公开(公告)号：US20090231997A1

公开(公告)日：2009-09-17

申请号：US12395783

申请日：2009-03-02

申请人： Bin Yang ,  Hong-Bin Liang ,  Yong Liu

发明人： Bin Yang ,  Hong-Bin Liang ,  Yong Liu

IPC分类号： G08C15/00

CPC分类号： H04M1/72522 ,  H04M1/2535 ,  H04W28/08 ,  H04W48/08 ,  H04W48/16

摘要： A method and mobile electronic device are provided that display, for a user, a packet switched congestion status of a wireless communication network that is useful for estimating a network quality of service. The method includes transmitting a packet switched congestion status inquiry message from the mobile electronic device to a first network element in the wireless communication network. A reply message received from the first network element in response to the packet switched congestion status inquiry message is then processed. The reply message includes transmission delay information obtained from a device transmission delay between the first network element and the mobile electronic device and a network transmission delay between the first network element and at least one packet switched support node. The packet switched congestion status is then determined based on the transmission delay information. Finally, the packet switched congestion status is displayed on the mobile electronic device.

摘要翻译： 提供了一种方法和移动电子设备，其为用户显示可用于估计网络服务质量的无线通信网络的分组交换拥塞状态。 该方法包括将分组交换拥塞状态查询消息从移动电子设备发送到无线通信网络中的第一网元。 然后处理从第一网元接收到的响应于分组交换拥塞状态查询消息的应答消息。 回复消息包括从第一网络元件和移动电子设备之间的设备传输延迟获得的传输延迟信息和第一网络元件与至少一个分组交换支持节点之间的网络传输延迟。 然后基于传输延迟信息来确定分组交换拥塞状态。 最后，在移动电子设备上显示分组交换拥塞状态。

公开(公告)号：US20090230518A1

公开(公告)日：2009-09-17

申请号：US12046734

申请日：2008-03-12

申请人： Yong Liu ,  Jiangyuan Zhang ,  Qiuxiao Qian

发明人： Yong Liu ,  Jiangyuan Zhang ,  Qiuxiao Qian

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.

摘要翻译： 半导体管芯封装。 半导体管芯封装的实施例可用于背光电路。 封装中的系统可以包括桥接电路或其一部分，以及由模制材料或其它封装封装的集成电路管芯，例如驱动器管芯。 桥接电路可以堆叠在引线框架的相对表面上。

公开(公告)号：US07589338B2

公开(公告)日：2009-09-15

申请号：US11948170

申请日：2007-11-30

申请人： Yong Liu ,  Zhengyu Zhu ,  Zhongfa Yuan

发明人： Yong Liu ,  Zhengyu Zhu ,  Zhongfa Yuan

IPC分类号： G02B27/00 ,  H01L29/16

CPC分类号： H01L25/167 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48465 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optocoupler package is disclosed. The package includes a substrate comprising a substrate surface, a first device, and a clip structure attached to the first device. The clip structure and the first device are mounted on the substrate, and the first device is oriented at an angle with respect to the substrate surface. A second device is mounted on the substrate, where the first device is capable of communicating with the second device.

摘要翻译： 公开了一种光耦合器封装。 所述包装包括包括衬底表面，第一装置和附接到所述第一装置的夹子结构的衬底。 夹子结构和第一装置安装在基板上，并且第一装置相对于基板表面成一定角度定向。 第二装置安装在基板上，其中第一装置能够与第二装置通信。

公开(公告)号：US07564842B2

公开(公告)日：2009-07-21

申请号：US10882808

申请日：2004-07-01

申请人： Edgar Herbert Callaway, Jr. ,  Lance Eric Hester ,  Vernon Anthony Allen ,  Jasmeet Chhabra ,  Lakshman Krishnamurthy ,  Ralph M. Kling ,  Zafer Sahinoglu ,  Philip V. Orlik ,  Phil Jamieson ,  Phil Rudland ,  Zachary Smith ,  Myung J. Lee ,  Xuhui Hu ,  Yong Liu ,  Chunhui Zhu

发明人： Edgar Herbert Callaway, Jr. ,  Lance Eric Hester ,  Vernon Anthony Allen ,  Jasmeet Chhabra ,  Lakshman Krishnamurthy ,  Ralph M. Kling ,  Zafer Sahinoglu ,  Philip V. Orlik ,  Phil Jamieson ,  Phil Rudland ,  Zachary Smith ,  Myung J. Lee ,  Xuhui Hu ,  Yong Liu ,  Chunhui Zhu

IPC分类号： H04L12/28 ,  H04L12/56

CPC分类号： H04L45/48 ,  H04L45/52 ,  H04W40/02 ,  H04W40/24 ,  H04W84/10 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/22 ,  Y02D70/30

摘要： The disclosure is a routing method for data in a personal area network. The personal area network includes a plurality of nodes. The method includes receiving a frame at a node, determining whether the node contains a routing table entry for the frame destination, and when the node contains a routing table entry, determining a route for the frame based on a first routing protocol. The method further includes, when the node does not contain a routing table entry for the frame destination, determining whether a route should be discovered for the frame destination, and when a route should not be discovered, determining a route for the frame based on a second routing protocol.

