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92 条记录 (耗时 0.03 秒)

    Ultrasonic probe
    1.
    发明授权
    Ultrasonic probe 有权

    公开(公告)号：US12059297B2

    公开(公告)日：2024-08-13

    申请号：US17232438

    申请日：2021-04-16

    申请人： SAMSUNG MEDISON CO., LTD.

    发明人： Haekee Min ,  Yoonsung Kyung ,  Jongsun Ko

    IPC分类号： B06B1/06 ,  A61B8/00 ,  H10N30/87

    CPC分类号： A61B8/4444 ,  B06B1/0622 ,  B06B1/067 ,  H10N30/875 ,  A61B8/4494

    摘要： Disclosed in an ultrasonic probe for obtaining an ultrasonic image. The ultrasonic probe includes piezoelectric elements forming a plurality of rows arranged to form a pair along a lateral direction, a kerf formed between the piezoelectric elements along the lateral direction, a first circuit layer disposed below the piezoelectric elements, a second circuit layer disposed to be spaced apart from a lower side of the first circuit layer and including a plurality of wires extending along the rows, the second circuit layer being provided with a first region in selectively contact with the piezoelectric elements and a second region disposed at opposite ends of the first region and folded without being in contact with the piezoelectric elements, and a first connection part to electrically connect the first circuit layer and the second circuit layer, wherein the first region is, when the plurality of wires extending along one row of the pair of rows extends from the first region to the second region, provided such that the plurality of wires is distributed to the other adjacent row.

    VIBRATION SENSOR AND MICROPHONE
    2.
    发明公开
    VIBRATION SENSOR AND MICROPHONE 审中-公开

    公开(公告)号：US20240268233A1

    公开(公告)日：2024-08-08

    申请号：US18639803

    申请日：2024-04-18

    申请人： Shenzhen Shokz Co., Ltd.

    发明人： Yongshuai YUAN ,  Xin QI ,  Fengyun LIAO

    IPC分类号： H10N30/30 ,  H04R17/02 ,  H04R17/10 ,  H10N30/87

    CPC分类号： H10N30/302 ,  H04R17/02 ,  H04R17/10 ,  H10N30/304 ,  H10N30/875

    摘要： In a vibration sensor, both ends of a vibration beam are fixed on a base, and a middle portion is suspended in a cavity and generates deformation in response to external vibrational excitation. The portions, suspended in the cavity, of a plurality of vibration beams have different dimensions by changing a structure and a dimension of the cavity and a dimension and a position of each vibration beam, so that different vibration beams have different natural frequencies, and resonance peaks of different frequencies are generated under vibrational excitation, forming a wider frequency response range. In addition, a vibration signal selected by the vibration sensor is a vibration signal within a preset range near the resonance peak, and the sensitivity is relatively high. A microphone having the vibration sensor is also provided.

    ULTRASONIC TRANSDUCER, FABRICATION METHOD THEREOF AND ULTRASONIC PROBE APPLYING THE SAME
    3.
    发明公开
    ULTRASONIC TRANSDUCER, FABRICATION METHOD THEREOF AND ULTRASONIC PROBE APPLYING THE SAME 审中-公开

    公开(公告)号：US20240216952A1

    公开(公告)日：2024-07-04

    申请号：US18527474

    申请日：2023-12-04

    申请人： Qisda Corporation

    发明人： Fu-Sheng JIANG

    IPC分类号： B06B1/06 ,  H10N30/87

    CPC分类号： B06B1/0629 ,  H10N30/875

    摘要： An ultrasonic transducer includes an ultrasonic transducer unit array and a circuit layer. The ultrasonic transducer unit array includes: a plurality of first array units and a plurality of second array units. At least two adjacent ones of the first array units are arranged along a first direction to form a first series string; at least two adjacent ones of the second array units are arranged along a second direction to form a second series string; the first series string and the second series string are intersected; and the first direction and the second direction form a non-180° angle. The circuit layer includes a first bridging unit connected in series with the first array units; and a second bridging unit connected in series with the second array units. The second bridging unit and the first bridging unit are not directly electrically connected to each other.

    Force-measuring and touch-sensing integrated circuit device
    6.
    发明授权
    Force-measuring and touch-sensing integrated circuit device 有权

    公开(公告)号：US11725993B2

    公开(公告)日：2023-08-15

    申请号：US17119365

    申请日：2020-12-11

    申请人： UltraSense Systems, Inc.

