公开(公告)号：US20250151421A1

公开(公告)日：2025-05-08

申请号：US18926920

申请日：2024-10-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Chang ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

Abstract: A semiconductor device has a photonic semiconductor die and a lens mounted onto the photonic semiconductor die. The photonic semiconductor die and lens are singulated prior to mounting the lens onto the photonic semiconductor die. An adhesive bead is formed on the photonic semiconductor die to seal a cavity between the lens and photonic semiconductor die. The photonic semiconductor die and lens are disposed into a storage media for transporting the photonic semiconductor die to a semiconductor packaging facility. The photonic semiconductor and lens are disposed on a substrate after mounting the lens onto the photonic semiconductor die. An encapsulant is deposited over the substrate, lens, and photonic semiconductor die.

公开(公告)号：US11670521B2

公开(公告)日：2023-06-06

申请号：US17125995

申请日：2020-12-17

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Il Kwon Shim ,  Jeffrey Punzalan

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/60

CPC classification number: H01L21/561 ,  H01L23/31 ,  H01L24/14 ,  H01L24/94 ,  H01L2021/60097

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.

公开(公告)号：US20220384505A1

公开(公告)日：2022-12-01

申请号：US17664510

申请日：2022-05-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/31

Abstract: A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.

公开(公告)号：US20250151447A1

公开(公告)日：2025-05-08

申请号：US18927456

申请日：2024-10-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Chang ,  Il Kwon Shim

IPC: H01L27/146

Abstract: A semiconductor device has a semiconductor die including a photonic circuit. A first adhesive bead is deposited over the semiconductor die around the photonic circuit. A second adhesive bead is deposited over the first adhesive bead. An inner edge of the second adhesive bead is offset toward the photonic circuit relative to an inner edge of the first adhesive bead. A lens is disposed over the second adhesive bead. An encapsulant is deposited over the semiconductor die and lens.

公开(公告)号：US11881494B2

公开(公告)日：2024-01-23

申请号：US17480090

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L23/12 ,  H01L27/146 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L21/56 ,  H01L23/3185 ,  H01L24/32 ,  H01L24/83 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73265

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package includes a dam structure configured to protect components of the semiconductor package from contamination.

公开(公告)号：US20230036239A1

公开(公告)日：2023-02-02

申请号：US17814593

申请日：2022-07-25

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Jose Mari Casticimo

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

公开(公告)号：US12302657B2

公开(公告)日：2025-05-13

申请号：US17664510

申请日：2022-05-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Emmanuel Espiritu ,  Il Kwon Shim ,  Jeffrey Punzalan ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/31 ,  H10F39/00

Abstract: A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.

公开(公告)号：US12211863B2

公开(公告)日：2025-01-28

申请号：US17394365

申请日：2021-08-04

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Il Kwon Shim ,  Jeffrey Punzalan ,  Emmanuel Espiritu ,  Allan Ilagan ,  Teddy Joaquin Carreon

IPC: H01L27/14 ,  H01L23/00 ,  H01L27/146

Abstract: A semiconductor package is disclosed. The package includes a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die region. A die having first and second major die surfaces is attached onto the die region. The second major die surface is attached to the die region. The first major die surface includes a sensor region and a cover adhesive region surrounding the sensor region. The package also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the sensor region. The protective cover includes a recessed structure on the second major cover surface. The recessed structure is located above die bond pads on the die to create an elevated space over peak portions of wire bonds on the die bond pads. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the protective cover, while leaving the first major cover surface exposed.

公开(公告)号：US20240186346A1

公开(公告)日：2024-06-06

申请号：US18516997

申请日：2023-11-22

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Catherine Cheh Yee Chang ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L27/14683 ,  H01L24/32 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227

Abstract: A semiconductor package for a sensor is disclosed. The package includes an opaque layer on the encapsulation to prevent the wire bonds encased by the encapsulation from being visible to the naked eye. This reduces or prevents reflectance which improves the performance of the sensor. In some cases, the opaque layer extends beyond the encapsulation to cover a peripheral portion of the cover to form a cover opaque region. The cover opaque region reduces or prevents flaring and scattering of light, further enhancing the performance of the sensor.

公开(公告)号：US20220093664A1

公开(公告)日：2022-03-24

申请号：US17478978

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  IL KWON SHIM

IPC: H01L27/146

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.