摘要:
The present invention relates to a substrate conveyance apparatus (200). The apparatus includes a main frame (230), a substrate support device (240) and a base plate (210). The substrate support device includes robot blades (141a, 141b) and a holding chuck (145). The holding chuck is movably connected with main frame so as to hold the robot blades. The robot blades are comprised of two pair of plate-shaped members, and the base plate is used to support the main frame. The distance between one pair of plate-shaped members is different from that of the other pair of plate-shaped members. The substrate conveyance apparatus is used to load/unload the substrates with different sizes.
摘要:
A data slicer capable of removing current mismatch between internal current pumps and its operating method is proposed. The data slicer includes a comparator for comparing an analog signal with a slice reference level to convert the analog signal into a digital signal, a counter electrically connected to the comparator for calculating a digital sum value according to logic values carried by the digital signal, and a voltage-adjusting circuit electrically connected to the comparator for adjusting the slice reference level. The voltage-adjusting circuit has two current pumps for shifting the slice reference level. The current generated by the current pumps can be adjusted according to the calculated digital sum value to reduce a difference between a first and a second binary values which are used to increase and decrease the slice reference level respectively.
摘要:
The present invention provides a reflective coding panel and a liquid crystal display. The liquid crystal display includes a panel, a reflective coding layer formed on the panel, and a polarizing plate positioned on the reflective coding layer, wherein the reflective coding layer includes a plurality of cholesteric liquid crystal flakes having a pitch length and an average reflective index, and the pitch length multiplied by the average reflective index is within a range of an infrared ray wavelength.
摘要:
A liquid crystal display (LCD) device, with an organic electroluminescent display (OLED) element serving as a light source, a common electrode, and a polarizer which is a wire grid polarizer or a thin film polarizer are formed on a lower substrate. A pixel electrode is formed on an upper substrate. According to the invention, a thinner integrated LCD device with improved light utilization efficiency is obtained.
摘要:
A light source device includes a housing, a reflecting plate, at least one lamp support member and a plurality of lamps. The housing has a substantially flat bottom plate. The reflecting plate is disposed on the bottom plate of the housing. The lamp support member is disposed on the reflecting plate for forming an opening. The lamps are disposed in the opening and directly mounted by the lamp support member.
摘要:
A liquid crystal display panel having a display area comprises a first substrate, a second substrate, a sealant, a liquid crystal layer, and a light-shielding layer. The sealant is disposed between the first substrate and the second substrate. The liquid crystal layer is disposed in a space defined by the first substrate, the second substrate and the sealant. The light shielding layer is disposed on a first outer surface of the first substrate or a second outer surface of the second substrate, wherein the light shielding layer and the display area are not overlapped. In addition, the liquid crystal display panel further comprises a protection layer. Since the protection layer encapsulates the light-shielding layer, out-diffusion of dye within the light-shielding layer is effectively prevented.
摘要:
A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed on the circuit board and having a plurality of bonding pads, and at least a bonding line connected between a bonding pad of the die and the trace of the circuit board so that the bonding pad of the die is electrically connected to the pin of the housing.
摘要:
A method for forming an adhesion/barrier liner with reduced fluorine contamination to improve adhesion and a specific contact resistance of metal interconnects including providing a semiconductor wafer having a process surface including an etched opening extending through a dielectric insulating layer thickness and in closed communication with a conductive underlayer surface; pre-heating the semiconductor wafer in a plasma reactor to a pre-heating temperature of at least about 400° C.; cleaning the etched opening according to a plasma assisted reactive pre-cleaning process (RPC) comprising nitrogen trifluoride (NF3); and, blanket depositing at least a first adhesion/barrier layer over the etched opening substantially free of fluorine containing residue.
摘要:
A circuit breaker includes a housing, separable contacts disposed in the housing, a latchable operating mechanism structured to separate the separable contacts, and a magnetic trip mechanism coupled to the latchable operating mechanism. The magnetic trip mechanism includes a plunger assembly support structure and a plunger assembly having a moveable core. The plunger assembly support structure includes a wall having a slot therein. The moveable core rests in the slot. A positioning member has a hook and an opening. The hook engages the wall of the plunger assembly support structure. The moveable core passes through the opening of the positioning member, which retains the moveable core relative to the plunger assembly support structure.
摘要:
A method of fabricating a planarized metal structure comprising the following steps. A structure is provided. A patterned dielectric layer is formed over the structure. The patterned dielectric layer having an opening formed therein and exposing at least a portion of the structure. A first-metal layer is formed over the patterned dielectric layer filling the opening. The first-metal layer including at least a doped metal portion adjacent the patterned dielectric layer. The doped metal portion being doped with a second-metal. The structure is annealed to form a second-metal oxide layer adjacent the patterned dielectric layer. The first-metal layer and the second-metal oxide layer are planarized using only a electropolishing process to remove the excess of the first-metal layer and the second-metal oxide layer from over the patterned dielectric layer and leaving a planarized metal structure within the opening.