公开(公告)号：US12148148B2

公开(公告)日：2024-11-19

申请号：US18198053

申请日：2023-05-16

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu

IPC: G06T7/00 ,  B24B37/013 ,  G06T7/90 ,  H01L21/67 ,  H01L21/677 ,  H04N23/12 ,  H04N23/56

Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

公开(公告)号：US20230249315A1

公开(公告)日：2023-08-10

申请号：US18163217

申请日：2023-02-01

Applicant: Applied Materials, Inc.

Inventor： Thomas H. Osterheld ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/013 ,  G06N3/084 ,  B24B53/017 ,  B24B37/04

CPC classification number: B24B49/12 ,  B24B37/013 ,  G06N3/084 ,  B24B53/017 ,  B24B37/04

Abstract: A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged. The consumable part can be a retaining ring on a carrier head, or a conditioner disk on a conditioner head.

公开(公告)号：US11682114B2

公开(公告)日：2023-06-20

申请号：US17242158

申请日：2021-04-27

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu

IPC: G06T7/00 ,  G06T7/90 ,  B24B37/013 ,  H01L21/67 ,  H04N23/12 ,  H04N23/56 ,  H01L21/677

CPC classification number: G06T7/001 ,  B24B37/013 ,  G06T7/0006 ,  G06T7/90 ,  H01L21/67253 ,  G06T2207/10024 ,  G06T2207/30148 ,  H01L21/67742 ,  H04N23/12 ,  H04N23/56

Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

公开(公告)号：US20220388111A1

公开(公告)日：2022-12-08

申请号：US17338032

申请日：2021-06-03

Applicant: Applied Materials, Inc.

Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: B24B37/013 ,  H01L21/67 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/66 ,  G01B11/06

Abstract: Exemplary semiconductor processing systems may include a substrate support defining an aperture therethrough. The processing systems may include a light assembly having a light source that emits an optical signal that is directed toward the aperture. The optical signal may have a high angle of incidence relative to the substrate support. The processing systems may include a photodetector aligned with an angle of reflectance of the optical signal.

公开(公告)号：US20220281058A1

公开(公告)日：2022-09-08

申请号：US17674772

申请日：2022-02-17

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Sohrab Pourmand ,  Dominic J. Benvegnu ,  Thomas H. Osterheld ,  Boguslaw A. Swedek

IPC: B24B37/013 ,  B24B49/00 ,  B24B37/04

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system, and a controller. The in-situ acoustic monitoring system includes an acoustic signal generator to emit acoustic signals and an acoustic signal sensor that receives acoustic signals reflected from the surface of the substrate. The controller is configured to detect exposure of an underlying layer due to the polishing of the substrate based on measurements from the in-situ acoustic monitoring system.

公开(公告)号：US20210407065A1

公开(公告)日：2021-12-30

申请号：US17359307

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06T7/00 ,  G06T7/60

Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.

公开(公告)号：US20210358113A1

公开(公告)日：2021-11-18

申请号：US17388961

申请日：2021-07-29

Applicant: Applied Materials, Inc.

Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Martin A. Josefowicz

IPC: G06T7/00 ,  G06T5/00 ,  H01L21/67 ,  G01B11/06

Abstract: A layer thickness measurement system includes a support to hold a substrate, an optical sensor to capture a color image of at least a portion of the substrate, and a controller. The controller is configured to receive the color image from the optical sensor, perform a color correction on the color image to generate an adjusted color image having increased color contrast, determine a coordinate of the pixel in a coordinate space of at least two dimensions including a first color channel and a second color channel from color data in the adjusted color image for each of the adjusted color image, and calculate a value representative of a thickness based on the coordinate of the pixel of the adjusted color image in the coordinate space.

公开(公告)号：US10766119B2

公开(公告)日：2020-09-08

申请号：US14322686

申请日：2014-07-02

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David

IPC: B24B49/12 ,  B24B37/013 ,  H01L21/26 ,  B24D7/14 ,  H01L21/66 ,  B24B49/08 ,  B24B37/20 ,  G05B15/02 ,  G05B13/04 ,  H01L21/321 ,  H01L21/3105

Abstract: A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.

公开(公告)号：US20190244374A1

公开(公告)日：2019-08-08

申请号：US16388777

申请日：2019-04-18

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G06T7/40 ,  G06T7/90 ,  H04N5/247 ,  H04N5/225 ,  G06T7/00 ,  H04N9/04 ,  B24B37/013

CPC classification number: G06T7/40 ,  B24B37/013 ,  G06T7/0004 ,  G06T7/90 ,  G06T2207/10024 ,  G06T2207/30148 ,  H04N5/2256 ,  H04N5/247 ,  H04N9/04

Abstract: A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles of incidence, and a controller. The controller is configured to store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least four dimensions. For a pixel in the two color images, the controller determines a coordinate in the coordinate space from the color data, determines a position of a point on the predetermined path that is closest to the coordinate, and calculates a value representative of a thickness from the function and the position of the point on the predetermined path.

公开(公告)号：US10276460B2

公开(公告)日：2019-04-30

申请号：US15403915

申请日：2017-01-11

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  B24B37/20 ,  H01L21/67 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  B24B37/013 ,  B24B49/12 ,  B24B49/08 ,  B24D7/14

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.