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    PORTABLE DEVICE FOR TREATING A PATIENT WITH LIGHT AND METHOD FOR OPERATING THE PORTABLE DEVICE
    92.
    发明申请
    PORTABLE DEVICE FOR TREATING A PATIENT WITH LIGHT AND METHOD FOR OPERATING THE PORTABLE DEVICE 有权

    公开(公告)号：US20220105356A1

    公开(公告)日：2022-04-07

    申请号：US17061212

    申请日：2020-10-01

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Daniel Vander LEY

    IPC: A61N5/06

    Abstract: A portable device configured to treat a patient with light, comprises a light generation unit configured to generate light; a pair of glasses, wherein each of the glasses is configured to be positioned in front of a respective eye of the patient when worn; a light emitting unit situated near or on the glasses and configured to emit light generated by the light generation unit toward a retina of the patient; and a controller unit configured to control the light generation unit in accordance with a programmed script, wherein the programmed script comprises at least one of the following parameters: a wavelength range of the light generated by the light generation unit, an intensity of the light generated by the light generation unit, a duration of a session for treating the patient and a number of sessions for treating the patient.

    OPTOELECTRONIC SEMICONDUCTOR DEVICE COMPRISING PORTIONS OF A CONDUCTIVE LAYER AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE
    94.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR DEVICE COMPRISING PORTIONS OF A CONDUCTIVE LAYER AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220077368A1

    公开(公告)日：2022-03-10

    申请号：US17428988

    申请日：2020-02-07

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Franz EBERHARD

    IPC: H01L33/62 ,  H01L33/00

    Abstract: An optoelectronic semiconductor device may include a first and second semiconductor layer having a first and second conductivity type, respectively, a first contact structure, a contact layer, and a separating layer. Contact holes are arranged in the separating layer. The optoelectronic semiconductor device may include portions of a conductive layer arranged over a side of the separating layer facing away from the contact layer. The portions of the conductive layer are each connected to a conducting material in the contact holes. The first contact structure is connected to the contact layer via the portions of the conductive layer and the conducting material. A length of each of the portions is greater than a greatest width of the portions. The length denotes a shortest distance between an associated contact hole and a conductive material between adjacent portions, and the width is measured perpendicular to the length.

    Component Having Homogenized Luminous Surface
    95.
    发明申请
    Component Having Homogenized Luminous Surface 有权

    公开(公告)号：US20220077362A1

    公开(公告)日：2022-03-10

    申请号：US17433060

    申请日：2020-02-07

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Peter Nagel ,  Christopher Wiesmann ,  Matthias Kiessling

    IPC: H01L33/58 ,  H01L25/075 ,  H01L33/50

    Abstract: In an embodiment a component includes a common carrier, a plurality of component parts, converter layers and internal scattering regions, wherein the component parts are arranged side by side in a lateral direction and vertically between the common carrier and the converter layers, wherein the component has a pass-through region and a radiation exit surface which, in a vertical direction, is spaced apart from the converter layers by the pass-through region, wherein adjacent converter layers are laterally spaced from each other by an intermediate region which, in top view of the carrier, is completely covered by the pass-through region, and wherein the inner scattering regions adjoin the pass-through region and the converter layers and are arranged at least partially in the intermediate region or directly adjoin the intermediate region.

    Controlled Wetting in the Manufacture of Electronic Components
    96.
    发明申请
    Controlled Wetting in the Manufacture of Electronic Components 有权

    公开(公告)号：US20220077357A1

    公开(公告)日：2022-03-10

    申请号：US17432908

    申请日：2020-02-25

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Daniel Leisen ,  Simon Jerebic ,  Max Wenzel

    IPC: H01L33/54

    Abstract: In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.

    Method of selecting semiconductor chips
    98.
    发明授权
    Method of selecting semiconductor chips 有权

    公开(公告)号：US11257705B2

    公开(公告)日：2022-02-22

    申请号：US16468324

    申请日：2018-01-24

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Daniel Richter ,  Gunnar Petersen ,  Konrad Wagner

    IPC: H01L21/683 ,  H01L21/78 ,  H01L25/00 ,  H01L23/00 ,  H01L21/52

    Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

    Display device
    99.
    发明授权
    Display device 有权

    公开(公告)号：US11257424B2

    公开(公告)日：2022-02-22

    申请号：US16279943

    申请日：2019-02-19

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thorsten Frank Baumheinrich ,  Hubert Halbritter

    IPC: G09G3/3225 ,  G09G3/32 ,  H01L27/32

    Abstract: A display device is disclosed. In an embodiment a display device includes a plurality of image points, each image point comprising at least one active region configured to generate first radiation, a carrier including a drive circuit for the plurality of image points and a detector assigned to at least some image points, the detector configured to receive second radiation, wherein at least some image points are configured to act either as an emitter or as a detector during operation of the display device.

    Optoelectronic component
    100.
    发明授权
    Optoelectronic component 有权

    公开(公告)号：US11233089B2

    公开(公告)日：2022-01-25

    申请号：US16466509

    申请日：2017-12-18

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Ulrich Streppel ,  Désirée Queren

    IPC: H01L33/58 ,  H01L27/15 ,  H01L25/075 ,  H01L33/50

    Abstract: An optoelectronic component includes a light emitter including a multiplicity of segments, wherein each segment of the light emitter includes a multiplicity of image points configured to emit light, and an optical element configured to image light emitted by the light emitter into a target region, light emitted by the individual segments of the light emitter is superimposed in the target region, the optical element is subdivided into a number of segments corresponding to a number of segments of the light emitter, each segment of the optical element is respectively arranged over a segment of the light emitter, and the segments of the optical element are respectively configured as double-sided aspherical lenses.

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