Abstract:
A resistor structure for an integrated circuit includes a first set of contacts connected between a semiconductor layer and a first conductive layer; and a second set of plugs connected between the first conductive layer and a second conductive layer, wherein the first set of contacts and the second set of plugs are coupled together as a first resistor segment to provide a predetermined resistance for the integrated circuit.
Abstract:
A program method for a flash memory semiconductor device includes the steps of providing a bit line voltage for programming a group of memory cells and detecting if the bit line voltage meets a selected target voltage. When the bit line voltage meets the selected target voltage, a program operation is performed on the group of memory cells. When the bit line voltage does not meet the selected target voltage, the programming operation is individually performed on at least a first subgroup of memory cells from the group and a second subgroup of memory cells from the group.
Abstract:
A strained-channel semiconductor structure and method of fabricating the same. The strained-channel semiconductor structure comprises a substrate composed of a first semiconductor material with a first natural lattice constant. A channel region is disposed in the substrate and a gate stack is disposed over the strained channel region. A pair of source/drain regions are oppositely disposed in the substrate adjacent to the channel region, wherein each of the source/drain regions comprises a lattice-mismatched zone comprising a second semiconductor material with a second natural lattice constant rather than the first natural lattice constant, an inner side and an outer side corresponding to the gate stack, and at least one outer sides laterally contacts the first semiconductor material of the substrate.
Abstract:
A digital image capturing apparatus includes a housing, a first hole installed on the front side of the housing for inputting light from the front, a second hole installed on the rear side of the housing for inputting light from the rear, a reflector module installed in the housing for reflecting the light input from the first hole or the second hole, a photosensor installed in the housing for sensing the light from the reflector module, and an image generating module installed in the housing for generating an image according to the light sensed by the photosensor.
Abstract:
A calibration method of a mixed mode simulation calibrates standard delay times in a standard delay format and includes obtaining a digital output circuit from a digital circuit, obtaining an analog output circuit from an analog circuit, performing a simulation on the digital output circuit connected to the analog output circuit to obtain an ideal output, obtaining a first delay time according to the standard delay times of the digital output circuit, performing a calibrative analog-to-digital mixed mode simulation using the first delay time to obtain an analog-to-digital mixed output, comparing the ideal output and the analog-to-digital mixed output to calibrate the first delay time, and calibrating the standard delay times of the digital output circuit according to the calibrated first delay time.
Abstract:
A method for detecting a type of a non-volatile memory. The method includes issuing one of a sequence of reading identification commands to detect the type of the non-volatile memory; obtaining a response data from the non-volatile memory; judging whether the response data matches any type of a plurality of types of non-volatile memory; utilizing another reading identification command of the sequence of reading identification commands to detect the type of the non-volatile memory when the response data does not match any type of the plurality of types of non-volatile memory; and determining the type of the non-volatile memory according to the response data when the response data match one type of the plurality of types of non-volatile memory.
Abstract:
A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.
Abstract:
A method for forming a semiconductor device including a DRAM cell structure comprising a silicon on insulator (SOI) substrate with an embedded capacitor structure including providing a substrate comprising an overlying first electrically insulating layer; forming a first electrically conductive layer on the first electrically insulating layer to form a first electrode; forming a capacitor dielectric layer on the first electrode; forming a second electrically conductive layer on the capacitor dielectric layer to form a second electrode; forming a second electrically insulating layer on the second electrode; and, forming a monocrystalline silicon layer over the second electrode to form an SOI substrate comprising a first capacitor structure.
Abstract:
The invention discloses a switching power supply capable of reducing a low-frequency secondary-side common-mode voltage. The power supply mainly has two common-mode filtering circuit devices to prevent an AC voltage and an AC current from coupling to a secondary side of a transformer. Thus, the electrical safety and the quality in use of the associated electronic apparatus can be enhanced, a potential difference between the electronic apparatus and the ground may be greatly reduced, and an AC hum of a speaker coupled to an output of the power supply may be reduced or even eliminated.