公开(公告)号：US20140154830A1

公开(公告)日：2014-06-05

申请号：US14173526

申请日：2014-02-05

Applicant: XINTEC INC

Inventor： Yu-Lung HUANG ,  Tzu-Hsiang HUNG ,  Yen-Shih HO

IPC: H01L31/18

CPC classification number: H01L31/1876 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2224/94

Abstract: A method for forming an image sensor chip package includes: providing a substrate having predetermined scribe lines defined thereon, wherein the predetermined scribe lines define device regions and each of the device regions has at least a device formed therein; disposing a support substrate on a first surface of the substrate; forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines; forming a package layer on a second surface of the substrate; forming conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and dicing along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.

Abstract translation: 一种用于形成图像传感器芯片封装的方法，包括：提供具有限定在其上的预定划线的基板，其中，所述预定划线限定器件区域，并且每个器件区域至少具有形成在其中的器件; 将支撑基板设置在所述基板的第一表面上; 在所述支撑基板和所述基板之间形成至少间隔层，其中所述间隔层覆盖所述预定划线; 在所述基板的第二表面上形成封装层; 在所述衬底的第二表面上形成导电结构，其中所述导电结构分别在相应的一个所述器件区域中电连接到相应的器件; 并且沿着预定的划线切割，使得支撑基板从基板移除，并且基板被分离成多个单独的图像传感器芯片封装。

公开(公告)号：US20140231966A1

公开(公告)日：2014-08-21

申请号：US14260205

申请日：2014-04-23

Applicant: XINTEC INC.

Inventor： Bai-Yao LOU ,  Tsang-Yu LIU ,  Chia-Sheng LIN ,  Tzu-Hsiang HUNG

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05025 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05687 ,  H01L2224/0569 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/32225 ,  H01L2224/73153 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552

Abstract: An embodiment of the invention provides a chip package which includes a substrate having a first surface and a second surface; a conducting pad structure located on the first surface; a dielectric layer located on the first surface of the substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure; and a cap layer located on the dielectric layer and filled into the opening.

Abstract translation: 本发明的实施例提供一种芯片封装，其包括具有第一表面和第二表面的基板; 位于所述第一表面上的导电垫结构; 位于所述基板的所述第一表面上的电介质层和所述导电焊盘结构，其中所述电介质层具有暴露所述导电焊盘结构的一部分的开口; 以及位于电介质层上并填充到开口中的盖层。