站的前侧沿上下方向设置多层，并且晶片传送机构设置在与清洁单元和检查单元相邻的区域中。

公开(公告)号：US20130112223A1

公开(公告)日：2013-05-09

申请号：US13663179

申请日：2012-10-29

Applicant: Tokyo Electron Limited

Inventor： Masahiro Nakaharada ,  Yoji Sakata ,  Akira Miyata ,  Shinichi Hayashi ,  Suguru Enokida ,  Tsunenaga Nakashima

IPC: B08B3/00

CPC classification number: H01L21/67046 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67213 ,  H01L21/67253 ,  H01L21/67748 ,  H01L21/6875

Abstract: In a coating and developing treatment system including a treatment station and an interface station, the interface station has: a cleaning unit cleaning a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting whether the cleaned wafer is in an exposable state; and a wafer transfer mechanism including an arm transferring the wafer between the cleaning unit and the inspection unit. Each of the cleaning unit and the inspection unit is provided at multiple tiers in an up and down direction on the front side in the interface station, and the wafer transfer mechanism is provided in a region adjacent to the cleaning units and the inspection units.

Abstract translation: 在包括处理台和接口站的涂覆和显影处理系统中，界面站具有：清洁单元，其在将晶片转移到曝光装置之前清洁晶片的后表面; 检查单元检查清洁的晶片是否处于可曝光状态; 以及晶片传送机构，其包括在所述清洁单元和所述检查单元之间传送所述晶片的臂。 每个清洁单元和检查单元在接口站的前侧沿上下方向设置多层，并且晶片传送机构设置在与清洁单元和检查单元相邻的区域中。

公开(公告)号：US11869789B2

公开(公告)日：2024-01-09

申请号：US17533672

申请日：2021-11-23

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  G03F7/16

CPC classification number: H01L21/67712 ,  G03F7/168 ,  H01L21/67766

Abstract: A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US11664254B2

公开(公告)日：2023-05-30

申请号：US17530581

申请日：2021-11-19

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  H01L21/67 ,  G03F7/16 ,  H01L21/683

CPC classification number: H01L21/67712 ,  G03F7/16 ,  H01L21/6719 ,  H01L21/67715 ,  H01L21/6838

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

公开(公告)号：US08707805B2

公开(公告)日：2014-04-29

申请号：US13716659

申请日：2012-12-17

Applicant: Tokyo Electron Limited

Inventor： Junnosuke Maki ,  Mitsuteru Yano ,  Seiji Nakano ,  Tsuyoshi Watanabe ,  Yasunori Toyoda ,  Suguru Enokida ,  Naruaki Iida ,  Hiroki Harada

IPC: G01D7/00 ,  G01L3/14

CPC classification number: G06F17/00 ,  B25J13/085 ,  H01L21/67288 ,  H01L21/68707

Abstract: A transfer apparatus for mounting and transferring a transferred component on a driven means, the transfer apparatus includes: a driving means for rotating a driving side pulley by a rotational driving force of a motor to move a belt wound around the driving side pulley, thereby moving the driven means coupled to the belt in a predetermined direction; and a transfer monitoring means for monitoring a transfer state of the driven means, wherein the transfer monitoring means detects a torque value of the motor required to move the driven means, calculates a torque differential value of the torque value with respect to time based on the detected torque value, and detects the transfer state using the calculated torque differential value.

Abstract translation: 一种用于在被驱动装置上安装和传送传送部件的传送装置，所述传送装置包括：驱动装置，用于通过电动机的旋转驱动力旋转驱动侧滑轮，以使缠绕在驱动侧滑轮周围的皮带移动，从而移动 所述被驱动装置沿预定方向联接到所述带; 以及传送监视装置，用于监视被驱动装置的传送状态，其中转印监视装置检测移动被驱动装置所需的电动机的转矩值，基于时间计算转矩值相对于时间的转矩差值 检测转矩值，并使用计算出的转矩差分值来检测转印状态。

公开(公告)号：USD1011550S1

公开(公告)日：2024-01-16

申请号：US29821009

申请日：2021-12-27

Applicant: Tokyo Electron Limited

Designer： Tatsuhiko Tsujihashi ,  Suguru Enokida ,  Kazuki Matsushita

Abstract: FIG. 1 is a front view of a holding pad for carrying substrate showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front perspective view thereof;
FIG. 8 is a rear perspective view thereof; and,
FIG. 9 is a cross-sectional view taken along the line 9-9 in FIG. 1.
The broken lines depict unclaimed portions of the holding pad for carrying substrate, and thus form no part of the claimed design. The dot-dash chain lines in the drawings depict the boundaries of the claimed subject matter, and thus form no part of the claimed design.

公开(公告)号：US11476136B2

公开(公告)日：2022-10-18

申请号：US16669965

申请日：2019-10-31

Applicant: Tokyo Electron Limited

Inventor： Kenichi Shigetomi ,  Takeshi Saikusa ,  Eiichi Sekimoto ,  Takayuki Fukudome ,  Kousuke Yoshihara ,  Suguru Enokida ,  Kazuhiro Takeshita ,  Kazuto Umeki

IPC: H01L21/67 ,  H05B1/02

Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.