摘要翻译： 本公开是用于个人区域网络中的数据的路由方法。 个人区域网络包括多个节点。 该方法包括在节点处接收帧，确定节点是否包含用于帧目的地的路由表条目，以及当节点包含路由表条目时，基于第一路由协议来确定该帧的路由。 该方法还包括：当节点不包含用于帧目的地的路由表条目时，确定是否应为帧目的地发现路由，并且当不发现路由时，基于 第二路由协议。

公开(公告)号：US20090174047A1

公开(公告)日：2009-07-09

申请号：US11971524

申请日：2008-01-09

申请人： Scott Irving ,  Yong Liu ,  Qiuxiao Qian

发明人： Scott Irving ,  Yong Liu ,  Qiuxiao Qian

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/732 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/05599

摘要： Disclosed are semiconductor die packages having overlapping dice, systems that use such packages, and methods of making such packages. An exemplary die package comprises a leadframe, a first semiconductor die, and a second semiconductor die that has a recessed portion in one of its surfaces. The first die is disposed over a first portion of the leadframe, and the second die is disposed over a second portion of the leadframe with its recess portion overlying at least a portion of the first die. Another exemplary die package comprises a leadframe with a recessed area, a first semiconductor die disposed in the recessed area, and a second semiconductor die overlying at least a portion of the first die. Preferably, electrically conductive regions of both dice are electrically coupled to a conductive region of the leadframe to provide an interconnection between dice that has very low parasitic capacitance and inductance.

摘要翻译： 公开了具有重叠的骰子的半导体管芯封装，使用这种封装的系统以及制造这种封装的方法。 示例性的管芯封装包括引线框架，第一半导体管芯和在其表面之一中具有凹部的第二半导体管芯。 第一管芯设置在引线框架的第一部分上，并且第二管芯设置在引线框架的第二部分上，其凹部覆盖在第一管芯的至少一部分上。 另一示例性管芯封装包括具有凹陷区域的引线框架，设置在凹陷区域中的第一半导体管芯，以及覆盖第一管芯的至少一部分的第二半导体管芯。 优选地，两个骰子的导电区域电耦合到引线框架的导电区域，以提供具有非常低的寄生电容和电感的管芯之间的互连。

公开(公告)号：US20090163218A1

公开(公告)日：2009-06-25

申请号：US12167980

申请日：2008-07-03

申请人： Yong Liu ,  Chiu Ngo

发明人： Yong Liu ,  Chiu Ngo

IPC分类号： H04Q7/20 ,  H04B3/36

CPC分类号： H04L5/0007 ,  H04B7/2606 ,  H04L5/0032 ,  H04L5/0037 ,  H04L5/0044 ,  H04L5/0064 ,  H04L5/0085 ,  H04L5/0089 ,  H04W16/04 ,  H04W16/26 ,  H04W28/08 ,  H04W72/0453 ,  H04W88/04

摘要： A method and system for allocating subcarrier frequency resources for a relay enhanced cellular communication system is provided. The relay enhanced cellular communication system includes a base station, one or more mobile stations and one or more relay stations. Subcarrier allocation involves assigning a set of subcarriers by allocating subcarriers to one or more access communication links between mobile stations and their serving stations, to meet minimum data rate requirements of the access links, and allocating subcarriers to one or more relay communication links between the base station and relay stations to accommodate the data rates achieved on the corresponding access links. The serving stations may include one or more relay stations and the base station. Link balancing, multi-user diversity and minimum data rate constraint are jointly considered to achieve an optimal solution.

摘要翻译： 提供了一种用于为中继增强型蜂窝通信系统分配副载波频率资源的方法和系统。 中继增强型蜂窝通信系统包括基站，一个或多个移动站和一个或多个中继站。 子载波分配包括通过将移动台及其服务站之间的一个或多个接入通信链路分配子载波来分配一组子载波，以满足接入链路的最小数据速率要求，并将子载波分配给基站之间的一个或多个中继通信链路 站和中继站以适应相应接入链路上实现的数据速率。 服务台可以包括一个或多个中继站和基站。 共同考虑链路平衡，多用户多样性和最小数据速率约束以实现最佳解决方案。

公开(公告)号：US20090114030A1

公开(公告)日：2009-05-07

申请号：US11933650

申请日：2007-11-01

申请人： Scott Irving ,  Yong Liu ,  Timwah Luk

发明人： Scott Irving ,  Yong Liu ,  Timwah Luk

IPC分类号： G01L9/04

CPC分类号： G01L1/2262 ,  G01L1/2281 ,  G01L1/2287

摘要： A chip with resistive, metallic strain gauges distributed on surfaces on and buried within the chip. Also, vertically arranged vias and vertical thin film resistive strain gauges are described. The resistive strain gauges can be multiplexed wherein strain can be measured across the topology of the chip in each of the top, bottom and buried layers and any vertical strain. The resistive strain gauges may be in serpentine patterns and may be arranged on via or on vertical edges of grooves that extend from an upper or lower surface of the chip to buried layers. In this fashion, the distributed strain gauges may be used to map the strain throughout the body of a chip. A Kelvin bridge may be used to measure the strain, but other such measuring techniques and devices may be used.

