摘要:
The bottom and the sides of a lower part of recess formed in the substrate has an insulating structure. A first part of the conductive structure of a first electric conductivity type is located in the lower part of the recess. A second part of the conductive structure of a second electric conductivity type, lower than the first type, is located in an upper part and borders the region of the substrate at the sides of the recess. The conductive structure has a diffusion barrier between its first and second parts. The conductive structure is configured as a bit line of a DRAM cell configuration with a vertical transistor, whereby S/Du represents the lower source/drain area and S/Do represents the upper source/drain area connected to a memory capacitor. Or, the conductive structure is configured as a memory capacitor and the upper source drain/area is connected to a bit line.
摘要:
A memory cell, which is isolated from other memory cells by STI trenches, each includes an ONO layer structure between a gate electrode and a channel region formed in a semiconductor body. The gate electrode is a component of a strip-shaped word line. Source and drain regions are disposed between gate electrodes of adjacent memory cells. Source regions are provided with polysilicon layers, in the form of a strip, as common source lines. Drain regions are connected as bit lines through polysilicon fillings to metallic interconnects applied to the top face of the semiconductor body.
摘要:
The memory cell has a source region and a drain region in semiconductor material and, above a channel region between the source and drain regions, a three-layered layer structure with a storage layer between boundary layers and a gate electrode arranged thereon. The storage layer is replaced above the channel region by an etching layer made of Al2O3. During fabrication, the etching layer is etched out laterally and the second boundary layer is thus undercut. The resulting interspaces are filled with the material of the storage layer. The provision of suitable spacers makes it possible to define the dimensions of the memory cell.
摘要翻译:存储单元在半导体材料中具有源极区域和漏极区域,并且在源极和漏极区域之间的沟道区域之上,具有在边界层之间的存储层和布置在其上的栅电极的三层层结构。 通过由Al 2 O 3制成的蚀刻层在沟道区域之上替换存储层。 在制造过程中,蚀刻层被横向蚀刻,因此第二边界层被切割。 所产生的间隙填充有存储层的材料。 提供合适的间隔物使得可以限定存储单元的尺寸。
摘要:
A depression extends from a main surface of the substrate to the inside of said substrate and has an upper area and an adjacent lower area. A cross-section of the upper area, parallel to the main surface, is provided with at least one corner. A cross-section of the lower area, parallel to the main surface, matches the cross-section of the upper area, particularly in the vicinity the upper area, with the following difference: each corner is rounded, whereby the cross section of the lower area is smaller than the cross-section of the upper area. In order to produce the indentation, the upper area is provided with an auxiliary spacer that is rounded by isotropic etching. The lower area is produced by selectively etching the substrate to form an auxiliary spacer.
摘要:
The invention relates to an SOI substrate which is provided with a recess that cuts through the silicon layer and the SiO2 layer (O). An upper part of said recess (V) which is located in the range of the silicon layer (S) has cylindrical shape with a horizontal first cross-section. A lower part of the recess (V) which is located in the range of the SiO2 layer (O), compared with the upper part of the recess (V), is bulged to such an extent that it has a cylindrical shape with a horizontal second cross-section that is larger than the first cross-section. A cylinder (Z) of an insulating material is provided in the recess (V). The horizontal cross-section of said cylinder corresponds to the first cross-section and the lower part thereof is located in the lower part of the recess (V). The dent laterally surrounds the lower part of the cylinder (Z). A conducting structure (L) is located in the dent and adjoins the silicon layer (S) and the silicon substrate (1) so that the channel zone of the MOS transistors is electrically connected to the silicon substrate.
摘要:
A grid of capacitor surfaces is connected to read lines and control lines. The read lines are connected alternately to the output of a feedback operational amplifier and to a collecting capacitor. The capacitances to be measured are charged repeatedly and the charges are collected on the collecting capacitors. Between the charging operations, the potential on the read lines is kept constant through the use of the low-resistance output of the operational amplifier. The use of this method in the case of a fingerprint sensor makes it possible to evaluate all the read lines together.
摘要:
A MOS transistor of a memory cell and a bit line connected thereto are disposed on a first surface of a substrate. A capacitor of the memory cell is disposed on a second surface of the substrate, the second surface being opposite to the first surface. A contact is disposed in the substrate and connects the capacitor to the MOS transistor.
摘要:
The SRAM cell arrangement comprises six MOS transistors per memory cell that are fashioned as vertical transistors. The MOS transistors are arranged at sidewalls of trenches (G1, G2, G4). Parts of the memory cell such as, for example, gate electrodes (Ga2, Ga4) or conductive structures (L3) fashioned as spacer are contacted via adjacent, horizontal, conductive structures (H5) arranged above a surface (O) of a substrate (S). Connections between parts of memory cells ensue via third conductive structures (L3) arranged at the sidewalls of the depressions and word lines (W) via diffusion regions (D2) that are adjacent to the sidewalls of the depressions within the substrate (S), via first bit lines, via second bit lines (B2) or/and via conductive structures (L1, L2, L6) that are partially arranged at different height with respect to an axis perpendicular to the surface (O). Contacts (K5) contact a plurality of parts of the MOS transistors simultaneously.
摘要:
Parallel lines, for example bit lines in a memory cell configuration formed of doped regions in a semiconductor substrate, are driven by electrically connecting a number of the lines to one another and to a common node. A number of selection lines extend transversely to the lines. MOS transistors are arranged at the points of intersection and are connected in series along one of the lines. The gate electrode of the MOS transistors is formed by the corresponding selection line. At least one MOS transistor in each of the parallel lines has a higher threshold voltage than the others.
摘要:
For manufacturing a silicon capacitor, hole openings are produced in an n-doped silicon substrate, a p.sup.+ -doped region is formed at the surface thereof and this surface is provided with a dielectric layer together with a conductive layer. The silicon substrate is thinned with an etching proceeding from the back side, this etching attacking silicon selectively to p.sup.+ -doped silicon and therefore stopping when the p.sup.+ -doped region is reached.