Abstract:
The present invention provides a fluid injection head structure and a method of fabricating the same. The fluid injection head structure is disposed on a substrate and has a bubble generator, a functional device for control the bubble generator, a first conductive trace composed of poly-silicon, a chamber, a manifold in flow communication with the chamber, and a second conductive trace. The second conductive trace electrically couples the functional device with the bubble generator and the first conductive trace. Moreover, the chamber further has at least one orifice through the substrate and a gate and the first conductive trace are formed in the same photo-etching process (PEP).
Abstract:
A fluid injection head structure. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.
Abstract:
A method for manufacturing a fluid injection head. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.
Abstract:
A digital phase-locked loop circuit includes a counter for outputting a count value corresponding to an output frequency outputted by a voltage controlled oscillator in response to a control voltage signal, a comparator for comparing the count value from the counter with a target value associated with a target frequency output and for outputting a comparison signal according to a comparison result therebetween, a digital reference value generator for outputting a digital reference value according to the comparison signal from the comparator and including a register for storing the digital reference value therein, and a digital-to-analog converter for generating the control voltage signal based on the digital reference value received from the digital reference value generator.
Abstract:
A method of manufacturing a fluid injection device. The method of the present invention applies a compensated geometric shape of the unetched isolating portions to increase the additional compensated portion for etching, or the ion implanting process to reduce the etching rate of the unetched isolating portions. Thus, crosstalk or overshoot in the isolating portions of the fluid injection device can be reduced, and the fluid injection device can be precisely manufactured in a small size.
Abstract:
A method for printing color images with an ink jet printer. The ink jet printer includes a printhead having printing nozzles arranged in first, second, and third columns. The first, second, and third columns each have a length approximately equal to 3*H, where H represents a length of first, second, and third sections of the second column. The method includes ejecting ink from the nozzles of the first, second, or third sections of the second column during each pass of the printhead over a printing medium as necessitated by characteristics of the color image, advancing the printing medium in the first direction by the length H, and ejecting ink from the nozzles of the first and third columns during every third pass that the printhead makes over the printing medium as necessitated by the characteristics of the color image.
Abstract:
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.
Abstract:
A tape automated bonding (TAB) device for a printhead cartridge of a printer includes a tape having a region capable of being substantially bisected by a centerline that defines a first side of the tape and a second side of the tape. Located on the tape is a printhead, and a plurality of contacts adapted to receive signals from the printer and to provide the signals to the printhead. The contacts are disposed such that the number of contacts on the first side is different from the number of contacts on the second side. The printhead is centrally aligned with the centerline or centrally offset from the centerline.
Abstract:
A pressure-compensation device for adjusting the backpressure inside the cartridge of an ink jet printer includes an accumulator bag, a resilient element, and a motion element. The accumulator bag, installed inside the cartridge, communicates with the external atmosphere through an air duct. The resilient element, kept at a tension state, has a first end connected with the accumulator bag and a second end connected with the motion element. The resilient element restrains the inflation of the accumulator bag so as to induce a backpressure inside the cartridge. The accumulator bag, gradually inflating along with consumption of the ink inside the cartridge, can move the resilient element and the motion element downwards to keep the resilient element at a stable tension state, and thereby a stable backpressure inside the cartridge can be provided.
Abstract:
A safety socket for avoiding danger of shock due to insertion of alien article into the insertion hole. The socket includes two high and two low fixing seats. Two insulative slide boards are reversely disposed on the fixing seats side by side. The lower edge of each slide board is disposed with an elliptic slot for a pin member to pass therethrough, whereby the slide boards can be limitedly left and right slided. The socket further includes two long and two short leaf springs. The short leaf springs abut against front edges of the slide boards. The long leaf springs are fixed on inner walls of a housing of the socket opposite to the short leaf springs. The long and short leaf springs are disposed with convex contact points opposite to each other. When a plug is not inserted into the socket, the slide boards are pushed by the resilient force of the short leaf springs to the center of the socket away from the long leaf springs so as to open the circuit. While when the plug is inserted into the socket, the contact points of the long and short leaf springs contact with each other to close the circuit.