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公开(公告)号：US10788512B2
公开(公告)日：2020-09-29
申请号：US16373500
申请日：2019-04-02
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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公开(公告)号：US20200227805A1
公开(公告)日：2020-07-16
申请号：US16711116
申请日：2019-12-11
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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93.发明授权公开(公告)号：US10676836B2
公开(公告)日：2020-06-09
申请号：US16118267
申请日：2018-08-30
Applicant: Microfabrica Inc.
Inventor： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
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公开(公告)号：US10665530B2
公开(公告)日：2020-05-26
申请号：US16373569
申请日：2019-04-02
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Will J. Tan
IPC: H01L23/473 , F28F3/12 , F28F13/06 , H01L21/48 , H05K7/20
Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
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公开(公告)号：US10416192B2
公开(公告)日：2019-09-17
申请号：US14927350
申请日：2015-10-29
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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Patent Agency Ranking
公开(公告)号：US20190227099A1
公开(公告)日：2019-07-25
申请号：US16373500
申请日：2019-04-02
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC: G01R1/067
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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97.发明申请公开(公告)号：US20190204354A1
公开(公告)日：2019-07-04
申请号：US16172354
申请日：2018-10-26
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Vacit Arat , Daniel I. Feinberg
IPC: G01R1/067
CPC classification number: G01R1/06727 , G01R1/06738
Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.
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公开(公告)号：US20180230614A1
公开(公告)日：2018-08-16
申请号：US15894233
申请日：2018-02-12
Applicant: Microfabrica Inc.
Inventor： Gregory P. Schmitz , Michael S. Lockard , Ming-Ting Wu , Eric C. Miller , Adam L. Cohen
CPC classification number: C25D1/003 , B32B15/01 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00 , C25D1/08 , C25D5/022 , C25D5/48 , C25D7/005
Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
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99.发明授权公开(公告)号：US09933578B1
公开(公告)日：2018-04-03
申请号：US15180017
申请日：2016-06-11
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen
CPC classification number: G02B6/3652 , G02B6/3644 , G02B6/3684
Abstract: Embodiments of the present invention are directed to fiber optic element devices, methods for aligning fiber optic elements, and batch formation methods for creating such fiber optic alignment devices.
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公开(公告)号：US09878401B1
公开(公告)日：2018-01-30
申请号：US14720719
申请日：2015-05-22
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
IPC: B23K26/362 , B23K26/364 , B23K26/38 , C25D5/02 , B23K26/382
CPC classification number: B23K26/38 , B23K26/382 , C25D5/48 , C25D7/00 , G01R1/00
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
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