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公开(公告)号：US20210193476A1
公开(公告)日：2021-06-24
申请号：US17096434
申请日：2020-11-12
Applicant: STMicroelectronics Pte Ltd
Inventor： Yuzhan WANG , Pradeep BASAVANAHALLI KUMARSWAMY , Hong Kia KOH , Alberto LEOTTI , Patrice RAMONDA
IPC: H01L21/3105 , H01L21/762
Abstract: A first dielectric layer made of a first dielectric material is deposited over a semiconductor substrate. A buffer layer is then deposited on an upper surface of the first dielectric layer. A trench is opened to extend through the buffer layer and the first dielectric layer. A second dielectric layer made of a second dielectric material is the deposited in a conformal manner on the buffer layer and filling the trench. Chemical mechanical polishing of the second dielectric layer is performed to remove overlying portions of the second dielectric layer with the buffer layer being used as a polish stop. After removing the buffer layer, the first dielectric layer and the second dielectric material filling the trench form a pre-metallization dielectric layer having a substantially planar upper surface.
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公开(公告)号：US11009474B2
公开(公告)日：2021-05-18
申请号：US16217631
申请日：2018-12-12
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Malek Brahem , Hatem Majeri , Olivier Le Neel , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.
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公开(公告)号：US10768133B2
公开(公告)日：2020-09-08
申请号：US15723661
申请日：2017-10-03
Applicant: STMicroelectronics Pte Ltd
Inventor： Ravi Shankar , Olivier Le Neel , Tien-Choy Loh , Shian-Yeu Kam
Abstract: Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with a support material that provides structural integrity. The solid state gas sensor module can be integrated on top of an ASIC on a common substrate. With sufficient thermal insulation, such a gas detector can be provided as a low-power component of mobile electronic devices such as smart phones. A method of operating a multi-sensor array allows detection of relative concentrations of different gas species by either using dedicated sensors, or by thermally tuning the sensors to monitor different gas species.
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公开(公告)号：US10684389B2
公开(公告)日：2020-06-16
申请号：US16107911
申请日：2018-08-21
Inventor： Wing Shenq Wong , Andy Price , Eric Christison
IPC: H01L31/167 , G01V8/12 , H01L25/16
Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
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公开(公告)号：US10128207B2
公开(公告)日：2018-11-13
申请号：US14674891
申请日：2015-03-31
Applicant: STMicroelectronics Pte Ltd
Inventor： Yun Liu , Jerome Teysseyre , Yonggang Jin
Abstract: One or more embodiments are directed to semiconductor packages that include a pillar and bump structures. The semiconductor packages include a die that has recess at a perimeter of the semiconductor die. The semiconductor package includes an encapsulation layer that is located over the semiconductor die filling the recess and surrounding side surfaces of the pillars. The package may be formed on a wafer with a plurality of die and may be singulated into a plurality of packages.
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Patent Agency Ranking
公开(公告)号：US10115842B2
公开(公告)日：2018-10-30
申请号：US15802271
申请日：2017-11-02
Inventor： Yonggang Jin , David Lawson , Colin Campbell , Anandan Ramasamy
IPC: H01L31/0216 , H01L31/0232 , H01L31/0203 , H01L31/02 , H01L31/101
Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.
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公开(公告)号：US20180248068A1
公开(公告)日：2018-08-30
申请号：US15969908
申请日：2018-05-03
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/18 , H01L31/0232 , H01L25/16
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , G01V8/12 , H01L21/568 , H01L25/167 , H01L31/0232 , H01L31/02327 , H01L31/167 , H01L31/18 , H01L31/186 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2924/3511 , H03K17/941 , H03K17/9631 , H03K17/9638 , H03K2217/96023 , Y10T156/1052 , Y10T156/1064
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
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公开(公告)号：US09991409B2
公开(公告)日：2018-06-05
申请号：US14968359
申请日：2015-12-14
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/0232 , H01L31/18 , H03K17/94 , H03K17/96 , H01L31/167 , G01S17/02 , G01S7/481 , H01L25/16 , G01V8/12
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , G01V8/12 , H01L21/568 , H01L25/167 , H01L31/0232 , H01L31/02327 , H01L31/167 , H01L31/18 , H01L31/186 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2924/3511 , H03K17/941 , H03K17/9631 , H03K17/9638 , H03K2217/96023 , Y10T156/1052 , Y10T156/1064
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
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公开(公告)号：US09911890B2
公开(公告)日：2018-03-06
申请号：US15199390
申请日：2016-06-30
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Loic Pierre Louis Renard , Cheng-Lay Ang
IPC: H01L31/0232 , H01L21/00 , H01L31/173 , H01S5/183 , H01S5/022 , H01L31/12 , H01L31/042 , H01L31/047 , H01L31/0475 , H01G9/20 , H01L31/046
CPC classification number: H01L31/173 , G01S7/4813 , G01S17/08 , H01G9/20 , H01L31/0203 , H01L31/02366 , H01L31/042 , H01L31/046 , H01L31/047 , H01L31/0475 , H01L31/125 , H01S5/02252 , H01S5/183
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
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公开(公告)号：US09851328B2
公开(公告)日：2017-12-26
申请号：US14462432
申请日：2014-08-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Jerome Teysseyre , Yonggang Jin , Suman Cherian
IPC: G01N27/28 , G01N27/403 , G01N27/413 , G01N27/406 , G01N27/407 , H05K1/18
CPC classification number: G01N27/4065 , G01N27/4062 , G01N27/4071 , G01N27/4077 , H05K1/185 , H05K2201/09118 , H05K2201/10151
Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.
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