    发明人： Hao-Yen Tang ,  Sina Akhbari ,  Man-Chia Chen ,  Zhongxuan Tu ,  Michael Chen

    IPC分类号： H01L41/113 ,  G01L1/16 ,  G01H11/08 ,  H10N30/50 ,  H10N30/30 ,  H10N30/87 ,  H10N30/00

    CPC分类号： G01L1/16 ,  G01H11/08 ,  H10N30/10513 ,  H10N30/302 ,  H10N30/50 ,  H10N30/875

    摘要： A force-measuring and touch-sensing integrated circuit device includes a semiconductor substrate, a thin-film piezoelectric stack overlying the semiconductor substrate, piezoelectric micromechanical force-measuring elements (PMFEs), and piezoelectric micromechanical ultrasonic transducers (PMUTs). The thin-film piezoelectric stack includes a piezoelectric layer. The PMFEs and PMUTs are located at respective lateral positions along the thin-film piezoelectric stack, such that each of the PMFEs and PMUTs includes a respective portion of the thin-film piezoelectric stack. Each PMUT has a cavity, the respective portion of the thin-film piezoelectric stack, and first and second PMUT electrodes. Each PMFE has the respective portion of the thin-film piezoelectric stack, and first and second PMFE electrodes. Each PMFE is configured to output voltage signals between the PMFE electrodes in accordance with a time-varying strain at the respective portion of the piezoelectric layer resulting from a low-frequency mechanical deformation.

    Fluid actuator
    7.
    发明授权
    Fluid actuator 有权

    公开(公告)号：US11711980B2

    公开(公告)日：2023-07-25

    申请号：US17088813

    申请日：2020-11-04

    申请人： KOGE MICRO TECH CO., LTD.

    发明人： Chung-Han Wu ,  Hsin-Cheng Wang

    IPC分类号： H01L41/047 ,  H10N30/20 ,  F04B43/04 ,  H10N30/88 ,  H10N30/87

    CPC分类号： H10N30/2047 ,  F04B43/046 ,  H10N30/875 ,  H10N30/88

    摘要： A fluid actuator includes an actuating portion, a piezoelectric unit, a conduction unit, and a levelness regulating portion. The actuating portion includes a first actuating area, a second actuating area, and at least one connecting section between the two actuating areas. The piezoelectric unit includes a first signal area and a second signal area. The two signal areas are provided in the same plane and are isolated from each other by an isolating portion. The piezoelectric unit corresponds in position to the first actuating area of the actuating portion. The conduction unit includes a first electrode and a second electrode. The first signal area of the piezoelectric unit is electrically connected to the first electrode, and the second signal area of the piezoelectric unit to the second electrode. The levelness regulating portion, the piezoelectric unit, and the conduction unit are located on the same side of the actuating portion.

    PIEZOELECTRIC ACTUATOR
    8.
    发明公开
    PIEZOELECTRIC ACTUATOR 审中-公开

    公开(公告)号：US20230165151A1

    公开(公告)日：2023-05-25

    申请号：US18161444

    申请日：2023-01-30

    申请人： BROTHER KOGYO KABUSHIKI KAISHA

    发明人： Yoshikazu TAKAHASHI

    IPC分类号： H10N30/20 ,  H10N30/87 ,  B41J2/14

    CPC分类号： H10N30/2047 ,  H10N30/875 ,  B41J2/14233 ,  B41J2002/14225 ,  B41J2002/14266 ,  B41J2002/14491 ,  H10N30/87 ,  C08G63/08

    摘要： There is provided a head including: a piezoelectric layer; a plurality of individual electrodes located below the piezoelectric layer in an up-down direction; a common electrode located below the piezoelectric layer. The plurality of individual electrodes includes: a first individual electrode array including a plurality of first individual electrodes aligned in a first direction; and a second individual electrode array including a plurality of second individual electrodes aligned in the first direction. The common electrode includes: a plurality of first facing portions which are demarcated to correspond to the plurality of first electrodes, respectively; a plurality of second facing portions which are demarcated to correspond to the plurality of second electrodes, respectively; and a connecting portion located between the plurality of first facing portions and the plurality of second facing portions, and connecting the plurality of first facing portions and the plurality of second facing portions.

    Multi-Layer Flexible Array Interconnect for an Ultrasound Transducer, and Methods of Manufacture
    10.
    发明公开
    Multi-Layer Flexible Array Interconnect for an Ultrasound Transducer, and Methods of Manufacture 审中-公开

    公开(公告)号：US20240306512A1

    公开(公告)日：2024-09-12

    申请号：US18591845

    申请日：2024-02-29

    申请人： FUJIFILM SonoSite, Inc.

    发明人： Andrew Lundberg ,  Jimin Zhang ,  William Blakemore ,  Ken Best

    IPC分类号： H10N30/87 ,  A61B8/00 ,  B06B1/06 ,  H10N30/06 ,  H10N30/088

    CPC分类号： H10N30/875 ,  A61B8/4494 ,  B06B1/067 ,  H10N30/06 ,  H10N30/088 ,  B06B2201/76

    摘要： Systems and methods for a multi-layer flexible array interconnect for an ultrasound transducer, and methods of manufacture are disclosed. The systems and methods described herein provide consistent and controllable alignment between the odd and even flex layers. Further, ground layers are added between the signal layers to improve crosstalk performance while simplifying the construction. In some implementations, vias are introduced at the interface of an electromechanical-array element (e.g., lead zirconate titanate (PZT) element) to increase the surface area of conductive material and thereby increase the quality of the electrical and physical connections. In addition, a machining alignment and verification aid is provided through strategic use of unused and discarded board area to enable (i) alignment check of the flex circuit with the machining equipment and (ii) adjustment of the flex circuit position relative to the machining equipment to avoid the flex circuit being machined to an unusable state.