Abstract:
An electrolyte for anodizing magnesium products, includes a base solution, a main blackening agent, an auxiliary blackening agent, and a complexing agent. The base solution includes 2 to 25 g/l of alkali, 1 to 30 g/l of fluoride, and 1 to 35 g/l of silicate. The main blackening agent mainly includes cupric salt, concentration of the cupric salt is from 0.3 to 9 grams per liter (g/l). The auxiliary blackening agent mainly includes oxysalt, concentration of the oxysalt is from 0.1 to 8 g/l. Concentration of the complexing agent is from 0.5 to 20 g/l.
Abstract:
A connecting apparatus comprises a riser card (10) and a slot (20). The riser card comprises a PCI-X slot (13), a PCI-E slot (11), a first connector (15), a second connector (17) and a third connector (19). The first connector set a serial of PCI-X signal pads (151) on one side thereof. The second connector is adapted to provide power and ground signals. The third connector set a serial of PCI-E signal pads (191) on the same side thereof as the first connector. The slot is defined on a circuit board for the riser card inserted therein. The slot comprises a first portion (21) and a second portion (23) coupling to the second connector. The first portion comprises a first side with a series of PCI-X signal pins (211) coupling to the serial of PCI-X signal pads of the first connector, when the riser card is inserted into the slot in a first direction with the first connector inserted into the first portion. The first portion comprises a second side with a series of PCI-E signal pins (191) coupling to the serial of PCI-E signal pads of the third connector, when the riser card is inserted into the slot in a second direction which is reverse to the first direction with the third connector inserted into the second portion.
Abstract:
A method for adhering windshield sealants directly over a basecoat/clearcoat finish in which the clearcoat comprises a carbamate polymer or oligomer.
Abstract:
A process for forming an isolation region comprised of shallow trench-deep trench configuration, wherein a smooth top surface topography is obtained for the isolation region and for adjacent active device regions in the semiconductor substrate, has been developed. The process features initially forming an insulator filled shallow trench shape, planarized via a first chemical mechanical polishing procedure, allowing reduced complexity to be realized during the subsequent formation of a narrow diameter, deep trench opening, in the insulator filled shallow trench shape and in an underlying portion of semiconductor substrate. Formation of a recessed polysilicon plug located in the bottom portion of the deep trench opening is followed by formation of an insulator plug located in a top portion of the deep trench opening, overlying the recessed polysilicon plug. This is accomplished via photolithographic and selective dry definition procedures, and a second chemical mechanical polishing procedure, resulting in a filled, deep trench opening exhibiting a smooth top surface topography.
Abstract:
A method for fabricating a thermal inkjet head equipped with a symmetrical heater and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist deposition process is carried out to form an ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel electroplating process provides an orifice plate on top of the inkjet head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.
Abstract:
A process for forming an isolation region comprised of shallow trench-deep trench configuration, wherein a smooth top surface topography is obtained for the isolation region and for adjacent active device regions in the semiconductor substrate, has been developed. The process features initially forming an insulator filled shallow trench shape, planarized via a first chemical mechanical polishing procedure, allowing reduced complexity to be realized during the subsequent formation of a narrow diameter, deep trench opening, in the insulator filled shallow trench shape and in an underlying portion of semiconductor substrate. Formation of a recessed polysilicon plug located in the bottom portion of the deep trench opening is followed by formation of an insulator plug located in a top portion of the deep trench opening, overlying the recessed polysilicon plug. This is accomplished via photolithographic and selective dry definition procedures, and a second chemical mechanical polishing procedure, resulting in a filled, deep trench opening exhibiting a smooth top surface topography.
Abstract:
A floating gate memory architecture having current regulator is disclosed. A floating gate memory block have at least a programming voltage node for being programmed a plurality of bits according to the control of a plurality of bit lines. A high voltage source provides a regulated voltage when the plurality of bits are programmed in. A high voltage decoder locates between the floating gate memory block and the high voltage source for connecting the voltage to the programming voltage node according to the programming data of the floating gate memory block. A current regulator connects to the programming voltage node for keeping the programming voltage node in a constant voltage, and making a constant current flowing into said floating gate memory block according to said plurality of bits.
Abstract:
A bipolar transistor is described whose I-V curve is such that it operates in two regions, one having low gain and low power consumption and another having higher gain and better current driving ability. Said transistor has a base region made up of two sub regions, the region closest to the emitter having a resistivity about an order a magnitude lower than the second region (which interfaces with the collector). A key feature of the invention is that the region closest to the collector is very uniformly doped, i.e. there is no gradient or built-in field present. In order to produce such a region, epitaxial growth along with boron doping is used rather than more conventional techniques such as ion implantation and/or diffusion.
Abstract:
A current sense amplifier with dynamic pre-charge is proposed. There is a storage unit having a sense line, a voltage amplifier for generating a first output signal depending on the sense line, a first current mirror for generating a first current depending on the first output signal, a second current mirror for generating a second current depending on a reference storage unit, and a pre-charge circuit for generating a charge up signal on the sense line to pre-charge the sense line to an operation current level depending on the first output signal, the second current and a clock pulse so as to directly detect a data in the storage unit during detecting the sense line.