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公开(公告)号：US10656255B2
公开(公告)日：2020-05-19
申请号：US15205743
申请日：2016-07-08
申请人： InvenSense, Inc.
发明人： Eldwin Ng , Julius Ming-Lin Tsai , Nikhil Apte
IPC分类号： H01L41/047 , G01S7/521 , B06B1/06 , H01L41/09 , A61B5/1172 , A61B8/00 , G01S15/89
摘要： A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
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公开(公告)号：US10652354B2
公开(公告)日：2020-05-12
申请号：US16277422
申请日：2019-02-15
申请人： InvenSense, Inc.
发明人： Sam Guilaume , Rene Cortenraad , Cyrille Soubeyrat
摘要： A profile of a user may be constructed having at least one profile entry. A device having an integrated sensor assembly including at least one sensor may be associated with the user and operated according to a sensor configuration. Sensor data may be processed to extract a feature. Entry data may be determined for a profile entry based on the extracted feature so that the profile entry may incorporate the determined entry data. An exchangeable profile may be derived from the constructed profile, for example by using privacy data, and compensation from a third party may be received in return for the exchangeable profile.
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公开(公告)号：US10651151B2
公开(公告)日：2020-05-12
申请号：US15663242
申请日：2017-07-28
申请人： InvenSense, Inc.
发明人： Peter Smeys , Mozafar Maghsoudnia
IPC分类号： H01L21/00 , H01L25/065 , H01L25/00 , H01L23/00
摘要： A method includes aligning a germanium feature on a first CMOS wafer with an aluminum feature on a second CMOS wafer. The aluminum feature and the germanium feature are pressed together. A eutectic bond is formed connecting the aluminum feature to the germanium feature. The eutectic bond has a melting point which is lower than the melting point of aluminum and the melting point of germanium.
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94.发明申请公开(公告)号：US20200109045A1
公开(公告)日：2020-04-09
申请号：US16698535
申请日：2019-11-27
申请人： INVENSENSE, INC.
发明人： Michael DANEMAN , Martin LIM , Kegang HUANG , Igor TCHERTKOV
摘要： A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
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95.发明申请公开(公告)号：US20200096555A1
公开(公告)日：2020-03-26
申请号：US16138949
申请日：2018-09-21
申请人： INVENSENSE, INC.
发明人： Omid Oliaei , Adolfo Giambastiani
IPC分类号： G01R31/28 , G01R31/3183 , G01P15/00 , G01C19/00
摘要： Facilitating fault detection of a system using a test input comprising a linear combination of inputs of the system is presented herein. A system can comprise a test signal component that generates, via a test procedure, a test input signal comprising a first linear combination of at least two input signals of the system, and applies the test input signal to the system during a phase of respective phases of the test procedure; and a fault detection component that detects a fault of the system based on a test output signal corresponding to the test input signal and a second linear combination of respective output signals of the system corresponding to the at least two input signals.
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公开(公告)号：US20200056887A1
公开(公告)日：2020-02-20
申请号：US16540852
申请日：2019-08-14
申请人： INVENSENSE, INC.
发明人： Joseph Seeger
IPC分类号： G01C19/5776
摘要： Reducing, at a common sense electrode of a group of sensors of a system, a common charge flow due to a common motion of the group of sensors is presented herein. The group of electromechanical sensors generates a common charge flow as a result of a common motion of the group of electromechanical sensors and a differential charge flow as a result of a differential motion of the group of electromechanical sensors—respective sense elements of the group of electromechanical sensors being electrically connected at the common sense electrode. The system further comprises a voltage-to-voltage converter component that generates, via an output of the voltage-to-voltage converter component, a positive feedback voltage, and minimizes the common charge flow by coupling, via a defined feedback capacitance, the positive feedback voltage to the common sense electrode—the common sense electrode being electrically coupled to an input of the voltage-to-voltage converter component.
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公开(公告)号：US10564778B2
公开(公告)日：2020-02-18
申请号：US16392161
申请日：2019-04-23
申请人： InvenSense, Inc.
发明人： Eitan Medina , Behrooz Abdi , Sam Massih , Romain Fayolle , Hao-Yen Tang
摘要： In a method for determining force applied to an ultrasonic sensor, ultrasonic signals are emitted from an ultrasonic sensor. A plurality of reflected ultrasonic signals from a finger interacting with the ultrasonic sensor is captured. A first data based at least in part on a first reflected ultrasonic signal of the plurality of reflected ultrasonic signals is compared with a second data based at least in part on a second reflected ultrasonic signal of the plurality of reflected ultrasonic signals. A deformation of the finger during interaction with the ultrasonic sensor is determined based on differences between the first data based at least in part on the first reflected ultrasonic signal and the second data based at least in part on the second reflected ultrasonic signal. A force applied by the finger to the ultrasonic sensor is determined based at least in part on the deformation.
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公开(公告)号：US10562070B2
公开(公告)日：2020-02-18
申请号：US15589930
申请日：2017-05-08
申请人： InvenSense, Inc.
IPC分类号： B06B1/06
摘要： An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers including a plurality of sub-arrays of ultrasonic transducers, wherein a sub-array of ultrasonic transducers of the plurality of sub-arrays of ultrasonic transducers is independently controllable, and wherein a sub-array of ultrasonic transducers has an associated receive channel. A plurality of shift registers is configured to select a receive pattern of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to activate during a receive operation. An array controller is configured to control selection of the ultrasonic transducers during the receive operation according to the receive pattern and configured to shift a position of the receive pattern within the plurality of shift registers such that the ultrasonic transducers activated during the receive operation moves relative to and within the two-dimensional array of ultrasonic transducers.
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公开(公告)号：US20200031661A1
公开(公告)日：2020-01-30
申请号：US16520228
申请日：2019-07-23
申请人： InvenSense, Inc.
发明人： Calin MICLAUS , Matthias SCHMIDT , Vijay WAKHARKAR , Milena VUJOSEVIC , Manish SHARMA-KULAMARVA
摘要： A device includes a sensor die, an electrical coupling, a substrate, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The housing unit and the substrate are configured to house the sensor die and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The housing unit may include a drainage configured to drain liquid, e.g., water, oil, etc., out from an interior environment of the housing unit to the environment external to the housing unit. In some embodiments the housing unit comprises a membrane barrier exposing the sensor die to an environment external to the housing unit while preventing liquid from the environment external to enter an interior environment of the housing unit. It is appreciated that in some embodiments, the membrane barrier may be porous and may be ePTFE.
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公开(公告)号：US20200030850A1
公开(公告)日：2020-01-30
申请号：US16592618
申请日：2019-10-03
申请人： InvenSense, Inc.
摘要： A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.
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