公开(公告)号：US20240189852A1

公开(公告)日：2024-06-13

申请号：US18582809

申请日：2024-02-21

Applicant: Tokyo Electron Limited

Inventor： Tadashi IINO

IPC: B05B15/18 ,  G01N27/07

CPC classification number: B05B15/18 ,  G01N27/07

Abstract: A substrate processing apparatus includes: a substrate holder that holds and processes a substrate; a nozzle that ejects a processing liquid to the substrate held by the substrate holder; a conductive pipe connected to the nozzle and configured to supply the processing liquid to the nozzle; a processing liquid supply that supplies the processing liquid to the nozzle via the conductive pipe; a ground line that connects the conductive pipe and a reference potential; a liquid receiver provided around the substrate holder and configured to receive the processing liquid ejected from the nozzle; an electrode provided close to the liquid receiver; a voltage source configured to apply a voltage to the electrode and impart a potential difference between a liquid contact surface of the liquid receiver and the reference potential; and an ammeter configured to measure a current value of a current flowing through a charge moving path.

公开(公告)号：US20210276031A1

公开(公告)日：2021-09-09

申请号：US17183816

申请日：2021-02-24

Applicant: Tokyo Electron Limited

Inventor： Tadashi IINO

IPC: B05B15/18 ,  G01N27/07

Abstract: A substrate processing apparatus includes: a substrate holder; a nozzle that ejects a processing liquid to the substrate; a conductive pipe that supplies the processing liquid to the nozzle; a ground line that connects the conductive pipe to a reference potential; a liquid receiver provided around the substrate holder and receives liquid ejected from the nozzle; and a deterioration degree measuring unit that measures a deterioration degree of conductivity of the conductive pipe. The deterioration degree measuring unit includes: a measurement liquid supply that supplies a measurement liquid to the conductive pipe; a potential difference imparting unit that imparts a potential difference between a liquid contact surface of the liquid receiver and the reference potential; and an ammeter that measures a current value of a current flowing through a charge moving path established via the measurement liquid between the liquid contact surface of the liquid receiver and the ground line.

公开(公告)号：US20170283977A1

公开(公告)日：2017-10-05

申请号：US15458327

申请日：2017-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tadashi IINO ,  Toru IHARA ,  Yoshihiro KAI ,  Yoichi TOKUNAGA

IPC: C25D17/08 ,  H01L21/67 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12 ,  C25D17/00 ,  H01L21/687 ,  H01L21/677

CPC classification number: C25D17/08 ,  C25D7/12 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67023 ,  H01L21/67173 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68785 ,  H01L21/68792

Abstract: A substrate processing apparatus includes a holding device that includes a conductive member and holds a substrate, a conduction path structure that includes a conductive material and positioned such that the conduction path structure is in contact with the holding device, a supply device that supplies a processing liquid to the substrate held by the holding device, and a grounding structure including a variable resistance device that changes a resistance such that the grounding structure has a first end portion connected the conduction path structure and a second end portion connected to a ground potential.