摘要翻译： 具有电阻性金属应变计的芯片分布在芯片上并埋入芯片内的表面上。 此外，还描述了垂直布置的通孔和垂直薄膜电阻应变计。 可以复用电阻应变计，其中可以在顶部，底部和掩埋层以及任何垂直应变中的每个中的芯片的拓扑结构上测量应变。 电阻应变计可以是蛇形图案，并且可以布置在从芯片的上表面或下表面延伸到掩埋层的凹槽的通孔或垂直边缘上。 以这种方式，分布式应变计可用于将应变映射到芯片的整个体内。 可以使用开尔文桥来测量应变，但是可以使用其它这样的测量技术和装置。

公开(公告)号：US20090079082A1

公开(公告)日：2009-03-26

申请号：US11860217

申请日：2007-09-24

申请人： Yong Liu ,  Daniel Hahn ,  Scott Irving ,  Qi Wang

发明人： Yong Liu ,  Daniel Hahn ,  Scott Irving ,  Qi Wang

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/05184 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05624 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01029

摘要： A wire bonding pad over an active area of a semiconductor die has grooves in two orthogonal sections thereof in the top surface of said wire bonding pad.

摘要翻译： 在半导体管芯的有源区域上的引线接合焊盘在所述引线接合焊盘的顶表面中的两个正交部分具有凹槽。

公开(公告)号：US07503498B2

公开(公告)日：2009-03-17

申请号：US11603272

申请日：2006-11-21

申请人： Xiaoxun Zhu ,  Yong Liu ,  Ka Man Au ,  Rui Hou ,  Hongpeng Yu ,  Xi Tao ,  Liang Liu ,  Wenhua Zhang ,  Anatoly Kotlarsky

发明人： Xiaoxun Zhu ,  Yong Liu ,  Ka Man Au ,  Rui Hou ,  Hongpeng Yu ,  Xi Tao ,  Liang Liu ,  Wenhua Zhang ,  Anatoly Kotlarsky

IPC分类号： G06K7/10

CPC分类号： G06K7/10851 ,  G06K7/10732 ,  G06K7/10881

摘要： A hand-supportable digital image capture and processing system comprises: an area-type image formation and detection subsystem having an area-type image detection array; an LED-based illumination subsystem having a LED-based illumination array; an automatic light exposure measurement and illumination control subsystem; an image capturing and buffering subsystem; and an image-processing subsystem. The LED array is automatically driven in a precise manner to globally expose the area-type image detection array with LED-based illumination only when substantially all of its rows of pixels are in a state of integration and have a common integration time, thereby enabling the capture of high quality images independent of the relative motion between the object and the hand-supportable digital image capture and processing system.

摘要翻译： 手持式数字图像捕获和处理系统包括：区域型图像形成和检测子系统，具有区域型图像检测阵列; 具有基于LED的照明阵列的基于LED的照明子系统; 一个自动曝光测量和照明控制子系统; 图像捕获和缓冲子系统; 和图像处理子系统。 LED阵列以精确的方式被自动驱动，以便仅当基本上所有像素行都处于集成状态并且具有共同的积分时间时才能以基于LED的照明来全面暴露区域型图像检测阵列， 捕获高质量的图像，与物体和手持式数字图像捕获和处理系统之间的相对运动无关。

公开(公告)号：US20080258282A1

公开(公告)日：2008-10-23

申请号：US11758886

申请日：2007-06-06

申请人： Hua Yang ,  Yong Liu

发明人： Hua Yang ,  Yong Liu

IPC分类号： H01L23/495 ,  H01L21/00 ,  H01L23/02

CPC分类号： H01L21/565 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and bonding package leads directly to the semiconductor die, and optionally to the heat sink. In an alternative embodiment, a lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and wire bonding package leads to the semiconductor die, and optionally to the heat sink.

摘要翻译： 通过将半导体器件直接连接到散热器并将封装引线直接连接到半导体管芯并且可选地连接到散热器来形成具有暴露的散热器的无引线框架的封装半导体器件。 在替代实施例中，通过将半导体器件直接连接到散热器并且引线接合封装引导到半导体管芯并且可选地到散热器来形成具有暴露的散热器的无引线框架的封装半导体器件。