公开(公告)号：US20180242451A1

公开(公告)日：2018-08-23

申请号：US15439754

申请日：2017-02-22

Applicant: XEROX CORPORATION

Inventor： Naveen CHOPRA ,  Barkev KEOSHKERIAN ,  Chad Steven SMITHSON ,  Kurt I. HALFYARD ,  Michelle N. CHRETIEN

IPC: H05K1/09 ,  C09D11/52 ,  C09D11/30 ,  C09D11/03 ,  H05K1/03 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/097 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/52 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/32227 ,  H01L2224/75155 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/3457 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0257

Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

公开(公告)号：US20220418104A1

公开(公告)日：2022-12-29

申请号：US17900309

申请日：2022-08-31

Applicant: XEROX CORPORATION

Inventor： Naveen CHOPRA ,  Barkev KEOSHKERIAN ,  Chad Steven SMITHSON ,  Kurt I. HALFYARD ,  Michelle N. CHRETIEN

IPC: H05K1/09 ,  C09D11/52 ,  C09D11/30 ,  C09D11/03 ,  H01L23/00 ,  H01L23/498 ,  H01B1/22 ,  C09D11/037 ,  H01B1/16 ,  H01B1/02 ,  H05K3/34

Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

公开(公告)号：US20140377454A1

公开(公告)日：2014-12-25

申请号：US13925438

申请日：2013-06-24

Applicant: XEROX CORPORATION

Inventor： Gabriel IFTIME ,  Yiliang WU ,  Naveen CHOPRA ,  Cuong VONG ,  Michael D'AMATO ,  Sandra J. GARDNER ,  Kurt I. HALFYARD ,  Adrien P. CÔTÉ

IPC: H05K3/12

CPC classification number: H05K3/1283 ,  B05D3/02 ,  B05D3/12 ,  B05D5/12 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0245 ,  H05K2203/1131 ,  H05K2203/1545

Abstract: A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20° C. to about 130° C. above the glass transition temperature of the thermoplastic binder and at least 120° C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink.

Abstract translation: 在衬底上形成印刷图案的方法包括：用包含导电材料，热塑性粘合剂和溶剂的导电油墨将图案印刷到基材上，固化印刷图案，并通过将印刷图案馈送通过 熔融体系在约20℃至约130℃的温度下操作，高于热塑性粘合剂的玻璃化转变温度，至少120℃，压力为约50psi至约1500psi， 以及通过熔化系统的进料速率为约1m / min至约100m / min。 该方法可以连续进行。 该方法提高了印刷油墨的薄层电阻率。